BRPI0814496A2 - Adesivo epóxi bicomponente e método para montar um primeiro membro num segundo membro - Google Patents

Adesivo epóxi bicomponente e método para montar um primeiro membro num segundo membro

Info

Publication number
BRPI0814496A2
BRPI0814496A2 BRPI0814496-6A2A BRPI0814496A BRPI0814496A2 BR PI0814496 A2 BRPI0814496 A2 BR PI0814496A2 BR PI0814496 A BRPI0814496 A BR PI0814496A BR PI0814496 A2 BRPI0814496 A2 BR PI0814496A2
Authority
BR
Brazil
Prior art keywords
mounting
bicomponent epoxy
epoxy sticker
sticker
bicomponent
Prior art date
Application number
BRPI0814496-6A2A
Other languages
English (en)
Inventor
Andreas Lutz
Beda Steiner
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0814496A2 publication Critical patent/BRPI0814496A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
    • C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI0814496-6A2A 2007-08-17 2008-08-05 Adesivo epóxi bicomponente e método para montar um primeiro membro num segundo membro BRPI0814496A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96549907P 2007-08-17 2007-08-17
PCT/US2008/072231 WO2009025991A1 (en) 2007-08-17 2008-08-05 Two part crash durable epoxy adhesives

Publications (1)

Publication Number Publication Date
BRPI0814496A2 true BRPI0814496A2 (pt) 2015-02-03

Family

ID=40157166

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0814496-6A2A BRPI0814496A2 (pt) 2007-08-17 2008-08-05 Adesivo epóxi bicomponente e método para montar um primeiro membro num segundo membro

Country Status (7)

Country Link
US (1) US8278398B2 (pt)
EP (1) EP2181156A1 (pt)
JP (1) JP2010536953A (pt)
KR (1) KR20100055478A (pt)
CN (1) CN101778901A (pt)
BR (1) BRPI0814496A2 (pt)
WO (1) WO2009025991A1 (pt)

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KR20110045046A (ko) * 2008-08-11 2011-05-03 다우 글로벌 테크놀로지스 엘엘씨 페놀 및 하이드록시-종결 아크릴레이트 또는 하이드록시-종결 메타크릴레이트로 캡핑된 엘라스토머 강인화제를 함유하는 1-파트 에폭시 수지 구조 접착제
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Also Published As

Publication number Publication date
CN101778901A (zh) 2010-07-14
US8278398B2 (en) 2012-10-02
WO2009025991A1 (en) 2009-02-26
KR20100055478A (ko) 2010-05-26
US20090048370A1 (en) 2009-02-19
EP2181156A1 (en) 2010-05-05
JP2010536953A (ja) 2010-12-02

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired