BRPI0722164A8 - Mistura padrão de alta resistência ao calor, e, corpo de laminação transparente de bloqueio de radiação térmica. - Google Patents

Mistura padrão de alta resistência ao calor, e, corpo de laminação transparente de bloqueio de radiação térmica.

Info

Publication number
BRPI0722164A8
BRPI0722164A8 BRPI0722164A BRPI0722164A BRPI0722164A8 BR PI0722164 A8 BRPI0722164 A8 BR PI0722164A8 BR PI0722164 A BRPI0722164 A BR PI0722164A BR PI0722164 A BRPI0722164 A BR PI0722164A BR PI0722164 A8 BRPI0722164 A8 BR PI0722164A8
Authority
BR
Brazil
Prior art keywords
high heat
thermal radiation
radiation blocking
heat resistance
lamination body
Prior art date
Application number
BRPI0722164A
Other languages
English (en)
Inventor
Fujita Kenichi
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of BRPI0722164A2 publication Critical patent/BRPI0722164A2/pt
Publication of BRPI0722164A8 publication Critical patent/BRPI0722164A8/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

MISTURA PADRÃO DE ALTA RESISTÊNCIA AO CALOR, E, CORPO DE LAMINAÇÃO TRANSPARENTE DE BLOQUEIO DE RADIAÇÃO TÉRMICA. É descrita uma moldagem de resina transparente de baixo amarelamento causado pela deterioração térmica de dispersante por causa da mistura do banho líquido durante a moldagem, e que tem propriedades de transmissão de luz visível satisfatórias e uma excelente função de bloqueio de radiação térmica. É também provida uma mistura padrão para uso na produção de uma moldagem de resina transparente com uma função de bloqueio de raio de calor. A mistura padrão compreende: uma resina termoplástica; partículas finas de óxido de tungstênio representadas pela fórmula geral WOx e/ou partículas finas de um óxido de tungstênio compósito representado pela fórmula geral MyWOz e com uma estrutura de cristal hexagonal; e um dispersante de alta resistência ao calor com uma temperatura de decomposição térmica de 230 ºC ou mais.
BRPI0722164A 2007-10-25 2007-10-25 Mistura padrão de alta resistência ao calor, e, corpo de laminação transparente de bloqueio de radiação térmica. BRPI0722164A8 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070845 WO2009054060A1 (ja) 2007-10-25 2007-10-25 高耐熱性マスターバッチ、熱線遮蔽透明樹脂成形体、並びに熱線遮蔽透明積層体

Publications (2)

Publication Number Publication Date
BRPI0722164A2 BRPI0722164A2 (pt) 2014-03-18
BRPI0722164A8 true BRPI0722164A8 (pt) 2017-12-12

Family

ID=40579170

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0722164A BRPI0722164A8 (pt) 2007-10-25 2007-10-25 Mistura padrão de alta resistência ao calor, e, corpo de laminação transparente de bloqueio de radiação térmica.

Country Status (7)

Country Link
US (1) US8268460B2 (pt)
EP (1) EP2206738A4 (pt)
KR (1) KR101320228B1 (pt)
CN (1) CN101835824B (pt)
AU (1) AU2007360455B2 (pt)
BR (1) BRPI0722164A8 (pt)
WO (1) WO2009054060A1 (pt)

