BRPI0919056A2 - elemento magnético utilizando passivação de parede lateral protetora - Google Patents
elemento magnético utilizando passivação de parede lateral protetoraInfo
- Publication number
- BRPI0919056A2 BRPI0919056A2 BRPI0919056A BRPI0919056A BRPI0919056A2 BR PI0919056 A2 BRPI0919056 A2 BR PI0919056A2 BR PI0919056 A BRPI0919056 A BR PI0919056A BR PI0919056 A BRPI0919056 A BR PI0919056A BR PI0919056 A2 BRPI0919056 A2 BR PI0919056A2
- Authority
- BR
- Brazil
- Prior art keywords
- side wall
- magnetic element
- protective side
- wall passivation
- passivation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/236,943 | 2008-09-24 | ||
| US12/236,943 US8482966B2 (en) | 2008-09-24 | 2008-09-24 | Magnetic element utilizing protective sidewall passivation |
| PCT/US2009/057523 WO2010036581A1 (en) | 2008-09-24 | 2009-09-18 | Magnetic element utilizing protective sidewall passivation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0919056A2 true BRPI0919056A2 (pt) | 2018-01-09 |
| BRPI0919056B1 BRPI0919056B1 (pt) | 2019-09-17 |
Family
ID=41397538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0919056-2A BRPI0919056B1 (pt) | 2008-09-24 | 2009-09-18 | Elemento magnético utilizando passivação de parede lateral protetora |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8482966B2 (pt) |
| EP (1) | EP2342767B1 (pt) |
| JP (1) | JP5415543B2 (pt) |
| KR (1) | KR101331511B1 (pt) |
| CN (1) | CN102160204B (pt) |
| BR (1) | BRPI0919056B1 (pt) |
| ES (1) | ES2397820T3 (pt) |
| TW (1) | TWI395356B (pt) |
| WO (1) | WO2010036581A1 (pt) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8390283B2 (en) | 2009-09-25 | 2013-03-05 | Everspin Technologies, Inc. | Three axis magnetic field sensor |
| US8518734B2 (en) | 2010-03-31 | 2013-08-27 | Everspin Technologies, Inc. | Process integration of a single chip three axis magnetic field sensor |
| US9300301B2 (en) | 2010-10-05 | 2016-03-29 | Carnegie Mellon University | Nonvolatile magnetic logic device |
| US8644055B2 (en) | 2010-12-09 | 2014-02-04 | Infineon Technologies Ag | Nonvolatile memory with enhanced efficiency to address asymetric NVM cells |
| US8557610B2 (en) | 2011-02-14 | 2013-10-15 | Qualcomm Incorporated | Methods of integrated shielding into MTJ device for MRAM |
| US9082956B2 (en) | 2011-04-04 | 2015-07-14 | Micron Technology, Inc. | Confined cell structures and methods of forming confined cell structures |
| JP2013021108A (ja) * | 2011-07-11 | 2013-01-31 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
| US8921959B2 (en) | 2011-07-26 | 2014-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM device and fabrication method thereof |
| CN103107281B (zh) | 2011-11-15 | 2015-04-08 | 中芯国际集成电路制造(北京)有限公司 | 半导体器件及其制造方法 |
| US20140061827A1 (en) * | 2012-08-29 | 2014-03-06 | Headway Technologies, Inc. | Metal Protection Layer over SiN Encapsulation for Spin-Torque MRAM Device Applications |
| US9093149B2 (en) * | 2012-09-04 | 2015-07-28 | Qualcomm Incorporated | Low cost programmable multi-state device |
| US8901687B2 (en) | 2012-11-27 | 2014-12-02 | Industrial Technology Research Institute | Magnetic device with a substrate, a sensing block and a repair layer |
| US9172033B2 (en) | 2013-07-03 | 2015-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM device and fabrication method thereof |
| US9564403B2 (en) * | 2013-09-27 | 2017-02-07 | Infineon Technologies Ag | Magnetic shielding of perpendicular STT-MRAM |
| KR102084726B1 (ko) | 2013-11-05 | 2020-03-04 | 삼성전자주식회사 | 반도체 소자 |
| KR102214798B1 (ko) | 2014-02-05 | 2021-02-10 | 삼성전자주식회사 | 패키지 기판 및 이를 포함하는 반도체 패키지 |
| KR102245262B1 (ko) * | 2014-07-16 | 2021-04-28 | 한양대학교 산학협력단 | 보호막을 갖는 mtj 셀 및 그 제작 방법 |
| US9673388B2 (en) * | 2014-10-20 | 2017-06-06 | Globalfoundries Singapore Pte. Ltd. | Integrated circuit structures with spin torque transfer magnetic random access memory and methods for fabricating the same |
| KR101663958B1 (ko) | 2014-12-08 | 2016-10-12 | 삼성전자주식회사 | 자기 메모리 소자의 제조방법 |
