BRPI0916929A2 - etiqueta de ci sem fio, e, sistema de administração de qualidade de objeto estrutural de concreto - Google Patents

etiqueta de ci sem fio, e, sistema de administração de qualidade de objeto estrutural de concreto

Info

Publication number
BRPI0916929A2
BRPI0916929A2 BRPI0916929A BRPI0916929A BRPI0916929A2 BR PI0916929 A2 BRPI0916929 A2 BR PI0916929A2 BR PI0916929 A BRPI0916929 A BR PI0916929A BR PI0916929 A BRPI0916929 A BR PI0916929A BR PI0916929 A2 BRPI0916929 A2 BR PI0916929A2
Authority
BR
Brazil
Prior art keywords
tag
wireless
management system
quality management
concrete structural
Prior art date
Application number
BRPI0916929A
Other languages
English (en)
Inventor
Kaga Kikuo
Ashizawa Shigeo
Original Assignee
Mitomo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitomo Corp filed Critical Mitomo Corp
Publication of BRPI0916929A2 publication Critical patent/BRPI0916929A2/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G01B7/20—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance formed by printed-circuit technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D9/00—Recording measured values
    • G01D9/005—Solid-state data loggers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Manufacturing Of Tubular Articles Or Embedded Moulded Articles (AREA)
BRPI0916929A 2009-06-18 2009-10-06 etiqueta de ci sem fio, e, sistema de administração de qualidade de objeto estrutural de concreto BRPI0916929A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009145829 2009-06-18
JP2009187642A JP2011022982A (ja) 2009-06-18 2009-08-13 無線ｉｃタグ、該無線ｉｃタグを用いたコンクリート構造物品質管理システム
PCT/JP2009/067684 WO2010146726A1 (ja) 2009-06-18 2009-10-06 無線ｉｃタグ、該無線ｉｃタグを用いたコンクリート構造物品質管理システム

Publications (1)

Publication Number Publication Date
BRPI0916929A2 true BRPI0916929A2 (pt) 2019-09-24

Family

ID=43356063

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0916929A BRPI0916929A2 (pt) 2009-06-18 2009-10-06 etiqueta de ci sem fio, e, sistema de administração de qualidade de objeto estrutural de concreto

Country Status (6)

Country Link
US (1) US20110115613A1 (pt)
JP (1) JP2011022982A (pt)
CN (1) CN102099658A (pt)
BR (1) BRPI0916929A2 (pt)
CA (1) CA2746172A1 (pt)
WO (1) WO2010146726A1 (pt)

