BRPI0919776A2 - sistema , composição de resina, método para fabricar um objeto tridimensional, e, artigo curado - Google Patents

sistema , composição de resina, método para fabricar um objeto tridimensional, e, artigo curado

Info

Publication number
BRPI0919776A2
BRPI0919776A2 BRPI0919776A BRPI0919776A BRPI0919776A2 BR PI0919776 A2 BRPI0919776 A2 BR PI0919776A2 BR PI0919776 A BRPI0919776 A BR PI0919776A BR PI0919776 A BRPI0919776 A BR PI0919776A BR PI0919776 A2 BRPI0919776 A2 BR PI0919776A2
Authority
BR
Brazil
Prior art keywords
manufacturing
resin composition
dimensional object
cured article
cured
Prior art date
Application number
BRPI0919776A
Other languages
English (en)
Inventor
Beat Dobler
Carole Chapelat
Jean-Jacques Lagref
Michael Rhodes
Ranjana C Patel
Richard Frantz
Zoubair M Cherkaoui
Original Assignee
Huntsman Adv Mat Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Adv Mat Switzerland filed Critical Huntsman Adv Mat Switzerland
Publication of BRPI0919776A2 publication Critical patent/BRPI0919776A2/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
BRPI0919776A 2008-10-17 2009-09-15 sistema , composição de resina, método para fabricar um objeto tridimensional, e, artigo curado BRPI0919776A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08018228 2008-10-17
PCT/EP2008/066634 WO2010043274A1 (en) 2008-10-17 2008-12-02 Improvements for rapid prototyping apparatus
PCT/EP2009/061958 WO2010043463A1 (en) 2008-10-17 2009-09-15 System and resin for rapid prototyping

Publications (1)

Publication Number Publication Date
BRPI0919776A2 true BRPI0919776A2 (pt) 2015-12-08

Family

ID=41040579

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI0919776A BRPI0919776A2 (pt) 2008-10-17 2009-09-15 sistema , composição de resina, método para fabricar um objeto tridimensional, e, artigo curado
BRPI0920292A BRPI0920292A2 (pt) 2008-10-17 2009-10-09 aparelho para produzir um objeto tridimensional, uso de uma resina fotocurável, método para curar uma composição fotocurável, e, objeto tridimensional

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRPI0920292A BRPI0920292A2 (pt) 2008-10-17 2009-10-09 aparelho para produzir um objeto tridimensional, uso de uma resina fotocurável, método para curar uma composição fotocurável, e, objeto tridimensional

Country Status (11)

Country Link
US (2) US20110195237A1 (pt)
EP (2) EP2346672A1 (pt)
JP (2) JP2012505775A (pt)
KR (2) KR20110084494A (pt)
CN (2) CN102186650A (pt)
AU (2) AU2009304209A1 (pt)
BR (2) BRPI0919776A2 (pt)
CA (2) CA2740922A1 (pt)
MX (2) MX2011003895A (pt)
RU (2) RU2011119609A (pt)
WO (3) WO2010043274A1 (pt)

