BRPI0801337A2 - processo para a separaÇço tÉrmica a laser de material em placa cerÂmico ou outro material quebradiÇo - Google Patents

processo para a separaÇço tÉrmica a laser de material em placa cerÂmico ou outro material quebradiÇo

Info

Publication number
BRPI0801337A2
BRPI0801337A2 BRPI0801337-3A BRPI0801337A BRPI0801337A2 BR PI0801337 A2 BRPI0801337 A2 BR PI0801337A2 BR PI0801337 A BRPI0801337 A BR PI0801337A BR PI0801337 A2 BRPI0801337 A2 BR PI0801337A2
Authority
BR
Brazil
Prior art keywords
ceramic plate
thermal separation
laser thermal
plate material
brittle
Prior art date
Application number
BRPI0801337-3A
Other languages
English (en)
Inventor
Wolfgang Friedl
Original Assignee
Grenzebach Maschb Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grenzebach Maschb Gmbh filed Critical Grenzebach Maschb Gmbh
Publication of BRPI0801337A2 publication Critical patent/BRPI0801337A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

PROCESSO PARA A SEPARAÇçO TÉRMICA A LASER DE MATERIAL EM PLACA CERÂMICO OU OUTRO MATERIAL QUEBRADIÇO. A presente invenção refere-se a processo para separação térmica a laser de material em placa cerâmico ou outro material quebradiço, sendo que ocorre uma varredura múltipla da linha de separação (6) prevista com o raio laser (2) em direção sempre igual e com pausas selecionáveis e ajustáveis em correspondência ao respectivo material a ser separado entre as varreduras individuais.
BRPI0801337-3A 2007-05-10 2008-05-09 processo para a separaÇço tÉrmica a laser de material em placa cerÂmico ou outro material quebradiÇo BRPI0801337A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07009423A EP1990168B1 (de) 2007-05-10 2007-05-10 Verfahren zum laserthermischen Trennen von keramischem oder anderem spröden Plattenmaterial

Publications (1)

Publication Number Publication Date
BRPI0801337A2 true BRPI0801337A2 (pt) 2008-12-30

Family

ID=38567161

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0801337-3A BRPI0801337A2 (pt) 2007-05-10 2008-05-09 processo para a separaÇço tÉrmica a laser de material em placa cerÂmico ou outro material quebradiÇo

Country Status (6)

Country Link
EP (1) EP1990168B1 (pt)
CN (1) CN101301704A (pt)
BR (1) BRPI0801337A2 (pt)
ES (1) ES2400019T3 (pt)
MX (1) MX2008005663A (pt)
RU (1) RU2457186C2 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
JP7134182B2 (ja) * 2017-03-22 2022-09-09 コーニング インコーポレイテッド ガラスウェブを分割する方法
CN109175728B (zh) * 2018-09-30 2021-02-23 大族激光科技产业集团股份有限公司 一种用于激光切割低温共烧陶瓷的装置及方法
WO2025230440A1 (ru) * 2024-05-02 2025-11-06 Владимир Степанович Кондратенко Способ лазерной резки слитков неметаллических материалов на пластины
WO2025230441A1 (ru) * 2024-05-02 2025-11-06 Владимир Степанович Кондратенко Способ лазерной резки слитков неметаллических материалов на пластины

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
DE19851353C1 (de) * 1998-11-06 1999-10-07 Schott Glas Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
RU2206527C2 (ru) * 2001-08-15 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
RU2226183C2 (ru) * 2002-02-21 2004-03-27 Алексеев Андрей Михайлович Способ резки прозрачных неметаллических материалов
US6787732B1 (en) * 2002-04-02 2004-09-07 Seagate Technology Llc Method for laser-scribing brittle substrates and apparatus therefor
KR100462358B1 (ko) * 2004-03-31 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치
KR101193874B1 (ko) * 2004-07-30 2012-10-26 미쓰보시 다이야몬도 고교 가부시키가이샤 기판의 수직크랙 형성방법 및 수직크랙 형성장치

Also Published As

Publication number Publication date
RU2008118381A (ru) 2009-11-20
CN101301704A (zh) 2008-11-12
EP1990168B1 (de) 2012-06-27
RU2457186C2 (ru) 2012-07-27
ES2400019T3 (es) 2013-04-05
MX2008005663A (es) 2009-03-02
EP1990168A1 (de) 2008-11-12

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Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law

Free format text: REFERENTE A 6A ANUIDADE.

B08K Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87)

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2260 DE 29/04/2014.