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IT1403612B1 (it) * 2010-12-22 2013-10-31 St Microelectronics Srl Dispositivo elettronico integrato per il monitoraggio di parametri all'interno di una struttura solida e sistema di monitoraggio impiegante tale dispositivo
JP5442593B2 (ja) * 2010-12-27 2014-03-12 株式会社Ｊｕｓｔ．Ｗｉｌｌ リサイクル対応型枠
JP5275379B2 (ja) * 2011-01-24 2013-08-28 三智商事株式会社 竪型無線ｉｃタグ投入装置
JP2012198121A (ja) 2011-03-22 2012-10-18 Seiko Epson Corp センサー装置および測定方法
JP2012198120A (ja) * 2011-03-22 2012-10-18 Seiko Epson Corp センサー装置
JP5796344B2 (ja) 2011-05-13 2015-10-21 セイコーエプソン株式会社 センサー装置
JP5734785B2 (ja) * 2011-08-08 2015-06-17 株式会社Just.Will リサイクル対応型枠
JP5690255B2 (ja) * 2011-10-28 2015-03-25 公益財団法人鉄道総合技術研究所 Ｒｃ構造物の表面被覆材の性能確認試験方法及びその装置
JP5690254B2 (ja) * 2011-10-28 2015-03-25 公益財団法人鉄道総合技術研究所 鉄筋腐食によるｒｃ構造物の劣化モニタリング方法及びその装置
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US9836801B2 (en) 2012-01-23 2017-12-05 Quipip, Llc Systems, methods and apparatus for providing comparative statistical information in a graphical format for a plurality of markets using a closed-loop production management system
CN102607644B (zh) * 2012-02-23 2014-11-12 中建钢构有限公司 一种建筑施工监测系统及其监测方法
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US10184928B2 (en) 2014-01-29 2019-01-22 Quipip, Llc Measuring device, systems, and methods for obtaining data relating to condition and performance of concrete mixtures
US9194855B2 (en) 2014-02-28 2015-11-24 Quipip, Llc Systems, methods and apparatus for providing to a driver of a vehicle carrying a mixture real-time information relating to a characteristic of the mixture
WO2015133541A1 (ja) * 2014-03-06 2015-09-11 シチズンホールディングス株式会社 ワイヤレス温度センサ
KR101604618B1 (ko) * 2014-07-10 2016-03-21 중앙대학교 산학협력단 탱크형 구조물의 변형정보 실시간 감지 장치
WO2016073413A1 (en) * 2014-11-07 2016-05-12 3M Innovative Properties Company Wireless sensor for thermal property with thermal source
US20160192801A1 (en) * 2015-01-02 2016-07-07 Jeff Wu Circulator cooker
WO2016123228A1 (en) 2015-01-30 2016-08-04 Quipip, Llc Systems, apparatus and methods for testing and predicting the performance of concrete mixtures
JP6455199B2 (ja) * 2015-02-09 2019-01-23 凸版印刷株式会社 表示機能付き電子デバイス及びカバン物品
CN105424214A (zh) * 2015-12-18 2016-03-23 深圳市敏杰电子科技有限公司 一体型薄膜温度传感器
JP6489527B2 (ja) * 2016-02-15 2019-03-27 公立大学法人 富山県立大学 コンクリート構造物の現有歪み測定方法及び測定装置
EP3254979B1 (en) * 2016-06-09 2018-12-19 Tetra Laval Holdings & Finance S.A. Unit and method for forming/advancing a pack or a portion of a pack
US20190184601A1 (en) * 2016-06-20 2019-06-20 The Board Of Regents For Oklahoma State University System and method for labeling and monitoring cementitious composites
CA2947925C (en) * 2016-08-16 2023-11-07 John Petrachek System and method for monitoring water level on a roof
CN106839965A (zh) * 2017-03-13 2017-06-13 同济大学 用于测量金属构件表面应变的标签、测量系统及其应用方法
WO2019157041A1 (en) * 2018-02-07 2019-08-15 Gregg Novick Smart porous concrete slab
CN108693337A (zh) * 2018-03-15 2018-10-23 中广核工程有限公司 一种用于核电站混凝土安全壳裂缝监测的装置和方法
EP3699856A1 (en) * 2019-02-21 2020-08-26 INL - International Iberian Nanotechnology Laboratory Tagging of an object
KR102071282B1 (ko) * 2019-05-20 2020-01-30 김창혁 매트형 변형률 게이지 및 그것을 이용한 변형률 분석 시스템
CN114829881B (zh) * 2019-10-02 2024-05-24 纳博特斯克有限公司 传感器装置、管理系统、管理服务器、验收检查装置、传感器装置执行的方法以及标牌
JP7489195B2 (ja) * 2020-01-10 2024-05-23 サトーホールディングス株式会社 物品管理システムおよび物品管理方法
JP7385478B2 (ja) * 2020-01-10 2023-11-22 サトーホールディングス株式会社 物品管理システムおよび物品管理方法
EP3862334A1 (en) 2020-02-07 2021-08-11 Secil-Companhia Geral de Cal e Cimento S.A. Cement-based substrate for induction energy transfer systems
EP3882604A1 (en) * 2020-03-17 2021-09-22 ETH Zurich Sensor assembly for determining properties of a concrete structure and concrete structure
DE102020112981A1 (de) 2020-05-13 2021-11-18 Deutsches Zentrum für Luft- und Raumfahrt e.V. Faserverbund-Fertigungsanlage und Verfahren zur Herstellung eines Faserverbundbauteils
CN111947563A (zh) * 2020-08-10 2020-11-17 南京智慧基础设施技术研究院有限公司 一种基于射频识别技术的混凝土坝分缝监测装置与方法
CN112525061B (zh) * 2020-11-09 2022-09-13 西南科技大学 一种采用纳米复合材料的无线应变测试装置及方法
JP7590160B2 (ja) * 2020-11-10 2024-11-26 Ｔｏｐｐａｎエッジ株式会社 コンクリート用型枠および施工方法
JP7590159B2 (ja) * 2020-11-10 2024-11-26 Ｔｏｐｐａｎエッジ株式会社 コンクリートの養生管理装置およびコンクリートの養生管理方法
JP7546508B2 (ja) * 2021-03-29 2024-09-06 太平洋セメント株式会社 水硬性組成物の強度発現時期の判定方法、水硬性組成物の強度発現時期の判定システム
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Also Published As

Publication number Publication date
US20110115613A1 (en) 2011-05-19
CA2746172A1 (en) 2010-12-23
JP2011022982A (ja) 2011-02-03
WO2010146726A1 (ja) 2010-12-23
CN102099658A (zh) 2011-06-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.