BRPI0920322A2 - armação guia para componentes eletrônicos - Google Patents

armação guia para componentes eletrônicos

Info

Publication number
BRPI0920322A2
BRPI0920322A2 BRPI0920322A BRPI0920322A BRPI0920322A2 BR PI0920322 A2 BRPI0920322 A2 BR PI0920322A2 BR PI0920322 A BRPI0920322 A BR PI0920322A BR PI0920322 A BRPI0920322 A BR PI0920322A BR PI0920322 A2 BRPI0920322 A2 BR PI0920322A2
Authority
BR
Brazil
Prior art keywords
electronic components
guide frame
guide
frame
electronic
Prior art date
Application number
BRPI0920322A
Other languages
English (en)
Inventor
Friedrich Seger
Joachim Stifter
Josef Sinder
Oliver Werner
Peter Goesele
Original Assignee
Tyco Electronics Amp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh filed Critical Tyco Electronics Amp Gmbh
Publication of BRPI0920322A2 publication Critical patent/BRPI0920322A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
BRPI0920322A 2008-10-13 2009-10-12 armação guia para componentes eletrônicos BRPI0920322A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008051491A DE102008051491A1 (de) 2008-10-13 2008-10-13 Leadframe für elektronische Bauelemente
PCT/EP2009/063247 WO2010043580A1 (en) 2008-10-13 2009-10-12 Leadframe for electronic components

Publications (1)

Publication Number Publication Date
BRPI0920322A2 true BRPI0920322A2 (pt) 2016-02-23

Family

ID=41478623

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0920322A BRPI0920322A2 (pt) 2008-10-13 2009-10-12 armação guia para componentes eletrônicos

Country Status (7)

Country Link
US (1) US8927342B2 (pt)
EP (1) EP2345075A1 (pt)
JP (1) JP5654470B2 (pt)
CN (1) CN102177581B (pt)
BR (1) BRPI0920322A2 (pt)
DE (1) DE102008051491A1 (pt)
WO (1) WO2010043580A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
US10998124B2 (en) 2016-05-06 2021-05-04 Vishay Dale Electronics, Llc Nested flat wound coils forming windings for transformers and inductors
KR102464202B1 (ko) 2016-08-31 2022-11-04 비쉐이 데일 일렉트로닉스, 엘엘씨 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터
US12567533B2 (en) 2020-03-03 2026-03-03 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
USD1034462S1 (en) 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device
CN115178851A (zh) * 2022-07-15 2022-10-14 浙江谷蓝电子科技有限公司 一种引线框架焊接方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3684464A (en) * 1970-11-04 1972-08-15 Texas Instruments Inc Composite metal laminate material and lead frame
US4176243A (en) 1976-12-30 1979-11-27 Westinghouse Electric Corp. Bus connector for welded electrical switchboard bus structure
JPS58171838A (ja) * 1982-04-02 1983-10-08 Nec Corp 半導体装置用リ−ドフレ−ム
IL74296A0 (en) 1984-03-20 1985-05-31 Isotronics Inc Corrosion resistant microcircuit package
JPS61272955A (ja) * 1985-05-29 1986-12-03 Furukawa Electric Co Ltd:The 電子機器用Ａｌ系条材
FR2591394B1 (fr) 1985-12-11 1988-08-12 Ducellier & Cie Organe lamellaire de liaison electrique de deux circuits
JP2622862B2 (ja) * 1988-08-24 1997-06-25 イビデン株式会社 リード付電子部品搭載用基板
JPH02152267A (ja) 1988-12-02 1990-06-12 Hitachi Cable Ltd Ｃｕ合金／Ｆｅ−Ｎｉ合金並接型リードフレーム
JPH0777256B2 (ja) * 1989-08-25 1995-08-16 株式会社東芝 樹脂封止型半導体装置
JPH03297163A (ja) * 1990-04-16 1991-12-27 Mitsubishi Electric Corp 半導体装置用リードフレーム
JPH0414257A (ja) * 1990-05-07 1992-01-20 Matsushita Electron Corp 固体撮像装置
JPH05144989A (ja) 1991-11-21 1993-06-11 Sony Corp リードフレームの製造方法とそれを用いた半導体素子の接合方法
US5339518A (en) 1993-07-06 1994-08-23 Motorola, Inc. Method for making a quad leadframe for a semiconductor device
JPH07221254A (ja) 1994-02-02 1995-08-18 Mitsui High Tec Inc 半導体装置用リ−ドフレ−ム
US5811733A (en) 1997-07-16 1998-09-22 Square D Company Busway elbow device
DE19921928C2 (de) 1999-05-12 2002-11-14 Bosch Gmbh Robert Elektrisches Gerät
TWI277192B (en) * 2004-07-08 2007-03-21 Siliconware Precision Industries Co Ltd Lead frame with improved molding reliability and package with the lead frame
KR20060021744A (ko) * 2004-09-04 2006-03-08 삼성테크윈 주식회사 리드프레임 및 그 제조방법
JP4225383B2 (ja) * 2006-02-14 2009-02-18 沖電気工業株式会社 通信タイミング制御装置、通信タイミング制御方法、ノード及び通信システム
KR101365052B1 (ko) 2006-08-11 2014-02-19 삼성디스플레이 주식회사 램프 어셈블리, 이를 갖는 백라이트 어셈블리 및 이를 갖는표시 장치

Also Published As

Publication number Publication date
JP2012505537A (ja) 2012-03-01
EP2345075A1 (en) 2011-07-20
JP5654470B2 (ja) 2015-01-14
CN102177581B (zh) 2016-11-23
WO2010043580A1 (en) 2010-04-22
US20110260304A1 (en) 2011-10-27
US8927342B2 (en) 2015-01-06
DE102008051491A1 (de) 2010-04-29
CN102177581A (zh) 2011-09-07

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: TE CONNECTIVITY GERMANY GMBH (DE)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]