BRPI0918292A2 - computador robusto capaz de operar em ambientes de alta temperatura - Google Patents

computador robusto capaz de operar em ambientes de alta temperatura

Info

Publication number
BRPI0918292A2
BRPI0918292A2 BRPI0918292A BRPI0918292A BRPI0918292A2 BR PI0918292 A2 BRPI0918292 A2 BR PI0918292A2 BR PI0918292 A BRPI0918292 A BR PI0918292A BR PI0918292 A BRPI0918292 A BR PI0918292A BR PI0918292 A2 BRPI0918292 A2 BR PI0918292A2
Authority
BR
Brazil
Prior art keywords
operating
high temperature
temperature environments
computer capable
rugged computer
Prior art date
Application number
BRPI0918292A
Other languages
English (en)
Inventor
Andrew J Ornatowski
Casey R Adkins
Charles A Abare
Original Assignee
Intergraph Technologies Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intergraph Technologies Co filed Critical Intergraph Technologies Co
Publication of BRPI0918292A2 publication Critical patent/BRPI0918292A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BRPI0918292A 2008-09-08 2009-09-08 computador robusto capaz de operar em ambientes de alta temperatura BRPI0918292A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9524308P 2008-09-08 2008-09-08
PCT/US2009/056204 WO2010028350A1 (en) 2008-09-08 2009-09-08 Ruggedized computer capable of operating in high-temperature environments

Publications (1)

Publication Number Publication Date
BRPI0918292A2 true BRPI0918292A2 (pt) 2015-12-22

Family

ID=41323536

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0918292A BRPI0918292A2 (pt) 2008-09-08 2009-09-08 computador robusto capaz de operar em ambientes de alta temperatura

Country Status (3)

Country Link
US (2) US8031464B2 (pt)
BR (1) BRPI0918292A2 (pt)
WO (1) WO2010028350A1 (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8289714B2 (en) * 2008-01-04 2012-10-16 APlus Mobile Inc. Ruggedized computer and aspects thereof
KR100934124B1 (ko) * 2008-12-26 2009-12-29 에이스트로닉스 주식회사 분진 방지 및 진동에 강한 산업용 컴퓨터
GB2474248B (en) * 2009-10-07 2015-05-13 Ibex Uk Ltd Heating apparatus
WO2011100297A2 (en) * 2010-02-09 2011-08-18 Cambridge Engineering, Inc. Device for indicating eradication of a pest infestation
FR2958766B1 (fr) * 2010-04-13 2021-07-09 Thales Sa Dispositif transportable pour enregistrer des donnees de vol.
TW201144994A (en) * 2010-06-15 2011-12-16 Hon Hai Prec Ind Co Ltd Server and server system
US8644020B2 (en) 2010-12-01 2014-02-04 Google Inc. Cooling heat-generating electronics
US9046906B1 (en) 2012-02-10 2015-06-02 APlus Mobile Inc. Highly survivable and rugged computer assembly
TWI482584B (zh) * 2012-05-03 2015-04-21 Wistron Corp 易拆裝的電磁屏蔽裝置
DE102012106192B4 (de) * 2012-07-10 2014-09-11 Fujitsu Technology Solutions Intellectual Property Gmbh Computersystem und Gehäuse für ein Computersystem
US8988880B2 (en) * 2012-09-19 2015-03-24 Ge Intelligent Platforms, Inc. Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
US11006548B2 (en) * 2013-02-01 2021-05-11 Smart Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
US20140268553A1 (en) * 2013-03-15 2014-09-18 Silicon Graphics International Corp. System for cooling multiple in-line central processing units in a confined enclosure
US9538687B2 (en) 2013-06-12 2017-01-03 Menara Network, Inc. High-density rack unit systems and methods
US9398731B1 (en) 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
US9596772B2 (en) 2015-01-15 2017-03-14 Dell Products L.P. Stackable switch cooling system
WO2016164417A1 (en) * 2015-04-10 2016-10-13 Phoenix Contact Development and Manufacturing, Inc. Enclosure with multiple heat dissipating surfaces
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US10462935B2 (en) 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
US9603289B1 (en) * 2016-01-14 2017-03-21 Ciena Corporation Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
EP3301710A1 (de) * 2016-09-29 2018-04-04 Siemens Aktiengesellschaft Wärmeleitender isolator
US11832400B2 (en) 2020-06-23 2023-11-28 Terra Ferma, Llc Ruggedized programmable power switch
US12225692B2 (en) * 2021-03-04 2025-02-11 Te Connectivity Solutions Gmbh Heat exchange assembly for an electrical device

