BRPI0811798A2 - "dispositivo dissipador de calor dotado de unidade dissipadora de calor e lâmpada led sem ventilador usando o dispositivo" - Google Patents

"dispositivo dissipador de calor dotado de unidade dissipadora de calor e lâmpada led sem ventilador usando o dispositivo"

Info

Publication number
BRPI0811798A2
BRPI0811798A2 BRPI0811798-5A2A BRPI0811798A BRPI0811798A2 BR PI0811798 A2 BRPI0811798 A2 BR PI0811798A2 BR PI0811798 A BRPI0811798 A BR PI0811798A BR PI0811798 A2 BRPI0811798 A2 BR PI0811798A2
Authority
BR
Brazil
Prior art keywords
heat sink
sink unit
fan
led lamp
detailed
Prior art date
Application number
BRPI0811798-5A2A
Other languages
English (en)
Inventor
Young Ho
Original Assignee
Fawoo Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fawoo Technology Co Ltd filed Critical Fawoo Technology Co Ltd
Publication of BRPI0811798A2 publication Critical patent/BRPI0811798A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
BRPI0811798-5A2A 2007-07-05 2008-07-01 "dispositivo dissipador de calor dotado de unidade dissipadora de calor e lâmpada led sem ventilador usando o dispositivo" BRPI0811798A2 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070067755 2007-07-05
KR20070071536 2007-07-18
KR20070071537 2007-07-18
PCT/KR2008/003870 WO2009005285A2 (en) 2007-07-05 2008-07-01 Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device

Publications (1)

Publication Number Publication Date
BRPI0811798A2 true BRPI0811798A2 (pt) 2014-11-11

Family

ID=40226664

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0811798-5A2A BRPI0811798A2 (pt) 2007-07-05 2008-07-01 "dispositivo dissipador de calor dotado de unidade dissipadora de calor e lâmpada led sem ventilador usando o dispositivo"

Country Status (11)

Country Link
US (1) US20110012494A1 (pt)
EP (1) EP2168412A4 (pt)
JP (1) JP2010531536A (pt)
KR (1) KR100879716B1 (pt)
CN (1) CN101690441A (pt)
AU (1) AU2008271463B2 (pt)
BR (1) BRPI0811798A2 (pt)
CA (1) CA2691738A1 (pt)
MX (1) MX2009014221A (pt)
WO (1) WO2009005285A2 (pt)
ZA (1) ZA200909151B (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5203031B2 (ja) * 2008-04-28 2013-06-05 臼井国際産業株式会社 扁平コイル状フィン部材を有する伝熱面構造及びその製造方法
TWI357479B (en) * 2008-11-28 2012-02-01 Univ Nat Taiwan Science Tech A thermal module for light source
CN102032474B (zh) * 2009-09-30 2013-04-24 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
KR101146693B1 (ko) * 2009-10-07 2012-05-23 김수경 엘이디(ｌｅｄ) 램프의 방열구조
KR100951553B1 (ko) * 2010-01-25 2010-04-09 엔 하이테크 주식회사 선형의 방열부재가 구비된 캐노피 등
KR101255221B1 (ko) * 2011-12-09 2013-04-23 한국해양대학교 산학협력단 Ｌｅｄ 방폭등 방열 장치
KR101340411B1 (ko) * 2013-09-04 2013-12-13 인지전기공업 주식회사 Led조명기구용 히트싱크
CN103954155B (zh) * 2014-05-09 2017-08-25 中国科学院工程热物理研究所 抗重力型螺旋盘管式非相变取热装置
US10598443B2 (en) * 2015-07-06 2020-03-24 General Electric Company Thermal management system
US10317020B1 (en) 2015-11-03 2019-06-11 Thomas McChesney Paint color matching light
CN106016206B (zh) * 2016-06-22 2019-06-04 东莞市闻誉实业有限公司 Led照明设备
CN105953197A (zh) * 2016-06-22 2016-09-21 东莞市闻誉实业有限公司 具有高效散热器的led照明装置
CN105953191B (zh) * 2016-06-22 2019-06-04 东莞市闻誉实业有限公司 散热灯具
CN106195950A (zh) * 2016-08-12 2016-12-07 广东工业大学 一种散热器和灯具
EP3293453A1 (en) * 2016-09-09 2018-03-14 Valeo Iluminacion Lighting device with a heat dissipation element
JP2018141614A (ja) * 2017-02-28 2018-09-13 三菱マテリアル株式会社 熱交換部材
JP7098954B2 (ja) * 2018-02-21 2022-07-12 三菱マテリアル株式会社 ヒートシンク
JP6863512B2 (ja) * 2019-08-06 2021-04-21 三菱マテリアル株式会社 ヒートシンク
KR102275357B1 (ko) * 2020-06-30 2021-07-09 주식회사 레딕스 히트파이프가 결합된 led 모듈장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275746A (ja) * 1993-03-18 1994-09-30 Hitachi Ltd 半導体装置
JPH1154676A (ja) * 1997-08-07 1999-02-26 Ebara Densen Kk 放熱部品
US5927386A (en) * 1998-08-24 1999-07-27 Macase Industrial Group Ga., Inc. Computer hard drive heat sink assembly
KR20020079296A (ko) * 2001-04-11 2002-10-19 주식회사 태림테크 히트파이프 및 그를 이용한 집적회로의 냉각장치
JP2005166578A (ja) * 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk 電球形ｌｅｄランプ
KR20040027642A (ko) * 2004-02-19 2004-04-01 (주) 케이티지 하이브리드 ic형 led 전등
EP1737035A4 (en) * 2004-03-31 2010-01-20 Jisouken Co Ltd HEATSINK PROCESS
CN100533715C (zh) * 2005-03-30 2009-08-26 株式会社事业创造研究所 散热器及其制造方法
KR100684429B1 (ko) * 2005-06-30 2007-02-16 서울반도체 주식회사 발광 다이오드 램프
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
JP4969973B2 (ja) * 2005-11-16 2012-07-04 臼井国際産業株式会社 ヒートシンク