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TWI503346B (zh) * 2014-06-11 2015-10-11 Zirco Applied Materials Co Ltd 近紅外光屏蔽膜及近紅外光屏蔽膜之製造方法
CN106661293B (zh) 2014-08-06 2019-05-10 住友金属矿山股份有限公司 热射线遮蔽膜、热射线遮蔽用夹层透明基材、汽车、建造物
TW201609923A (zh) * 2014-09-10 2016-03-16 台虹科技股份有限公司 紅外線吸收膜、紅外線吸收膜的製作方法及包含該紅外線吸收膜的相機模組
GB201418604D0 (en) * 2014-10-20 2014-12-03 Colorant Chromatics Ag Polymeric materials
US10730272B2 (en) 2015-06-30 2020-08-04 Sumitomo Metal Mining Co., Ltd. Heat-ray shielding film, heat-ray shielding laminated transparent substrate, automobile, building, dispersoid, mixed composition, method for manufacturing dispersoid, dispersion liquid, and method for manufacturing dispersion liquid
US11130315B2 (en) * 2015-12-02 2021-09-28 Sumitomo Metal Mining Co., Ltd. Heat ray shielding fine particles, heat ray shielding fine particle dispersion liquid, heat ray shielding film, heat ray shielding glass, heat ray shielding dispersion body, and heat ray shielding laminated transparent substrate
KR102415540B1 (ko) * 2016-11-17 2022-07-04 코베스트로 도이칠란트 아게 열 관리를 위한 투명한 다층 구조체
JP6949304B2 (ja) * 2017-06-19 2021-10-13 住友金属鉱山株式会社 熱線吸収成分含有マスターバッチおよびその製造方法、熱線吸収透明樹脂成形体、並びに熱線吸収透明積層体
KR102615612B1 (ko) * 2017-07-24 2023-12-20 스미토모 긴조쿠 고잔 가부시키가이샤 적외선 흡수 미립자 함유 마스터배치 분쇄물, 적외선 흡수 미립자 함유 마스터배치 분쇄물 함유 분산액, 적외선 흡수 재료 함유 잉크, 그것들을 사용한 위조 방지 잉크, 위조 방지용 인쇄막, 및 적외선 흡수 미립자 함유 마스터배치 분쇄물의 제조 방법
AU2018307393B2 (en) * 2017-07-24 2024-05-09 Sumitomo Metal Mining Co., Ltd. Infrared absorbing fine particle dispersion powder, dispersion liquid containing infrared absorbing fine particle dispersion powder, ink containing infrared absorbing fine particle dispersion powder, anti-counterfeit ink, and printed matter for anti-counterfeiting
CN111479689B (zh) 2017-12-15 2023-07-28 康宁股份有限公司 具有uv和nir阻挡特性的层压玻璃陶瓷制品及其制造方法
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CN113574114B (zh) * 2019-03-13 2024-05-28 帝人株式会社 红外线屏蔽透明构件用树脂组合物和成型品
CN109912990A (zh) * 2019-03-29 2019-06-21 台州见龙科技有限公司 一种etfe着色用色母料
CN115443301B (zh) * 2020-04-24 2025-02-11 Dic株式会社 母料、树脂组合物、成形品和它们的制造方法
CN115746568B (zh) * 2022-11-18 2023-07-28 北京工业大学 一种耐高温硅橡胶材料及其制备方法

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Also Published As

Publication number Publication date
US8268460B2 (en) 2012-09-18
CN101835824B (zh) 2014-01-01
EP2206738A1 (en) 2010-07-14
AU2007360455A1 (en) 2009-04-30
BRPI0722164A2 (pt) 2014-03-18
KR101320228B1 (ko) 2013-10-21
CN101835824A (zh) 2010-09-15
KR20100098373A (ko) 2010-09-06
WO2009054060A1 (ja) 2009-04-30
EP2206738A4 (en) 2011-10-19
US20100261037A1 (en) 2010-10-14
AU2007360455B2 (en) 2014-11-27

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B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B15K Others concerning applications: alteration of classification

Free format text: AS CLASSIFICACOES ANTERIORES ERAM: C08J 3/22 , B32B 27/20 , C08J 5/00 , C08K 3/22 , C08L 33/00

Ipc: C08J 3/22 (1974.07), C08L 69/00 (1974.07)

Ipc: C08J 3/22 (1974.07), C08L 69/00 (1974.07)

B09B Patent application refused [chapter 9.2 patent gazette]
B12B Appeal against refusal [chapter 12.2 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2693 DE 16-08-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.