BRPI0816202A2 - Arranjo de circuito elétrico com um suporte de circuito de mid e uma interface de ligação ligada ao mesmo. - Google Patents

Arranjo de circuito elétrico com um suporte de circuito de mid e uma interface de ligação ligada ao mesmo.

Info

Publication number
BRPI0816202A2
BRPI0816202A2 BRPI0816202-6A BRPI0816202A BRPI0816202A2 BR PI0816202 A2 BRPI0816202 A2 BR PI0816202A2 BR PI0816202 A BRPI0816202 A BR PI0816202A BR PI0816202 A2 BRPI0816202 A2 BR PI0816202A2
Authority
BR
Brazil
Prior art keywords
interface connected
mid
bracket
wiring interface
electrical circuit
Prior art date
Application number
BRPI0816202-6A
Other languages
English (en)
Inventor
Stefan Kopf
Hartmut Rohde
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BRPI0816202A2 publication Critical patent/BRPI0816202A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
BRPI0816202-6A 2007-09-04 2008-07-18 Arranjo de circuito elétrico com um suporte de circuito de mid e uma interface de ligação ligada ao mesmo. BRPI0816202A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007041892A DE102007041892A1 (de) 2007-09-04 2007-09-04 Elektrische Schaltanordnung mit einem MID-Schaltungsträger und einer damit verbundenen Verbindungsschnittstelle
PCT/EP2008/059484 WO2009030553A1 (de) 2007-09-04 2008-07-18 Elektrische schaltanordnung mit einem mid-schaltungsträger und einer damit verbundenen verbindungsschnittstelle

Publications (1)

Publication Number Publication Date
BRPI0816202A2 true BRPI0816202A2 (pt) 2015-04-14

Family

ID=40230021

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0816202-6A BRPI0816202A2 (pt) 2007-09-04 2008-07-18 Arranjo de circuito elétrico com um suporte de circuito de mid e uma interface de ligação ligada ao mesmo.

Country Status (8)

Country Link
US (1) US9560772B2 (pt)
EP (1) EP2198484B1 (pt)
JP (1) JP5393681B2 (pt)
KR (1) KR101539212B1 (pt)
CN (1) CN101796690A (pt)
BR (1) BRPI0816202A2 (pt)
DE (1) DE102007041892A1 (pt)
WO (1) WO2009030553A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010043493A1 (de) 2010-11-05 2012-05-10 Robert Bosch Gmbh Elektrisches Bauteil mit einer Kontaktvorrichtung
WO2013189531A1 (de) 2012-06-20 2013-12-27 Siemens Medical Instruments Pte. Ltd. Spritzgegossener leitungsträger mit integrierter leiterplatte
WO2014064544A1 (en) 2012-10-22 2014-05-01 Siemens Medical Instruments Pte. Ltd. Routing building block for complex mid structures in hearing instruments
DE102014010628A1 (de) * 2014-07-21 2016-01-21 Krallmann Kunststoffverarbeitung Gmbh Kunststoff-Bauteil mit zumindest einem elektrischen Kontaktelement und Verfahren zu seiner Herstellung
KR102518368B1 (ko) 2016-04-06 2023-04-13 삼성전자주식회사 조명 장치
JP6563366B2 (ja) * 2016-06-13 2019-08-21 新光電気工業株式会社 配線基板及びその製造方法
KR102003644B1 (ko) * 2018-06-28 2019-10-01 조현민 신축 전도성 연결 기반 신축성 전자 장치 및 그 제조 방법
DE102018120337B3 (de) * 2018-08-21 2020-02-27 Preh Gmbh Berührempfindliches bedienelement für ein kraftfahrzeug
JP7786820B2 (ja) 2021-12-07 2025-12-16 キヤノン株式会社 電子機器
JP2023174161A (ja) * 2022-05-27 2023-12-07 株式会社デンソー 電子装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
DE4032397A1 (de) 1990-10-12 1992-04-16 Bosch Gmbh Robert Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur
JP3464826B2 (ja) 1994-07-21 2003-11-10 株式会社東芝 半導体装置
US6249048B1 (en) * 1997-03-21 2001-06-19 Siemens N.V. Polymer stud grid array
US5579207A (en) * 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
JPH08310172A (ja) 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
US5831832A (en) * 1997-08-11 1998-11-03 Motorola, Inc. Molded plastic ball grid array package
DE10211826C1 (de) * 2002-03-16 2003-09-25 Krone Gmbh Stecker für Anschlussleisten und Verfahren zu deren Herstellung
FR2844098B1 (fr) * 2002-09-03 2004-11-19 Atmel Grenoble Sa Microsysteme optique et procede de fabrication
FR2857782B1 (fr) * 2003-07-18 2005-10-14 Commissariat Energie Atomique Film conducteur anisotrope a inserts conducteurs ameliores
US7613010B2 (en) * 2004-02-02 2009-11-03 Panasonic Corporation Stereoscopic electronic circuit device, and relay board and relay frame used therein
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
DE102004011100A1 (de) * 2004-03-06 2005-09-22 Robert Bosch Gmbh Bewegungssensor und Verfahren zur Herstellung eines Bewegungssensors
JP4196901B2 (ja) * 2004-08-11 2008-12-17 ソニー株式会社 電子回路装置
DE202004020759U1 (de) * 2004-11-29 2006-04-13 Robert Bosch Gmbh Elektrische Maschine mit in das Gehäuse integrierten Leiterbahnen
DE102005015109B4 (de) * 2005-04-01 2007-06-21 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips auf einem Substrat und entsprechende Anordnung
JP2006332799A (ja) * 2005-05-23 2006-12-07 Matsushita Electric Works Ltd 音響センサ
JP4466497B2 (ja) * 2005-07-26 2010-05-26 パナソニック電工株式会社 センサモジュール
US7280370B2 (en) * 2005-08-26 2007-10-09 Delphi Technologies, Inc. Electronic package and circuit board having segmented contact pads
DE102005046008B4 (de) * 2005-09-26 2007-05-24 Infineon Technologies Ag Halbleitersensorbauteil mit Sensorchip und Verfahren zur Herstellung desselben
DE102007031980A1 (de) * 2007-07-10 2009-01-15 Robert Bosch Gmbh Anschlusseinheit für eine Druckmesszelle

Also Published As

Publication number Publication date
WO2009030553A1 (de) 2009-03-12
KR101539212B1 (ko) 2015-07-27
KR20100068243A (ko) 2010-06-22
JP5393681B2 (ja) 2014-01-22
EP2198484A1 (de) 2010-06-23
CN101796690A (zh) 2010-08-04
DE102007041892A1 (de) 2009-03-05
US20110083894A1 (en) 2011-04-14
EP2198484B1 (de) 2018-12-05
US9560772B2 (en) 2017-01-31
JP2010538482A (ja) 2010-12-09

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Legal Events

Date Code Title Description
B07A Technical examination (opinion): publication of technical examination (opinion)
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application according art. 36 industrial patent law
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements