BRPI0918187A2 - materiais de interface térmica polimericos - Google Patents

materiais de interface térmica polimericos

Info

Publication number: BRPI0918187A2
Authority: BR; Brazil
Prior art keywords: thermal interface; interface materials; polymeric thermal; polymeric; materials
Prior art date: 2008-12-23

Application number

BRPI0918187A

Other languages

English (en)

Inventor

Ed Prack

Yi Li

Original Assignee

Intel Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-12-23

Filing date

2009-12-09

Publication date

2015-12-01

2009-12-09 Application filed by Intel Corp filed Critical Intel Corp

2015-12-01 Publication of BRPI0918187A2 publication Critical patent/BRPI0918187A2/pt

2019-05-07 Publication of BRPI0918187B1 publication Critical patent/BRPI0918187B1/pt

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Engineering & Computer Science (AREA)
Thermal Sciences (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Combustion & Propulsion (AREA)
Materials Engineering (AREA)
Compositions Of Macromolecular Compounds (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Paints Or Removers (AREA)
Nonmetallic Welding Materials (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Laminated Bodies (AREA)

BRPI0918187-3A 2008-12-23 2009-12-09 Materiais de interface térmica polimericos BRPI0918187B1 (pt)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US12/342,322 US8138239B2 (en)	2008-12-23	2008-12-23	Polymer thermal interface materials
US12/342,322		2008-12-23
PCT/US2009/067274 WO2010074970A2 (en)	2008-12-23	2009-12-09	Polymer thermal interface materials

Publications (2)

Publication Number	Publication Date
BRPI0918187A2 true BRPI0918187A2 (pt)	2015-12-01
BRPI0918187B1 BRPI0918187B1 (pt)	2019-05-07

Family

ID=42266562

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0918187-3A BRPI0918187B1 (pt)	2008-12-23	2009-12-09	Materiais de interface térmica polimericos

Country Status (10)

Country	Link
US (1)	US8138239B2 (pt)
JP (2)	JP5325987B2 (pt)
KR (1)	KR101280663B1 (pt)
CN (1)	CN102171310B (pt)
BR (1)	BRPI0918187B1 (pt)
DE (1)	DE112009002321B4 (pt)
GB (1)	GB2478209B (pt)
SG (1)	SG172367A1 (pt)
TW (1)	TWI420625B (pt)
WO (1)	WO2010074970A2 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5239768B2 (ja) *	2008-11-14	2013-07-17	富士通株式会社	放熱材料並びに電子機器及びその製造方法
US8138239B2 (en)	2008-12-23	2012-03-20	Intel Corporation	Polymer thermal interface materials
WO2011137360A1 (en) *	2010-04-30	2011-11-03	Indium Corporation	Thermal interface materials with good reliability
KR101931395B1 (ko)	2011-02-18	2018-12-20	쓰리엠 이노베이티브 프로퍼티즈 컴파니	가요성 발광 반도체 디바이스
WO2013076909A1 (ja) *	2011-11-21	2013-05-30	パナソニック株式会社	電気部品用樹脂、半導体装置、及び配線基板
US9063700B2 (en)	2012-08-31	2015-06-23	Apple Inc.	Low-force gap-filling conductive structures
KR101465616B1 (ko) *	2012-10-26	2014-11-27	엔트리움 주식회사	열 계면 물질(접착제) 및 이를 포함하는 반도체 칩 패키지
CN109830466B (zh) *	2013-08-12	2023-05-26	三星电子株式会社	热界面材料层及包括热界面材料层的层叠封装件器件
KR20160094385A (ko)	2013-12-05	2016-08-09	허니웰 인터내셔날 인코포레이티드	조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
TWI657132B (zh)	2013-12-19	2019-04-21	Henkel IP & Holding GmbH	具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
WO2015105204A1 (ko) *	2014-01-07	2015-07-16	엔트리움 주식회사	열 계면 물질 및 이를 포함하는 반도체 칩 패키지
US10155894B2 (en)	2014-07-07	2018-12-18	Honeywell International Inc.	Thermal interface material with ion scavenger
CN107250317A (zh)	2014-12-05	2017-10-13	霍尼韦尔国际公司	具有低热阻的高性能热界面材料
US10312177B2 (en)	2015-11-17	2019-06-04	Honeywell International Inc.	Thermal interface materials including a coloring agent
MX393621B (es)	2016-03-08	2025-03-24	Honeywell Int Inc	Material de camibo de fase.
US10501671B2 (en)	2016-07-26	2019-12-10	Honeywell International Inc.	Gel-type thermal interface material
US11041103B2 (en)	2017-09-08	2021-06-22	Honeywell International Inc.	Silicone-free thermal gel
US10428256B2 (en)	2017-10-23	2019-10-01	Honeywell International Inc.	Releasable thermal gel
US10567084B2 (en) *	2017-12-18	2020-02-18	Honeywell International Inc.	Thermal interface structure for optical transceiver modules
US11072706B2 (en)	2018-02-15	2021-07-27	Honeywell International Inc.	Gel-type thermal interface material
KR102152376B1 (ko) *	2018-09-11	2020-09-04	엔트리움 주식회사	방열 입자 및 이를 이용한 열 계면 물질
US11373921B2 (en)	2019-04-23	2022-06-28	Honeywell International Inc.	Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2854385C2 (de) *	1978-12-16	1982-04-15	Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt	Gedruckte Schaltung
US5738936A (en) *	1996-06-27	1998-04-14	W. L. Gore & Associates, Inc.	Thermally conductive polytetrafluoroethylene article
JP3746915B2 (ja)	1999-06-21	2006-02-22	富士通株式会社	高熱伝導性組成物
US6391442B1 (en) *	1999-07-08	2002-05-21	Saint-Gobain Performance Plastics Corporation	Phase change thermal interface material
US6673434B2 (en) *	1999-12-01	2004-01-06	Honeywell International, Inc.	Thermal interface materials
JP3928943B2 (ja) *	2002-07-03	2007-06-13	信越化学工業株式会社	放熱部材、その製造方法及びその敷設方法
US20030171487A1 (en) *	2002-03-11	2003-09-11	Tyco Electronics Corporation	Curable silicone gum thermal interface material
US6791839B2 (en) *	2002-06-25	2004-09-14	Dow Corning Corporation	Thermal interface materials and methods for their preparation and use
JP4017932B2 (ja) *	2002-07-22	2007-12-05	ポリマテック株式会社	熱伝導性高分子成形体の製造方法
JP2004241594A (ja) *	2003-02-05	2004-08-26	Sony Corp	半導体パッケージ
WO2004090938A2 (en) *	2003-04-02	2004-10-21	Honeywell International Inc.	Thermal interconnect and interface systems, methods of production and uses thereof
US7014093B2 (en) *	2003-06-26	2006-03-21	Intel Corporation	Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
JP4070714B2 (ja) *	2003-12-25	2008-04-02	電気化学工業株式会社	樹脂組成物及び相変化型熱伝導部材
CN100376655C (zh) *	2004-06-30	2008-03-26	鸿富锦精密工业（深圳）有限公司	热介面材料
CN101035876A (zh) *	2004-08-23	2007-09-12	莫门蒂夫性能材料股份有限公司	导热性组合物及其制备方法
EP1805256A1 (en) *	2004-10-28	2007-07-11	Dow Corning Corporation	Conductive curable compositions
US7545030B2 (en) *	2005-12-30	2009-06-09	Intel Corporation	Article having metal impregnated within carbon nanotube array
US20080023665A1 (en) *	2006-07-25	2008-01-31	Weiser Martin W	Thermal interconnect and interface materials, methods of production and uses thereof
US8138239B2 (en)	2008-12-23	2012-03-20	Intel Corporation	Polymer thermal interface materials

