BRPI0807278A2 - Cartão eletrônico e aeronave - Google Patents

Cartão eletrônico e aeronave

Info

Publication number: BRPI0807278A2
Authority: BR; Brazil
Prior art keywords: layer; electronic; situated; card; insulation
Prior art date: 2007-02-22

Application number

BRPI0807278-7A2A

Other languages

English (en)

Inventor

Stephane Ortet

Vincent Rebeyrotte

David Rousset

Original Assignee

Airbus France

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-02-22

Filing date

2008-02-18

Publication date

2014-12-30

2008-02-18 Application filed by Airbus France filed Critical Airbus France

2014-12-30 Publication of BRPI0807278A2 publication Critical patent/BRPI0807278A2/pt

Links

238000009413 insulation Methods 0.000 abstract 3
239000004593 Epoxy Substances 0.000 abstract 1
230000002093 peripheral effect Effects 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Credit Cards Or The Like (AREA)
Structure Of Printed Boards (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Laminated Bodies (AREA)

BRPI0807278-7A2A 2007-02-22 2008-02-18 Cartão eletrônico e aeronave BRPI0807278A2 (pt)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
FR0753433A FR2913173B1 (fr)	2007-02-22	2007-02-22	Carte electronique et aeronef la comportant
PCT/FR2008/000211 WO2008129155A2 (fr)	2007-02-22	2008-02-18	Carte electronique et aeronef la comportant

Publications (1)

Publication Number	Publication Date
BRPI0807278A2 true BRPI0807278A2 (pt)	2014-12-30

Family

ID=38473394

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0807278-7A2A BRPI0807278A2 (pt)	2007-02-22	2008-02-18	Cartão eletrônico e aeronave

Country Status (11)

Country	Link
US (1)	US8148644B2 (pt)
EP (1)	EP2123137B1 (pt)
JP (1)	JP5204128B2 (pt)
CN (1)	CN101617571B (pt)
AT (1)	ATE494762T1 (pt)
BR (1)	BRPI0807278A2 (pt)
CA (1)	CA2679084C (pt)
DE (1)	DE602008004318D1 (pt)
FR (1)	FR2913173B1 (pt)
RU (1)	RU2467528C2 (pt)
WO (1)	WO2008129155A2 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9232640B2 (en) *	2013-03-10	2016-01-05	Qualcomm Incorporated	Thermal isolation in printed circuit board assemblies
JP2016033973A (ja) *	2014-07-31	2016-03-10	アイシン・エィ・ダブリュ株式会社	電力変換装置の制御基板
WO2023110156A1 (en) *	2021-12-15	2023-06-22	Valeo Comfort And Driving Assistance	Electronic assembly

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3244795A (en) *	1963-05-31	1966-04-05	Riegel Paper Corp	Stacked, laminated printed circuit assemblies
JPS57145397A (en) *	1981-03-04	1982-09-08	Hitachi Ltd	Method of producing multilayer printed circuit board
US4755911A (en) *	1987-04-28	1988-07-05	Junkosha Co., Ltd.	Multilayer printed circuit board
US4824511A (en) *	1987-10-19	1989-04-25	E. I. Du Pont De Nemours And Company	Multilayer circuit board with fluoropolymer interlayers
JPH01161355U (pt) *	1988-04-30	1989-11-09
US4916260A (en) *	1988-10-11	1990-04-10	International Business Machines Corporation	Circuit member for use in multilayered printed circuit board assembly and method of making same
US5739476A (en) *	1994-10-05	1998-04-14	Namgung; Chung	Multilayer printed circuit board laminated with unreinforced resin
JPH11307888A (ja) *	1998-04-24	1999-11-05	Furukawa Electric Co Ltd:The	放熱層埋め込み型回路基板の製造方法
JP3956516B2 (ja) *	1999-01-11	2007-08-08	株式会社デンソー	プリント基板の実装構造
JP2001085879A (ja) *	1999-09-13	2001-03-30	Hitachi Ltd	電子回路基板の組み立て構造
EP1162630B1 (de) *	2000-06-08	2004-10-13	I & T Innovation Technik Vertriebs-Ges.m.b.H.	Flachbandkabel
CN1672475B (zh) *	2002-06-27	2011-11-23	Ppg工业俄亥俄公司	有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法
JP4099756B2 (ja) *	2002-08-07	2008-06-11	日立金属株式会社	積層基板
JP2004241526A (ja) *	2003-02-05	2004-08-26	Kyocera Corp	配線基板
DE10315768A1 (de) *	2003-04-07	2004-11-25	Siemens Ag	Mehrlagige Leiterplatte
JP2004363568A (ja) *	2003-05-09	2004-12-24	Matsushita Electric Ind Co Ltd	回路素子内蔵モジュール
JP4394432B2 (ja) *	2003-12-15	2010-01-06	日東電工株式会社	配線回路基板保持シートの製造方法
JP2005191378A (ja) *	2003-12-26	2005-07-14	Toyota Industries Corp	プリント基板における放熱構造
RU57053U1 (ru) *	2006-05-03	2006-09-27	Открытое акционерное общество "Научно-производственное объединение "Прибор"	Устройство для тепловой защиты электронных модулей в аварийных условиях

