BRPI0803701A2 - dispositivo semicondutor - Google Patents

dispositivo semicondutor

Info

Publication number
BRPI0803701A2
BRPI0803701A2 BRPI0803701-9A BRPI0803701A BRPI0803701A2 BR PI0803701 A2 BRPI0803701 A2 BR PI0803701A2 BR PI0803701 A BRPI0803701 A BR PI0803701A BR PI0803701 A2 BRPI0803701 A2 BR PI0803701A2
Authority
BR
Brazil
Prior art keywords
resin layer
molding resin
semiconductor element
semiconductor device
opening
Prior art date
Application number
BRPI0803701-9A
Other languages
English (en)
Inventor
Tetsuo Yoshioka
Kenji Fukumura
Takahiko Yoshida
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of BRPI0803701A2 publication Critical patent/BRPI0803701A2/pt
Publication of BRPI0803701B1 publication Critical patent/BRPI0803701B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

DISPOSITIVO SEMICONDUTOR. Um dispositivo semicondutor inclui uma camada de resina de moldagem (14) e um elemento semicondutor (12) encapsulado com a camada de resina de moldagem (14). A camada de resina de moldagem (14) tem uma abertura (14a). Uma superficie do elemento semicondutor (12) é parcialmente exposta fora da camada de resina de moldagem (14) através da abertura (14a). Uma ranhura (16, 18) está localizada na superficie do elemento semicondutor (12) ao redor da abertura (14a) da camada de resina de moldagem (14). A ranhura (16, 18) é enchida com a camada de resina de moldagem (14) para produzir efeito de ancoragem que aprimora a força adesiva da camada de resina de moldagem (14) na superficie do elemento semicondutor (12) ao redor da abertura (14a).
BRPI0803701-9A 2007-08-22 2008-08-19 dispositivo semicondutor BRPI0803701B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-215977 2007-08-22
JP2007215977A JP4450031B2 (ja) 2007-08-22 2007-08-22 半導体部品

Publications (2)

Publication Number Publication Date
BRPI0803701A2 true BRPI0803701A2 (pt) 2009-10-20
BRPI0803701B1 BRPI0803701B1 (pt) 2019-01-02

Family

ID=40280430

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0803701-9A BRPI0803701B1 (pt) 2007-08-22 2008-08-19 dispositivo semicondutor

Country Status (4)