| US9923137B2 (en) * | 2015-03-05 | 2018-03-20 | Globalfoundries Singapore Pte. Ltd. | Magnetic memory with tunneling magnetoresistance enhanced spacer layer |
| US10128309B2 (en) | 2015-03-27 | 2018-11-13 | Globalfoundries Singapore Pte. Ltd. | Storage layer for magnetic memory with high thermal stability |
| US9502642B2 (en) * | 2015-04-10 | 2016-11-22 | Micron Technology, Inc. | Magnetic tunnel junctions, methods used while forming magnetic tunnel junctions, and methods of forming magnetic tunnel junctions |
| US9847473B2 (en) * | 2015-04-16 | 2017-12-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | MRAM structure for process damage minimization |
| WO2016174509A1 (en) * | 2015-04-27 | 2016-11-03 | Kabushiki Kaisha Toshiba | Magnetic memory device |
| US9960346B2 (en) | 2015-05-07 | 2018-05-01 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US10043852B2 (en) * | 2015-08-11 | 2018-08-07 | Toshiba Memory Corporation | Magnetoresistive memory device and manufacturing method of the same |
| KR102395997B1 (ko) | 2015-09-30 | 2022-05-10 | 삼성전자주식회사 | 자기 저항 메모리 소자 및 그 제조 방법 |
| US10297745B2 (en) | 2015-11-02 | 2019-05-21 | Globalfoundries Singapore Pte. Ltd. | Composite spacer layer for magnetoresistive memory |
| US10270025B2 (en) * | 2015-12-31 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure having magnetic tunneling junction (MTJ) layer |
| US10312432B2 (en) * | 2016-04-06 | 2019-06-04 | Varian Semiconductor Equipment Associates, Inc. | Magnetic memory device and techniques for forming |
| US9680089B1 (en) | 2016-05-13 | 2017-06-13 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US9786343B1 (en) * | 2016-08-30 | 2017-10-10 | International Business Machines Corporation | STT MRAM common source line array bias scheme |
| US9985199B1 (en) * | 2017-03-15 | 2018-05-29 | International Business Machines Corporation | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield |
| US10439132B2 (en) | 2017-03-20 | 2019-10-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protective passivation layer for magnetic tunnel junctions |
| WO2018182697A1 (en) * | 2017-03-31 | 2018-10-04 | Intel Corporation | Magnetic tunnel junction (mtj) devices with a sidewall passivation layer and methods to for the same |
| US9935261B1 (en) | 2017-04-05 | 2018-04-03 | Headway Technologies, Inc. | Dielectric encapsulation layer for magnetic tunnel junction (MTJ) devices using radio frequency (RF) sputtering |
| US10516100B2 (en) | 2017-06-12 | 2019-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Silicon oxynitride based encapsulation layer for magnetic tunnel junctions |
| US10038138B1 (en) | 2017-10-10 | 2018-07-31 | Headway Technologies, Inc. | High temperature volatilization of sidewall materials from patterned magnetic tunnel junctions |
| US10439129B2 (en) * | 2018-01-18 | 2019-10-08 | Globalfoundries Inc. | Shielded MRAM cell |
| US10374154B1 (en) | 2018-01-18 | 2019-08-06 | Globalfoundries Inc. | Methods of shielding an embedded MRAM array on an integrated circuit product comprising CMOS based transistors |
| US11139341B2 (en) | 2018-06-18 | 2021-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protection of MRAM from external magnetic field using magnetic-field-shielding structure |
| US11088083B2 (en) | 2018-06-29 | 2021-08-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure |
| US10522752B1 (en) | 2018-08-22 | 2019-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetic layer for magnetic random access memory (MRAM) by moment enhancement |
| US11043251B2 (en) * | 2018-11-30 | 2021-06-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetic tunnel junction device and method of forming same |
| CN111435703B (zh) | 2019-01-14 | 2024-03-22 | 联华电子股份有限公司 | 磁隧穿结装置及其形成方法 |
| US11165017B2 (en) * | 2019-03-15 | 2021-11-02 | International Business Machines Corporation | Replacement bottom electrode structure process to form misalignment tolerate MRAM with high yield |