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EP2436510A1 (en) * 2010-10-04 2012-04-04 3D Systems, Inc. System and resin for rapid prototyping
US9157007B2 (en) * 2011-03-09 2015-10-13 3D Systems, Incorporated Build material and applications thereof
WO2012126695A1 (en) 2011-03-23 2012-09-27 Huntsman Advanced Materials (Switzerland) Gmbh Stable curable thiol-ene composition
EP2537665A1 (en) * 2011-06-22 2012-12-26 3D Systems, Inc. Improvements for rapid prototyping apparatus and method
EP3078482B1 (en) * 2013-12-03 2019-05-22 Prismlab China Ltd. Photo-curing 3d printing device and imaging system thereof
MX2016010901A (es) * 2014-02-28 2016-11-18 Maurizio Costabeber Ettore Maquina de estereolitografia mejorada.
DE102014203710B3 (de) * 2014-02-28 2015-05-28 MTU Aero Engines AG Vorrichtung und Verfahren zum generativen Herstellen eines Bauteils
CN106553339A (zh) * 2015-09-18 2017-04-05 广东汉邦激光科技有限公司 3d打印基板智能调平系统及3d打印机
DE102015221623A1 (de) * 2015-11-04 2017-05-04 Eos Gmbh Electro Optical Systems Belichteroptik und Vorrichtung zum Herstellen eines dreidimensionalen Objekts
US10976703B2 (en) * 2015-12-30 2021-04-13 Dualitas Ltd Dynamic holography focused depth printing device
US11850791B2 (en) 2016-01-20 2023-12-26 Hewlett-Packard Development Company, L.P. Printing devices
US10899072B2 (en) 2016-03-15 2021-01-26 Adaptive 3D Technologies Thiourethane polymers, method of synthesis thereof and use in additive manufacturing technologies
US10457033B2 (en) 2016-11-07 2019-10-29 The Boeing Company Systems and methods for additively manufacturing composite parts
US11440261B2 (en) 2016-11-08 2022-09-13 The Boeing Company Systems and methods for thermal control of additive manufacturing
US10766241B2 (en) 2016-11-18 2020-09-08 The Boeing Company Systems and methods for additive manufacturing
US10843452B2 (en) * 2016-12-01 2020-11-24 The Boeing Company Systems and methods for cure control of additive manufacturing
DE102017223223A1 (de) * 2017-12-19 2019-06-19 Siemens Aktiengesellschaft Verfahren für den additiven Aufbau einer Struktur und Computerprogrammprodukt
WO2019169211A1 (en) * 2018-03-02 2019-09-06 Formlabs, Inc. Latent cure resins and related methods
MX2020010168A (es) * 2018-03-28 2021-03-09 Benjamin Lund Polímeros de triol-acrilato, métodos de síntesis de los mismos y uso en tecnologías de fabricación por adición.
JP7048723B2 (ja) * 2018-03-29 2022-04-05 富士フイルム株式会社 感光性転写材料、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法
US11780166B2 (en) 2018-04-10 2023-10-10 Hewlett-Packard Development Company, L.P. Preheat build materials with preheating sources
EP3781375A4 (en) 2018-04-20 2021-09-29 Benjamin Lund SEALED ISOCYANATE
US11739177B2 (en) 2018-04-20 2023-08-29 Adaptive 3D Technologies Sealed isocyanates
CN110539481A (zh) * 2018-05-28 2019-12-06 三纬国际立体列印科技股份有限公司 立体打印方法
US11426818B2 (en) 2018-08-10 2022-08-30 The Research Foundation for the State University Additive manufacturing processes and additively manufactured products
AU2019360258A1 (en) 2018-10-19 2021-06-10 The Regents Of The University Of California Photocurable resin composition, photocurable resin article, and methods of fabricating the article
US11911956B2 (en) 2018-11-21 2024-02-27 Adaptive 3D Technologies Using occluding fluids to augment additive manufacturing processes
CN111902258B (zh) * 2019-01-04 2022-07-15 卡本有限公司 具有哑光饰面的增材制造的产品
CN109795105B (zh) * 2019-02-27 2022-11-18 深圳摩方新材科技有限公司 三维打印装置及打印方法
WO2020210101A1 (en) * 2019-04-12 2020-10-15 3D Systems, Inc. Large array stereolithography with efficient optical path
US11666988B2 (en) * 2019-07-22 2023-06-06 Hamilton Sundstrand Corporation Additive manufacturing machine condensate monitoring
CN110658071B (zh) * 2019-10-09 2020-06-26 北京化工大学 一种动态测试光聚合模塑成型收缩演化的装置及方法
EP4091578B1 (en) * 2020-03-17 2024-10-09 Tokuyama Dental Corporation Method for producing plate denture
JP7425640B2 (ja) * 2020-03-25 2024-01-31 株式会社Ｓｃｒｅｅｎホールディングス ３次元造形装置
US11872760B2 (en) * 2020-10-29 2024-01-16 Seurat Technologies, Inc. Distributed flux array
US20230265311A1 (en) * 2021-11-24 2023-08-24 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Cure-on-Demand Coatings
US12409496B2 (en) 2022-04-27 2025-09-09 The Boeing Company Pre-heating methods for performing electron beam powder bed fusion
US12485621B2 (en) 2022-08-25 2025-12-02 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods
US12343933B2 (en) 2022-08-25 2025-07-01 The Boeing Company Methods of additively manufacturing a manufactured component and systems that perform the methods

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Also Published As

Publication number Publication date
EP2346671A1 (en) 2011-07-27
AU2009305465A1 (en) 2010-04-22
WO2010043559A1 (en) 2010-04-22
MX2011003895A (es) 2011-05-25
RU2011119605A (ru) 2012-11-27
CA2740922A1 (en) 2010-04-22
EP2346672A1 (en) 2011-07-27
US20110195237A1 (en) 2011-08-11
WO2010043463A1 (en) 2010-04-22
JP2012505775A (ja) 2012-03-08
MX2011004035A (es) 2011-05-19
WO2010043274A1 (en) 2010-04-22
CA2734969A1 (en) 2010-04-22
KR20110085967A (ko) 2011-07-27
CN102186649A (zh) 2011-09-14
KR20110084494A (ko) 2011-07-25
BRPI0920292A2 (pt) 2016-02-16
JP2012505776A (ja) 2012-03-08
CN102186650A (zh) 2011-09-14
AU2009304209A2 (en) 2011-03-31
RU2011119609A (ru) 2012-11-27
AU2009304209A1 (en) 2010-04-22
US20120298886A1 (en) 2012-11-29

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A E 6A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2370 DE 07-06-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.