BRPI0908922A2 - processo de moldagem de resina e dispositivo de molde de moldagem de resina - Google Patents

processo de moldagem de resina e dispositivo de molde de moldagem de resina

Info

Publication number
BRPI0908922A2
BRPI0908922A2 BRPI0908922A BRPI0908922A BRPI0908922A2 BR PI0908922 A2 BRPI0908922 A2 BR PI0908922A2 BR PI0908922 A BRPI0908922 A BR PI0908922A BR PI0908922 A BRPI0908922 A BR PI0908922A BR PI0908922 A2 BRPI0908922 A2 BR PI0908922A2
Authority
BR
Brazil
Prior art keywords
resin molding
molding process
molding device
resin
molding
Prior art date
Application number
BRPI0908922A
Other languages
English (en)
Inventor
Noda Yuuichirou
Original Assignee
Honda Lock Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Lock Kk filed Critical Honda Lock Kk
Publication of BRPI0908922A2 publication Critical patent/BRPI0908922A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/57—Exerting after-pressure on the moulding material
    • B29C45/572—Exerting after-pressure on the moulding material using movable mould wall or runner parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561—Injection-compression moulding
    • B29C2045/5645—Resilient compression means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
BRPI0908922A 2008-03-31 2009-03-10 processo de moldagem de resina e dispositivo de molde de moldagem de resina BRPI0908922A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008092323A JP4979627B2 (ja) 2008-03-31 2008-03-31 樹脂成形方法および樹脂成形用金型装置
PCT/JP2009/054509 WO2009122866A1 (ja) 2008-03-31 2009-03-10 樹脂成形方法および樹脂成形用金型装置

Publications (1)

Publication Number Publication Date
BRPI0908922A2 true BRPI0908922A2 (pt) 2018-02-06

Family

ID=41135253

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0908922A BRPI0908922A2 (pt) 2008-03-31 2009-03-10 processo de moldagem de resina e dispositivo de molde de moldagem de resina

Country Status (5)

Country Link
US (1) US7988904B2 (pt)
JP (1) JP4979627B2 (pt)
CN (1) CN101980850B (pt)
BR (1) BRPI0908922A2 (pt)
WO (1) WO2009122866A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013078929A (ja) * 2011-06-29 2013-05-02 Sony Corp 成形装置、成形品の成形方法及び成形品
US20160062373A1 (en) * 2014-08-29 2016-03-03 Intel Corporation Adaptive loading and cooling
US20210268702A1 (en) * 2018-07-18 2021-09-02 Kumi Kasei Co., Ltd. Injection molding die, and method of manufacturing molded product
JP7262986B2 (ja) * 2018-12-05 2023-04-24 キヤノン株式会社 射出成形型、射出成形型の製造方法、射出成形機、および樹脂成形品の製造方法
CN113442372A (zh) * 2021-07-15 2021-09-28 深圳市银宝山新科技股份有限公司 保压机构及模具

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51119062A (en) * 1975-03-26 1976-10-19 Nissan Chemical Ind Ltd Low pressure extrusion molding method
US4832676A (en) * 1986-12-08 1989-05-23 James River-Norwalk, Inc. Method and apparatus for forming paperboard containers
JP3253991B2 (ja) * 1991-10-24 2002-02-04 旭化成株式会社 射出成形方法
US5439371A (en) * 1992-10-07 1995-08-08 Sumitomo Heavy Industries, Ltd. Locally pressurizing injection molding machine
JP3512595B2 (ja) 1996-11-07 2004-03-29 株式会社リコー プラスチック成形品の成形方法およびプラスチック成形品の成形用金型
US5656234A (en) * 1994-08-12 1997-08-12 Mitsubishi Gas Chemical Company, Inc. Mold apparatus and injection molding method for producing hollow-structured article by injection molding
US6929761B2 (en) * 2001-04-19 2005-08-16 Sagoma Plastics Corporation Molded hologram apparatus method and product
JP2002326260A (ja) * 2001-05-07 2002-11-12 Ricoh Co Ltd プラスチック成形品の成形方法及び金型
JP2004082482A (ja) 2002-08-26 2004-03-18 Olympus Corp 射出成形用金型、射出成形方法及び光学素子
JP3963314B2 (ja) * 2002-08-26 2007-08-22 ダイキョーニシカワ株式会社 表皮一体成形体の成形方法
JP4211555B2 (ja) * 2003-10-01 2009-01-21 トヨタ自動車株式会社 コアバック射出成形方法および射出成形品
JP4087818B2 (ja) * 2004-06-09 2008-05-21 株式会社日本製鋼所 厚肉導光板の成形方法
JP4579781B2 (ja) * 2005-06-30 2010-11-10 日本写真印刷株式会社 圧縮成形方法およびその装置
KR100644926B1 (ko) * 2005-08-30 2006-11-10 강명호 분리형 금형을 구비한 사출장치 및 그 제어방법

Also Published As

Publication number Publication date
US20110001266A1 (en) 2011-01-06
CN101980850B (zh) 2013-05-15
JP4979627B2 (ja) 2012-07-18
US7988904B2 (en) 2011-08-02
WO2009122866A1 (ja) 2009-10-08
JP2009241480A (ja) 2009-10-22
CN101980850A (zh) 2011-02-23

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 10A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2506 DE 15-01-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.