| CN111969103B (zh) | 2019-05-20 | 2023-10-10 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| TWI815948B (zh) | 2019-08-14 | 2023-09-21 | 聯華電子股份有限公司 | 半導體元件及其製作方法 |
| CN114695431B (zh) * | 2020-12-28 | 2025-09-26 | 浙江驰拓科技有限公司 | 一种半导体器件 |
| US12178137B2 (en) | 2021-07-30 | 2024-12-24 | International Business Machines Corporation | In-array magnetic shield for spin-transfer torque magneto-resistive random access memory |
| US12575332B2 (en) | 2022-10-08 | 2026-03-10 | International Business Machines Corporation | CoFeB based magnetic tunnel junction device with boron encapsulation layer |
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| JP3558996B2 (ja) * | 2001-03-30 | 2004-08-25 | 株式会社東芝 | 磁気抵抗効果素子、磁気ヘッド、磁気再生装置及び磁気記憶装置 |
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| TW569442B (en) * | 2001-12-18 | 2004-01-01 | Toshiba Corp | Magnetic memory device having magnetic shield layer, and manufacturing method thereof |
| JP2003243630A (ja) * | 2002-02-18 | 2003-08-29 | Sony Corp | 磁気メモリ装置およびその製造方法 |
| US6714444B2 (en) * | 2002-08-06 | 2004-03-30 | Grandis, Inc. | Magnetic element utilizing spin transfer and an MRAM device using the magnetic element |
| US6888742B1 (en) * | 2002-08-28 | 2005-05-03 | Grandis, Inc. | Off-axis pinned layer magnetic element utilizing spin transfer and an MRAM device using the magnetic element |
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| JP4008857B2 (ja) * | 2003-03-24 | 2007-11-14 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
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| ATE405950T1 (de) * | 2003-06-24 | 2008-09-15 | Ibm | Selbstausgerichtete leitfähige linien für magnetische direktzugriffsspeicherbausteine auf fet-basis und herstellungsverfahren dafür |
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| US7978439B2 (en) * | 2007-06-19 | 2011-07-12 | Headway Technologies, Inc. | TMR or CPP structure with improved exchange properties |
| US7750421B2 (en) * | 2007-07-23 | 2010-07-06 | Magic Technologies, Inc. | High performance MTJ element for STT-RAM and method for making the same |
| US7936027B2 (en) * | 2008-01-07 | 2011-05-03 | Magic Technologies, Inc. | Method of MRAM fabrication with zero electrical shorting |
| US7948044B2 (en) * | 2008-04-09 | 2011-05-24 | Magic Technologies, Inc. | Low switching current MTJ element for ultra-high STT-RAM and a method for making the same |
| US9159910B2 (en) * | 2008-04-21 | 2015-10-13 | Qualcomm Incorporated | One-mask MTJ integration for STT MRAM |
-
2008
- 2008-09-24 US US12/236,943 patent/US8482966B2/en active Active
-
2009
- 2009-09-18 ES ES09792722T patent/ES2397820T3/es active Active
- 2009-09-18 JP JP2011529132A patent/JP5415543B2/ja active Active
- 2009-09-18 CN CN200980136770.6A patent/CN102160204B/zh active Active
- 2009-09-18 EP EP09792722A patent/EP2342767B1/en active Active
- 2009-09-18 BR BRPI0919056-2A patent/BRPI0919056B1/pt active IP Right Grant
- 2009-09-18 WO PCT/US2009/057523 patent/WO2010036581A1/en not_active Ceased
- 2009-09-18 KR KR1020117009270A patent/KR101331511B1/ko active Active
- 2009-09-24 TW TW098132346A patent/TWI395356B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201029238A (en) | 2010-08-01 |
| TWI395356B (zh) | 2013-05-01 |
| WO2010036581A1 (en) | 2010-04-01 |
| KR101331511B1 (ko) | 2013-11-20 |
| CN102160204A (zh) | 2011-08-17 |
| US8482966B2 (en) | 2013-07-09 |
| EP2342767B1 (en) | 2012-11-21 |
| BRPI0919056B1 (pt) | 2019-09-17 |
| KR20110074559A (ko) | 2011-06-30 |
| EP2342767A1 (en) | 2011-07-13 |
| JP2012503885A (ja) | 2012-02-09 |
| ES2397820T3 (es) | 2013-03-11 |
| JP5415543B2 (ja) | 2014-02-12 |
| US20100072566A1 (en) | 2010-03-25 |
| CN102160204B (zh) | 2014-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B15K | Others concerning applications: alteration of classification |
Free format text: A CLASSIFICACAO ANTERIOR ERA: H01L 43/08 Ipc: G01R 33/09 (1980.01), H01L 43/08 (1974.07) |
|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 18/09/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 18/09/2009, OBSERVADAS AS CONDICOES LEGAIS |