Country Link
US (1) US7906859B2 (pt)
JP (1) JP4450031B2 (pt)
BR (1) BRPI0803701B1 (pt)
DE (1) DE102008039068A1 (pt)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993972B2 (en) * 2008-03-04 2011-08-09 Stats Chippac, Ltd. Wafer level die integration and method therefor
EP2366993A1 (en) * 2010-03-08 2011-09-21 Nxp B.V. A sensor and a method of assembling a sensor
WO2012049742A1 (ja) * 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法
DE102011004381A1 (de) * 2011-02-18 2012-08-23 Robert Bosch Gmbh Moldmodul mit Sensorelement
DE102011013468A1 (de) * 2011-03-09 2012-09-13 Micronas Gmbh Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses
JP5441956B2 (ja) * 2011-05-26 2014-03-12 三菱電機株式会社 樹脂封止形電子制御装置及びその製造方法
US8759153B2 (en) 2011-09-06 2014-06-24 Infineon Technologies Ag Method for making a sensor device using a graphene layer
EP2573804A1 (en) * 2011-09-21 2013-03-27 Nxp B.V. Integrated circuit with sensor and manufacturing method thereof
US8828207B2 (en) * 2012-06-13 2014-09-09 Honeywell International Inc. Deep sea pH sensor
DE102012011794A1 (de) 2012-06-15 2013-12-19 Phoenix Contact Gmbh & Co. Kg Elektrische Anschlussklemme
JP5675716B2 (ja) 2012-06-29 2015-02-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
ITTO20120854A1 (it) * 2012-09-28 2014-03-29 Stmicroelectronics Malta Ltd Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione
US9184066B2 (en) * 2012-11-16 2015-11-10 Infineon Technologies Ag Chip arrangements and methods for manufacturing a chip arrangement
JP6018903B2 (ja) 2012-12-17 2016-11-02 日立オートモティブシステムズ株式会社 物理量センサ
JP2016029676A (ja) 2012-12-19 2016-03-03 富士電機株式会社 半導体装置
JP6063777B2 (ja) * 2013-03-04 2017-01-18 日立オートモティブシステムズ株式会社 センサ装置
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
JP6264193B2 (ja) * 2013-10-07 2018-01-24 株式会社デンソー モールドパッケージ
JP5910653B2 (ja) 2014-03-18 2016-04-27 トヨタ自動車株式会社 放熱板付きリードフレーム、放熱板付きリードフレームの製造方法、半導体装置、および半導体装置の製造方法
EP2765410B1 (en) * 2014-06-06 2023-02-22 Sensirion AG Gas sensor package
CN104201116B (zh) * 2014-09-12 2018-04-20 苏州晶方半导体科技股份有限公司 指纹识别芯片封装方法和封装结构
EP3045909B1 (en) 2015-01-14 2020-11-04 Sensirion AG Sensor package
US9470652B1 (en) * 2015-09-15 2016-10-18 Freescale Semiconductor, Inc. Sensing field effect transistor devices and method of their manufacture
US10750071B2 (en) * 2016-03-12 2020-08-18 Ningbo Sunny Opotech Co., Ltd. Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
EP3429181B1 (en) 2016-03-12 2024-10-16 Ningbo Sunny Opotech Co., Ltd. Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
GB201608758D0 (en) * 2016-05-18 2016-06-29 Dnae Group Holdings Ltd Improvements in or relating to packaging for integrated circuits
JP6528732B2 (ja) * 2016-06-20 2019-06-12 株式会社デンソー 流量センサ
US10229865B2 (en) * 2016-06-23 2019-03-12 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package
CN107799476B (zh) * 2016-09-02 2019-12-13 胜丽国际股份有限公司 具有挡止件的封装基板及感测器封装结构
WO2018060252A1 (en) * 2016-09-29 2018-04-05 Idt Europe Gmbh Hydrophobic and oleophobic cover for gas sensing module
US11843009B2 (en) * 2017-08-18 2023-12-12 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly, imaging module, smart terminal, and method and mould for manufacturing photosensitive assembly
KR102466332B1 (ko) 2018-01-02 2022-11-15 삼성전자주식회사 가스 센서 패키지
WO2020012810A1 (ja) * 2018-07-11 2020-01-16 住友電気工業株式会社 炭化珪素半導体装置
EP3840353A4 (en) 2018-08-21 2021-09-15 Ningbo Sunny Opotech Co., Ltd. CAMERA MODULE, SHAPED LIGHT SENSITIVE ARRANGEMENT AND MANUFACTURING METHOD FOR IT, AND ELECTRONIC DEVICE
KR102248527B1 (ko) * 2019-05-02 2021-05-06 삼성전기주식회사 이미지 센서 패키지
CN113266491A (zh) * 2021-05-19 2021-08-17 天津大学 一种提高内燃机燃料利用效率的方法及内燃机
CN113299566B (zh) * 2021-05-20 2023-01-24 合肥速芯微电子有限责任公司 封装结构及其制备方法
US12261088B2 (en) * 2021-08-31 2025-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of forming the same
CN115985859A (zh) * 2021-10-14 2023-04-18 恩智浦美国有限公司 形成于半导体封装模塑料中的腔和形成方法
JPWO2024214655A1 (pt) * 2023-04-12 2024-10-17

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598161B2 (ja) 1990-10-03 1997-04-09 三菱電機株式会社 中空型半導体装置の樹脂封止方法
JPH05136298A (ja) 1991-11-14 1993-06-01 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPH05183072A (ja) 1991-12-26 1993-07-23 Olympus Optical Co Ltd 半導体装置
JPH0685132A (ja) 1992-09-07 1994-03-25 Mitsubishi Electric Corp 半導体装置
JP3179970B2 (ja) 1994-07-14 2001-06-25 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JP3274963B2 (ja) 1996-04-19 2002-04-15 株式会社日立製作所 半導体装置
JP3483720B2 (ja) 1997-02-12 2004-01-06 沖電気工業株式会社 半導体装置
DE10346474B4 (de) * 2003-10-02 2014-07-10 Infineon Technologies Ag Sensorbauteil mit einem Sensorchip, Sensorstapel und Verfahren zum Prüfen einer biochemischen Probe
JP2005203431A (ja) 2004-01-13 2005-07-28 Mitsui Mining & Smelting Co Ltd 合成樹脂モールドパッケージの製造方法
US20060053850A1 (en) * 2004-09-14 2006-03-16 Bioarts Industria E Comercio De Biotechnologia Ltda. Package for storing a formulate liquid inoculating solution containing rhizobia and process for growing rhizobia in it
US20090053850A1 (en) 2005-03-25 2009-02-26 Fujifilm Corporation Method of manufacturing solid state imaging device
EP2463910A3 (en) * 2005-03-25 2012-08-15 Fujifilm Corporation Manufacturing method of a solid state imaging device

Also Published As

Publication number Publication date
JP2009049298A (ja) 2009-03-05
JP4450031B2 (ja) 2010-04-14
US7906859B2 (en) 2011-03-15
DE102008039068A1 (de) 2009-02-26
US20090051052A1 (en) 2009-02-26
BRPI0803701B1 (pt) 2019-01-02

Similar Documents

Publication Publication Date Title
BRPI0803701A2 (pt) dispositivo semicondutor
BR112021025146A2 (pt) Tela de exibição e dispositivo eletrônico
MX2016005182A (es) Modulo semiconductor con una masa de revestimiento de cemento que cubre un componente semiconductor.
BR112012024725A2 (pt) embalagem microeletrônica com terminais em massa dielétrica
BR112015030312A2 (pt) conector óptico com material adesivo
TW200940672A (en) Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
CL2012001345A1 (es) Pelicula polimerica biodegradable con capacidad para respirar que comprende 20-30% de un almidon termoplastico, un relleno inorganico y/o un relleno organico y una resina de polimero biodegradable; articulo absorbente; metodo de fabricacion.
CL2011000380A1 (es) Granulo para ser utilizado en la braquiterapia, que comprende una estructura insoluble o coloidal con radioisotopo, una matriz de polimero reabsorbible, que a su vez comprende particulas individuales, consistentes en sorbitol cubierto con un polimero biodegradable; y metodo para la fabricacion de dichos granulos.
BRPI0410834A (pt) válvula
AR104606A1 (es) Partícula recubierta
MY176228A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
BRPI0503936A (pt) sistema e método para dispositivo de display com dessecante integrado
AR081734A1 (es) Un cigarrillo simulado
BRPI0711968B8 (pt) tampa para dispositivo de injeção e dispositivo de injeção
BRPI0604976A (pt) estojo para um dispositivo portátil
CL2013002991A1 (es) Cinta que comprende un sustrato celulósico que define una primera superficie y una segunda superficie opuesta, un adhesivo sensible a la presión dispuesto en la primera superficie y un material fibroso encapsulado; sistema de abertura desprendible; envase; composición adhesiva; método para elaborar una cinta; método para elaborar dicho sistema
MY151034A (en) Semicondutor package, core layer material, buildup layer material, and sealing resin composition
MX2017013292A (es) Caja compuesta subterranea para cableado.
BR112012014344A2 (pt) dispositivo de encapsulamento com estanqueidade melhorada
BR112015014699A2 (pt) película de silicone
MY185884A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
AR089932A2 (es) Dispositivos de proteccion
MX2021003324A (es) Composicion que contiene tiol.
BR112018015159A2 (pt) método de produção para membro de compósito, e membro de compósito
BR112015021771A8 (pt) rótulo adesivo para gravação por jato de tinta

Legal Events

Date Code Title Description
B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO EM SUA FORMA AUTENTICADA; OU SEGUNDO PARECER DA PROCURADORIA NO 074/93, DEVE CONSTAR UMA DECLARACAO DE VERACIDADE, A QUAL DEVE SER ASSINADA POR UMA PESSOA DEVIDAMENTE AUTORIZADA A REPRESENTAR O INTERESSADO, DEVENDO A MESMA CONSTAR NO INSTRUMENTO DE PROCURACAO, OU NO SEU SUBSTABELECIMENTO.

B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 02/01/2019, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2633 DE 22-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.