Also Published As

Publication number Publication date
WO2009005285A3 (en) 2009-03-12
US20110012494A1 (en) 2011-01-20
ZA200909151B (en) 2011-02-23
EP2168412A2 (en) 2010-03-31
CN101690441A (zh) 2010-03-31
AU2008271463A1 (en) 2009-01-08
MX2009014221A (es) 2010-01-28
JP2010531536A (ja) 2010-09-24
EP2168412A4 (en) 2011-04-27
AU2008271463B2 (en) 2011-05-12
KR20090004673A (ko) 2009-01-12
CA2691738A1 (en) 2009-01-08
KR100879716B1 (ko) 2009-01-22
WO2009005285A2 (en) 2009-01-08

Similar Documents

Publication Publication Date Title
BRPI0811798A2 (pt) "dispositivo dissipador de calor dotado de unidade dissipadora de calor e lâmpada led sem ventilador usando o dispositivo"
DE602006012391D1 (de) Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
EP2175193A4 (en) LIGHT EMITTING DEVICE AND INTEGRATING LIGHTING DEVICE
BRPI0811678A2 (pt) "aparelho de iluminação"
EP2120271A4 (en) LIGHT EMITTING DIODE DEVICE AND LIGHTING APPARATUS
BRPI0816558A2 (pt) aparelho e dispositivo de iluminação de diodo emissor de luz
EP2094063A4 (en) LIGHT EMITTING DIODE LIGHTING CIRCUIT AND LIGHTING APPARATUS USING SAID CIRCUIT
TWI317829B (en) Led illumination device and application thereof
EP1754259A4 (en) DIRECT COOLING OF LEDS
EP1904793A4 (en) LIGHTS CEILING FAN COMBINATION
BRPI0814134A2 (pt) Dispositivo de iluminação e dispositivo de vídeo utilizando o mesmo
GB0719999D0 (en) Integral reflector and heat sink
EP2259345A4 (en) LIGHT-EMITTING SEMICONDUCTOR ELEMENT AND LIGHTING DEVICE THEREWITH
EP1988336A4 (en) ILLUMINATION DEVICE
BR112012029829A2 (pt) ''dispositivo dissipador de calor para lâmpada led e lâmpada com elevada dissipação de calor''
DE602008000268D1 (de) Beleuchtungsvorrichtung und Sichtmessgerät
DE602008005234D1 (de) Glühlampe und lichtausstrahlende Wärmebehandlungsvorrichtung
DE602006016278D1 (de) Induktionserwärmungsvorrichtung
DE602007010961D1 (de) Lampeneinheit und projektor damit
TWI339789B (en) Device and heat sink
EP2329188A4 (en) CEILING FAN AND LUMINOUS COMBINATION
DE602006011168D1 (de) Leuchtstoff und leuchtvorrichtung
DE602006012951D1 (de) Led-beleuchtungsvorrichtung
EP2109195A4 (en) LAMP SUN AND LIGHTING DEVICE THEREWITH
TWI329490B (en) Fan duct and heat dissipating device having the same

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]