2007
- 2007-02-22 FR FR0753433A patent/FR2913173B1/fr not_active Expired - Fee Related
2008
- 2008-02-18 BR BRPI0807278-7A2A patent/BRPI0807278A2/pt not_active IP Right Cessation
- 2008-02-18 EP EP08775569A patent/EP2123137B1/fr not_active Ceased
- 2008-02-18 CN CN200880005784XA patent/CN101617571B/zh not_active Expired - Fee Related
- 2008-02-18 CA CA2679084A patent/CA2679084C/en not_active Expired - Fee Related
- 2008-02-18 US US12/528,167 patent/US8148644B2/en active Active
- 2008-02-18 DE DE602008004318T patent/DE602008004318D1/de active Active
- 2008-02-18 RU RU2009135264/07A patent/RU2467528C2/ru not_active IP Right Cessation
- 2008-02-18 JP JP2009550301A patent/JP5204128B2/ja not_active Expired - Fee Related
- 2008-02-18 AT AT08775569T patent/ATE494762T1/de not_active IP Right Cessation
- 2008-02-18 WO PCT/FR2008/000211 patent/WO2008129155A2/fr not_active Ceased

Also Published As

Publication number	Publication date
FR2913173B1 (fr)	2009-05-15
ATE494762T1 (de)	2011-01-15
CN101617571B (zh)	2012-04-11
US8148644B2 (en)	2012-04-03
JP2010519755A (ja)	2010-06-03
JP5204128B2 (ja)	2013-06-05
US20100319965A1 (en)	2010-12-23
WO2008129155A2 (fr)	2008-10-30
EP2123137B1 (fr)	2011-01-05
FR2913173A1 (fr)	2008-08-29
RU2467528C2 (ru)	2012-11-20
WO2008129155A3 (fr)	2009-02-05
RU2009135264A (ru)	2011-03-27
CN101617571A (zh)	2009-12-30
CA2679084A1 (en)	2008-10-30
CA2679084C (en)	2016-08-16
EP2123137A2 (fr)	2009-11-25
DE602008004318D1 (de)	2011-02-17

Legal Events

Date	Code	Title	Description
2015-06-09	B25A	Requested transfer of rights approved	Owner name: AIRBUS OPERATIONS SAS (FR)
2016-12-20	B08F	Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]	Free format text: REFERENTE A 9A ANUIDADE.
2017-04-04	B08K	Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

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EP2779810A3 (en)	2014-11-26	Printed circuit board package structure and manufacturing method thereof
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ATE452051T1 (de)	2010-01-15	Strukturbauteil, insbesondere hitzeschild
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DE602007009810D1 (de)	2010-11-25	Verbindung elektronischer anordnungen mit erhöhten leitungen
CL2011000284A1 (es)	2011-07-15	Una estructura laminada para un documento electronico, con elementos de interferencia electromagnetica.
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WO2009061886A3 (en)	2009-06-25	Tensile strained ge for electronic and optoelectronic applications
WO2009075079A1 (ja)	2009-06-18	回路板、回路板の製造方法およびカバーレイフィルム
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WO2014095316A3 (de)	2015-01-22	Elektronische vorrichtung und verfahren zur herstellung einer elektronischen vorrichtung
BRPI0807278A2 (pt)	2014-12-30	Cartão eletrônico e aeronave
EP2116895A3 (en)	2013-06-05	Laminated structure and image display device
NL1036864A (en)	2010-04-14	Circuit board having isolation cover and assembling method thereof.
DE112005001146A5 (de)	2007-05-24	Flacher Transponder und Verfahren zu seiner Herstellung