2008
- 2008-12-23 US US12/342,322 patent/US8138239B2/en active Active
2009
- 2009-12-09 GB GB1105363.4A patent/GB2478209B/en active Active
- 2009-12-09 WO PCT/US2009/067274 patent/WO2010074970A2/en not_active Ceased
- 2009-12-09 CN CN200980139735.XA patent/CN102171310B/zh active Active
- 2009-12-09 DE DE112009002321.5T patent/DE112009002321B4/de active Active
- 2009-12-09 KR KR1020117007593A patent/KR101280663B1/ko active Active
- 2009-12-09 BR BRPI0918187-3A patent/BRPI0918187B1/pt not_active IP Right Cessation
- 2009-12-09 JP JP2011531273A patent/JP5325987B2/ja active Active
- 2009-12-09 SG SG2011046414A patent/SG172367A1/en unknown
- 2009-12-11 TW TW098142489A patent/TWI420625B/zh active
2013
- 2013-07-22 JP JP2013151959A patent/JP5837007B2/ja active Active

Also Published As

Publication number	Publication date
GB2478209A (en)	2011-08-31
CN102171310A (zh)	2011-08-31
TWI420625B (zh)	2013-12-21
SG172367A1 (en)	2011-07-28
GB2478209B (en)	2014-07-23
CN102171310B (zh)	2014-10-29
US8138239B2 (en)	2012-03-20
KR20110059748A (ko)	2011-06-03
JP2012505299A (ja)	2012-03-01
TW201029124A (en)	2010-08-01
WO2010074970A2 (en)	2010-07-01
DE112009002321T5 (de)	2012-04-05
JP5837007B2 (ja)	2015-12-24
KR101280663B1 (ko)	2013-07-01
DE112009002321B4 (de)	2018-03-01
JP5325987B2 (ja)	2013-10-23
GB201105363D0 (en)	2011-05-11
WO2010074970A3 (en)	2010-09-16
BRPI0918187B1 (pt)	2019-05-07
JP2013224445A (ja)	2013-10-31
US20100159233A1 (en)	2010-06-24

Legal Events

Date	Code	Title	Description
2018-10-09	B07A	Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
2019-03-12	B09A	Decision: intention to grant [chapter 9.1 patent gazette]
2019-05-07	B16A	Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]	Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/12/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/12/2009, OBSERVADAS AS CONDICOES LEGAIS
2020-12-22	B21F	Lapse acc. art. 78, item iv - on non-payment of the annual fees in time	Free format text: REFERENTE A 11A ANUIDADE.
2021-04-13	B24J	Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)	Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2607 DE 22-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

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GB2478209B (en)	2014-07-23	Polymer thermal interface materials
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