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046193A (en) * 1976-02-18 1977-09-06 Westinghouse Electric Corporation Closed electrical apparatus cabinet embodying a vaporization chamber and cabinet top thereof
US4642715A (en) * 1984-11-01 1987-02-10 Miltope Corporation Environmental conditioning and safety system for disk-type mass memories
US5243493A (en) * 1992-04-29 1993-09-07 Industrial Technology Research Institute Fanless convection cooling design for personal computers
US5455739A (en) * 1994-04-05 1995-10-03 Alcatel Network Systems, Inc. Assembly for transferring heat from heat generating components to a surrounding housing
US5570270A (en) * 1994-06-03 1996-10-29 Pulse Electronics, Inc. Chassis and personal computer for severe environment embedded applications
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
JP3518242B2 (ja) * 1997-04-14 2004-04-12 株式会社日立製作所 電子装置
EP0917418B1 (en) * 1997-11-11 2003-09-17 Lucent Technologies Inc. Electronic apparatus
DE69802659T2 (de) * 1998-01-27 2002-08-22 Lucent Technologies Inc., Murray Hill Elektronisches Gerät
EP0954210A1 (en) * 1998-04-28 1999-11-03 Lucent Technologies Inc. Cooling electronic apparatus
US6434000B1 (en) * 1998-12-03 2002-08-13 Iv Phoenix Group, Inc. Environmental system for rugged disk drive
US6289678B1 (en) * 1998-12-03 2001-09-18 Phoenix Group, Inc. Environmental system for rugged disk drive
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6209631B1 (en) * 1999-07-23 2001-04-03 Esco Electronics Corporation Thermal management apparatus for a sealed enclosure
US6252726B1 (en) * 1999-09-02 2001-06-26 Lightlogic, Inc. Dual-enclosure optoelectronic packages
US7301776B1 (en) * 2004-11-16 2007-11-27 Super Talent Electronics, Inc. Light-weight flash hard drive with plastic frame
JP2002100892A (ja) * 2000-09-25 2002-04-05 Hitachi Ltd 密閉型電子機器筐体
US6407911B1 (en) * 2000-10-10 2002-06-18 Juniper Systems, Inc. Sealed portable electronics device having expansion port
US6628521B2 (en) * 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
NL1017301C2 (nl) * 2001-01-12 2002-07-15 Koninkl Kpn Nv Werkwijze en systeem voor efficiÙnte verspreiding van informatie.
AU2002306161A1 (en) * 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
US6765793B2 (en) * 2002-08-30 2004-07-20 Themis Corporation Ruggedized electronics enclosure
FR2845821B1 (fr) * 2002-10-11 2005-12-02 Thales Sa Substrat electronique d'un module electronique a trois dimensions a fort pouvoir de dissipation thermique et module electronique
US20040218362A1 (en) * 2003-02-19 2004-11-04 Amaro Allen J. System and apparatus for heat removal
DE10311526A1 (de) * 2003-03-17 2004-09-30 Richard Wöhr GmbH Modulares Gehäusesystem für lüfterlose Display-Computer mit Wärmerohr und mit direktem im Gehäuse integriertem Mehrschichtenkühlsystem
US6798661B1 (en) * 2003-05-08 2004-09-28 Hewlett-Packard Development Company, L.P. Chassis conducted cooling thermal dissipation apparatus for servers
WO2004102304A2 (en) * 2003-05-13 2004-11-25 Zalman Tech Co., Ltd. Computer
TW200506586A (en) * 2003-08-07 2005-02-16 Wincomm Corp Fanless heat sink for computer equipment
US7747787B2 (en) * 2003-09-12 2010-06-29 Logic Controls, Inc. Hybrid industrial networked computer system
US20050060444A1 (en) * 2003-09-12 2005-03-17 Logic Controls, Inc Rugged computing module
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7133284B2 (en) * 2003-10-16 2006-11-07 Etasis Electronics Corporation Power supply without cooling fan
US20050168941A1 (en) * 2003-10-22 2005-08-04 Sokol John L. System and apparatus for heat removal
JP4408224B2 (ja) * 2004-01-29 2010-02-03 富士通株式会社 放熱機能を有する筐体
TWM261977U (en) * 2004-06-23 2005-04-11 Via Tech Inc A modular dissipation assembling structure for PCB
US7072179B1 (en) * 2004-09-10 2006-07-04 Micro Industries Corporation Fanless computer with integrated display
KR100624092B1 (ko) * 2004-09-16 2006-09-18 잘만테크 주식회사 컴퓨터
US7277282B2 (en) * 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
DE102005014534A1 (de) * 2005-03-30 2006-10-05 Hush Technologies Investments Ltd. Gehäuse für einen Computer
TWM279164U (en) 2005-05-31 2005-10-21 Atio System Inc Electronic device with heat-dissipating casing
KR100683412B1 (ko) * 2005-06-11 2007-02-20 삼성전자주식회사 컴퓨터
US7719828B2 (en) * 2005-09-14 2010-05-18 Lockheed Martin Corporation Rugged hard disk drive storage assembly
US7365982B2 (en) * 2005-11-01 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Liquid cooling device
US7295436B2 (en) * 2005-12-10 2007-11-13 Kioan Cheon Cooling system for computer components
CN101072482A (zh) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 散热装置及使用该散热装置的散热系统
US7309291B1 (en) * 2006-05-31 2007-12-18 Karsten Manufacturing Corporation Golf club head with alignment indicia
CN101257781A (zh) * 2007-03-01 2008-09-03 鸿富锦精密工业（深圳）有限公司 电子设备及散热器
US7457123B1 (en) * 2007-05-10 2008-11-25 Adc Telecommunications, Inc. Chassis mounted heat sink system
US7845395B2 (en) * 2007-07-02 2010-12-07 Cooler Master Co., Ltd. Heat-dissipating casing structure

Also Published As

Publication number Publication date
WO2010028350A1 (en) 2010-03-11
US20100061053A1 (en) 2010-03-11
US8031464B2 (en) 2011-10-04
US20110304980A1 (en) 2011-12-15
US8654523B2 (en) 2014-02-18

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]