BRPI0917176A2 - composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi - Google Patents

composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi

Info

Publication number
BRPI0917176A2
BRPI0917176A2 BRPI0917176A BRPI0917176A BRPI0917176A2 BR PI0917176 A2 BRPI0917176 A2 BR PI0917176A2 BR PI0917176 A BRPI0917176 A BR PI0917176A BR PI0917176 A BRPI0917176 A BR PI0917176A BR PI0917176 A2 BRPI0917176 A2 BR PI0917176A2
Authority
BR
Brazil
Prior art keywords
heat
resin compositions
epoxide resin
substrate
substrates
Prior art date
Application number
BRPI0917176A
Other languages
English (en)
Inventor
Andreas Kramer
Original Assignee
Sika Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Technology Ag filed Critical Sika Technology Ag
Publication of BRPI0917176A2 publication Critical patent/BRPI0917176A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0917176A 2008-08-27 2009-08-27 composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi BRPI0917176A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08163060A EP2161274B1 (de) 2008-08-27 2008-08-27 Silan-/Harnstoff-Verbindung als hitzeaktivierbarer Härter für Epoxidharzzusammensetzungen
PCT/EP2009/061027 WO2010023234A1 (de) 2008-08-27 2009-08-27 Silan/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen

Publications (1)

Publication Number Publication Date
BRPI0917176A2 true BRPI0917176A2 (pt) 2015-11-24

Family

ID=40266047

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0917176A BRPI0917176A2 (pt) 2008-08-27 2009-08-27 composto de silano / uréia como endurecedor ativável sob calor para composições de resinas epóxi

Country Status (9)

Country Link
US (2) US8728271B2 (pt)
EP (1) EP2161274B1 (pt)
JP (1) JP2012500879A (pt)
KR (1) KR20110057176A (pt)
CN (2) CN102131817B (pt)
AT (1) ATE468344T1 (pt)
BR (1) BRPI0917176A2 (pt)
DE (1) DE502008000690D1 (pt)
WO (1) WO2010023234A1 (pt)

Families Citing this family (13)

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US9263360B2 (en) * 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants
US20140249273A1 (en) * 2013-03-04 2014-09-04 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Silane end capped substituted urea resins and coatings thereof
CN106715577A (zh) 2014-07-08 2017-05-24 陶氏环球技术有限责任公司 延迟固化的高Tg碰撞耐用粘合剂
WO2016076193A1 (ja) * 2014-11-13 2016-05-19 横浜ゴム株式会社 硬化性樹脂組成物
PL3067375T3 (pl) * 2015-03-11 2018-01-31 Henkel Ag & Co Kgaa Sililowane poliuretany, ich wytwarzanie i zastosowanie
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
US9957438B2 (en) * 2016-01-26 2018-05-01 General Electric Company Compositions for, solutions for, and methods of use of siloxane based aromatic trisureas as viscosifiers
CN109096836B (zh) * 2018-07-09 2021-04-06 广州弗西林橡塑有限公司 一种氟橡胶组合物
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband
US20240010782A1 (en) * 2020-11-12 2024-01-11 Dic Corporation Curable composition, cured product, and adhesive
WO2023086852A1 (en) * 2021-11-11 2023-05-19 Ddp Specialty Electronic Materials Us, Llc Two-component polyurethane adhesive
CN113930132B (zh) * 2021-11-17 2022-10-21 芜湖跃兆生物科技有限公司 一种没食子酸修饰硅藻土改性环氧树脂漆和制备方法
CN118599086B (zh) * 2024-06-18 2025-01-28 东莞市亮雅塑料制品有限公司 一种高韧性复合tpu材料及其制备方法

