BRPI0917176A2 - composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi - Google Patents

composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi

Info

Publication number
BRPI0917176A2
BRPI0917176A2 BRPI0917176A BRPI0917176A BRPI0917176A2 BR PI0917176 A2 BRPI0917176 A2 BR PI0917176A2 BR PI0917176 A BRPI0917176 A BR PI0917176A BR PI0917176 A BRPI0917176 A BR PI0917176A BR PI0917176 A2 BRPI0917176 A2 BR PI0917176A2
Authority
BR
Brazil
Prior art keywords
heat
resin compositions
epoxide resin
substrate
substrates
Prior art date
Application number
BRPI0917176A
Other languages
English (en)
Inventor
Andreas Kramer
Original Assignee
Sika Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Technology Ag filed Critical Sika Technology Ag
Publication of BRPI0917176A2 publication Critical patent/BRPI0917176A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0917176A 2008-08-27 2009-08-27 composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi BRPI0917176A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08163060A EP2161274B1 (de) 2008-08-27 2008-08-27 Silan-/Harnstoff-Verbindung als hitzeaktivierbarer Härter für Epoxidharzzusammensetzungen
PCT/EP2009/061027 WO2010023234A1 (de) 2008-08-27 2009-08-27 Silan/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen

Publications (1)

Publication Number Publication Date
BRPI0917176A2 true BRPI0917176A2 (pt) 2015-11-24

Family

ID=40266047

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0917176A BRPI0917176A2 (pt) 2008-08-27 2009-08-27 composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi

Country Status (9)

Country Link
US (2) US8728271B2 (pt)
EP (1) EP2161274B1 (pt)
JP (1) JP2012500879A (pt)
KR (1) KR20110057176A (pt)
CN (2) CN102131817B (pt)
AT (1) ATE468344T1 (pt)
BR (1) BRPI0917176A2 (pt)
DE (1) DE502008000690D1 (pt)
WO (1) WO2010023234A1 (pt)

Families Citing this family (13)

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US9263360B2 (en) * 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants
US20140272437A1 (en) * 2013-03-04 2014-09-18 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Silane end capped substituted urea resins and coatings thereof
BR112017000219A2 (pt) 2014-07-08 2018-01-16 Dow Global Technologies Llc adesivo durável à falha de alta tg de cura retardada
US10913815B2 (en) * 2014-11-13 2021-02-09 The Yokohama Rubber Co., Ltd. Curable resin composition
PL3067375T3 (pl) * 2015-03-11 2018-01-31 Henkel Ag & Co Kgaa Sililowane poliuretany, ich wytwarzanie i zastosowanie
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
US9957438B2 (en) * 2016-01-26 2018-05-01 General Electric Company Compositions for, solutions for, and methods of use of siloxane based aromatic trisureas as viscosifiers
CN109096836B (zh) * 2018-07-09 2021-04-06 广州弗西林橡塑有限公司 一种氟橡胶组合物
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband
EP4245785A4 (en) * 2020-11-12 2024-09-25 DIC Corporation CURABLE COMPOSITION, CURRED PRODUCT AND ADHESIVE
WO2023086852A1 (en) * 2021-11-11 2023-05-19 Ddp Specialty Electronic Materials Us, Llc Two-component polyurethane adhesive
CN113930132B (zh) * 2021-11-17 2022-10-21 芜湖跃兆生物科技有限公司 一种没食子酸修饰硅藻土改性环氧树脂漆和制备方法
CN118599086B (zh) * 2024-06-18 2025-01-28 东莞市亮雅塑料制品有限公司 一种高韧性复合tpu材料及其制备方法

