BRPI0909861A2 - método para aderir um primeiro componente a um segundo componente, tubulação, composição e uso de composição - Google Patents

método para aderir um primeiro componente a um segundo componente, tubulação, composição e uso de composição

Info

Publication number
BRPI0909861A2
BRPI0909861A2 BRPI0909861A BRPI0909861A BRPI0909861A2 BR PI0909861 A2 BRPI0909861 A2 BR PI0909861A2 BR PI0909861 A BRPI0909861 A BR PI0909861A BR PI0909861 A BRPI0909861 A BR PI0909861A BR PI0909861 A2 BRPI0909861 A2 BR PI0909861A2
Authority
BR
Brazil
Prior art keywords
compositing
component
piping
joining
compositing use
Prior art date
Application number
BRPI0909861A
Other languages
English (en)
Inventor
Carlo Cocconi
Elisa Corinti
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0909861A2 publication Critical patent/BRPI0909861A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
    • C08G18/6685—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3225 or polyamines of C08G18/38
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polyurethanes Or Polyureas (AREA)
BRPI0909861A 2008-06-03 2009-06-01 método para aderir um primeiro componente a um segundo componente, tubulação, composição e uso de composição BRPI0909861A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08157510A EP2130641A1 (en) 2008-06-03 2008-06-03 Polyurethane Adhesive Composition
PCT/EP2009/056693 WO2009147117A1 (en) 2008-06-03 2009-06-01 Polyurethane adhesive composition

Publications (1)

Publication Number Publication Date
BRPI0909861A2 true BRPI0909861A2 (pt) 2015-10-06

Family

ID=39884499

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0909861A BRPI0909861A2 (pt) 2008-06-03 2009-06-01 método para aderir um primeiro componente a um segundo componente, tubulação, composição e uso de composição

Country Status (5)

Country Link
US (1) US20110174414A1 (pt)
EP (1) EP2130641A1 (pt)
CN (1) CN102105261A (pt)
BR (1) BRPI0909861A2 (pt)
WO (1) WO2009147117A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5604407B2 (ja) 2010-12-21 2014-10-08 ローム アンド ハース カンパニー 接着剤組成物
JP5642047B2 (ja) 2010-12-21 2014-12-17 ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ 接着剤組成物
EP2888303B1 (en) * 2012-08-24 2020-10-21 Ashland Licensing And Intellectual Property, LLC Solvent free polyurethane laminating adhesive with high oxygen transfer rate
CN102876279B (zh) * 2012-09-17 2013-12-18 太原市塑料研究所 一种非开挖管道修复用聚氨酯胶粘剂及其制备方法
KR20200099567A (ko) 2017-12-20 2020-08-24 헨켈 아게 운트 코. 카게아아 기계적 특성의 우수한 조합을 갖는 열 전도성 폴리우레탄 접착제
CN115895263A (zh) * 2022-10-28 2023-04-04 深圳市凯五新材料科技有限公司 弹性复合材料及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE667728A (pt) 1964-08-28
US3949189A (en) * 1973-06-15 1976-04-06 Thermon Manufacturing Company Pipe heat transfer assembly
US4401156A (en) 1979-06-21 1983-08-30 Eaton Corporation Heat transfer apparatus for releasably securing heating or cooling means to pipe
US5451629A (en) * 1985-05-31 1995-09-19 Jacobs; Richard Fast bonding electrically conductive composition and structures
US4935086A (en) * 1986-01-13 1990-06-19 Raytheon Company Process of bonding an electrical device package to a mounting surface
DE3919697A1 (de) * 1989-06-16 1990-12-20 Bayer Ag Einkomponenten-reaktivklebstoffe auf polyurethanbasis
GB2268496B (en) * 1992-07-08 1996-03-20 Intersurgical Ltd Improved thermal capacity reticulated polymer foams
WO2004090942A2 (en) * 2003-04-01 2004-10-21 Aguila Technologies, Inc. Thermally conductive adhesive composition and process for device attachment

Also Published As

Publication number Publication date
EP2130641A1 (en) 2009-12-09
CN102105261A (zh) 2011-06-22
WO2009147117A1 (en) 2009-12-10
US20110174414A1 (en) 2011-07-21

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2344 DE 08-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.