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US3754971A (en) * 1968-09-12 1973-08-28 Union Carbide Corp Urea silicon product and uses thereof
FR2125244A1 (en) 1971-02-11 1972-09-29 Du Pont Epoxy resin compn
DE3864484D1 (de) 1987-08-26 1991-10-02 Ciba Geigy Ag Modifizierte epoxidharze.
EP0338985B1 (de) 1988-04-18 1994-05-18 Ciba-Geigy Ag Modifizierte Epoxidharze
ES2068911T3 (es) 1988-07-28 1995-05-01 Ciba Geigy Ag Combinaciones de flexibilizadores para resinas epoxi.
BR9405431A (pt) * 1993-06-21 1999-09-08 Atochem North America Elf Processos para reforçar um substrato de óxido quebradiço e um recipiente de vidro, para restaurar a resistência a um substrato de óxido quebradiço e para cicatrizar parcialmente ou complemente falhas em uma superfìcie, recipiente de óxido quebradiço revestido com silano e composição útil para revestir substratos de óxido quebradiço
US5530052A (en) 1995-04-03 1996-06-25 General Electric Company Layered minerals and compositions comprising the same
JP3664831B2 (ja) * 1997-01-28 2005-06-29 ジーイー東芝シリコーン株式会社 エマルジョン型シリコーン組成物およびエアバッグ
CN1297470A (zh) 1998-02-20 2001-05-30 范蒂科股份公司 亲有机物的页硅酸盐
US6322890B1 (en) 1998-03-30 2001-11-27 Wm. Marsh Rice University Supra-molecular alkylalumoxanes
DE19845607A1 (de) 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
TWI245791B (en) * 2000-03-31 2005-12-21 Hitachi Chemical Co Ltd Adhesive films, and semiconductor devices using the same
KR20020089439A (ko) 2000-04-10 2002-11-29 헨켈 코만디트게젤샤프트 아우프 악티엔 내충격성 에폭시 수지 조성물
EP1152019A1 (de) 2000-05-02 2001-11-07 Sika AG, vorm. Kaspar Winkler & Co. Thixotropiermittel
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
EP1431325A1 (de) 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
DE10324486A1 (de) * 2003-05-30 2004-12-16 Degussa Ag Verwendung von Harnstoff-Derivaten als Beschleuniger für Epoxidharze
EP2843022B1 (en) 2003-07-07 2020-12-16 Dow Global Technologies LLC Adhesive epoxy composition and process for applying it
EP1498441A1 (de) 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
CN100537689C (zh) * 2003-12-04 2009-09-09 旭化成电子材料株式会社 各向异性的导电粘合片材及连接结构体
EP1812512B1 (en) 2004-11-10 2010-01-06 Dow Global Technologies Inc. Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
US20090082486A1 (en) 2004-11-10 2009-03-26 Dow Chemical Technologies Inc. Amphiphilic block copolymer-toughened epoxy resins
DE502005010289D1 (de) * 2005-04-29 2010-11-04 Sika Technology Ag Organoalkoxysilane zur Verwendung in feuchtigkeitshärtenden Zusammensetzungen
DE602005020260D1 (de) 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
EP1741734A1 (de) * 2005-07-05 2007-01-10 Sika Technology AG Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen
EP1754721A1 (de) 2005-08-16 2007-02-21 Sika Technology AG Aminogruppen-terminierte Zähigkeitsverbesserer und deren Folgeprodukte und Verwendungen
KR101303246B1 (ko) 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
JP5307714B2 (ja) 2006-07-31 2013-10-02 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 硬化性エポキシ樹脂系粘着組成物
US7759435B2 (en) 2006-09-26 2010-07-20 Loctite (R&D) Limited Adducts and curable compositions using same
EP1916270A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Hitzehärtende Epoxidharzzusammensetzung mit blockiertem Polyurethanprepolymer
EP1916272A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Hitzehärtende Epoxidharzzusammensetzung enthaltend ein blockiertes und ein epoxidterminiertes Polyurethanprepolymer
EP1916269A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Blockierte Polyurethanprepolymere und hitzehärtende Epoxidharzzusammensetzungen
EP1916285A1 (de) 2006-10-24 2008-04-30 Sika Technology AG Derivatisiertes Epoxid-Festharz und dessen Verwendungen

Also Published As

Publication number Publication date
EP2161274A1 (de) 2010-03-10
US9284447B2 (en) 2016-03-15
US20140216655A1 (en) 2014-08-07
WO2010023234A1 (de) 2010-03-04
US20110155320A1 (en) 2011-06-30
EP2161274B1 (de) 2010-05-19
US8728271B2 (en) 2014-05-20
CN103524714A (zh) 2014-01-22
KR20110057176A (ko) 2011-05-31
DE502008000690D1 (de) 2010-07-01
CN103524714B (zh) 2016-04-06
ATE468344T1 (de) 2010-06-15
CN102131817B (zh) 2014-05-07
JP2012500879A (ja) 2012-01-12
CN102131817A (zh) 2011-07-20

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]