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US3754971A (en) * 1968-09-12 1973-08-28 Union Carbide Corp Urea silicon product and uses thereof
DE2123033A1 (de) 1971-02-11 1972-08-24 Du Pont Epoxy haltige Polymermasse
EP0308664B1 (de) 1987-08-26 1991-08-28 Ciba-Geigy Ag Modifizierte Epoxidharze
EP0338985B1 (de) 1988-04-18 1994-05-18 Ciba-Geigy Ag Modifizierte Epoxidharze
ES2068911T3 (es) 1988-07-28 1995-05-01 Ciba Geigy Ag Combinaciones de flexibilizadores para resinas epoxi.
PE56294A1 (es) * 1993-06-21 1995-01-17 Atochem North America Elf Un metodo para reforzar un sustrato de oxido quebradizo, composiciones a base de silano, y un sustrato de oxido quebradizo polimerizado eslabonado-cruzado recubierto de siloxano
US5530052A (en) 1995-04-03 1996-06-25 General Electric Company Layered minerals and compositions comprising the same
JP3664831B2 (ja) * 1997-01-28 2005-06-29 ジーイー東芝シリコーン株式会社 エマルジョン型シリコーン組成物およびエアバッグ
DE69907162T2 (de) 1998-02-20 2004-02-19 Vantico Ag Organophile phyllosilikate
US6322890B1 (en) 1998-03-30 2001-11-27 Wm. Marsh Rice University Supra-molecular alkylalumoxanes
DE19845607A1 (de) 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
KR100815314B1 (ko) * 2000-03-31 2008-03-19 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치
ES2221909T3 (es) 2000-04-10 2005-01-16 Henkel Kommanditgesellschaft Auf Aktien Composiciones de resina epoxi resilientes.
EP1152019A1 (de) 2000-05-02 2001-11-07 Sika AG, vorm. Kaspar Winkler & Co. Thixotropiermittel
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
EP1431325A1 (de) 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
DE10324486A1 (de) 2003-05-30 2004-12-16 Degussa Ag Verwendung von Harnstoff-Derivaten als Beschleuniger für Epoxidharze
CA2529737C (en) 2003-07-07 2013-05-07 Dow Global Technologies Inc. Adhesive epoxy composition and process for applying it
EP1498441A1 (de) 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
CN101483080A (zh) * 2003-12-04 2009-07-15 旭化成电子材料元件株式会社 各向异性的导电粘合片材及连接结构体
BRPI0516699A (pt) 2004-11-10 2008-09-16 Dow Global Technologies Inc composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratos
ATE453687T1 (de) 2004-11-10 2010-01-15 Dow Global Technologies Inc Mit amphiphilem blockcoplymer gehärtete epoxidharze
DK1717240T3 (da) * 2005-04-29 2011-01-24 Sika Technology Ag Organoalkoxysilaner til anvendelse i fugtighedshærdende sammensætninger
ATE462762T1 (de) 2005-06-02 2010-04-15 Dow Global Technologies Inc Schlagzähmodifizierter strukturklebstoff auf epoxid basis
EP1741734A1 (de) * 2005-07-05 2007-01-10 Sika Technology AG Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen
EP1754721A1 (de) 2005-08-16 2007-02-21 Sika Technology AG Aminogruppen-terminierte Zähigkeitsverbesserer und deren Folgeprodukte und Verwendungen
ATE534703T1 (de) 2005-08-24 2011-12-15 Henkel Kgaa Epoxidzusammensetzungen mit verbesserter schlagzähigkeit
ES2691528T3 (es) 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
US7759435B2 (en) 2006-09-26 2010-07-20 Loctite (R&D) Limited Adducts and curable compositions using same
EP1916285A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Derivatisiertes Epoxid-Festharz und dessen Verwendungen
EP1916272A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Hitzehärtende Epoxidharzzusammensetzung enthaltend ein blockiertes und ein epoxidterminiertes Polyurethanprepolymer
EP1916270A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Hitzehärtende Epoxidharzzusammensetzung mit blockiertem Polyurethanprepolymer
EP1916269A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Blockierte Polyurethanprepolymere und hitzehärtende Epoxidharzzusammensetzungen

Also Published As

Publication number Publication date
JP2012500879A (ja) 2012-01-12
US20110155320A1 (en) 2011-06-30
US8728271B2 (en) 2014-05-20
EP2161274A1 (de) 2010-03-10
US9284447B2 (en) 2016-03-15
CN103524714B (zh) 2016-04-06
EP2161274B1 (de) 2010-05-19
CN102131817A (zh) 2011-07-20
KR20110057176A (ko) 2011-05-31
DE502008000690D1 (de) 2010-07-01
CN103524714A (zh) 2014-01-22
CN102131817B (zh) 2014-05-07
WO2010023234A1 (de) 2010-03-04
US20140216655A1 (en) 2014-08-07
ATE468344T1 (de) 2010-06-15

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]