BRPI0923894A2 - Módulo de recepção/transmissão de conjunto integrado - Google Patents

Módulo de recepção/transmissão de conjunto integrado

Info

Publication number
BRPI0923894A2
BRPI0923894A2 BRPI0923894-8A BRPI0923894A BRPI0923894A2 BR PI0923894 A2 BRPI0923894 A2 BR PI0923894A2 BR PI0923894 A BRPI0923894 A BR PI0923894A BR PI0923894 A2 BRPI0923894 A2 BR PI0923894A2
Authority
BR
Brazil
Prior art keywords
transmit module
integrated set
set receive
receive
integrated
Prior art date
Application number
BRPI0923894-8A
Other languages
English (en)
Inventor
Debabani Choudhury
Mark Ruberto
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of BRPI0923894A2 publication Critical patent/BRPI0923894A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/067—Two dimensional planar arrays using endfire radiating aerial units transverse to the plane of the array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/44—Transmit/receive switching
    • H04B1/48—Transmit/receive switching in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/50—Circuits using different frequencies for the two directions of communication
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Transceivers (AREA)
  • Details Of Aerials (AREA)
  • Structure Of Printed Boards (AREA)
BRPI0923894-8A 2008-12-31 2009-12-23 Módulo de recepção/transmissão de conjunto integrado BRPI0923894A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/347,915 US8467737B2 (en) 2008-12-31 2008-12-31 Integrated array transmit/receive module
PCT/US2009/069442 WO2010078199A2 (en) 2008-12-31 2009-12-23 Integrated array transmit/receive module

Publications (1)

Publication Number Publication Date
BRPI0923894A2 true BRPI0923894A2 (pt) 2015-07-28

Family

ID=42285550

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0923894-8A BRPI0923894A2 (pt) 2008-12-31 2009-12-23 Módulo de recepção/transmissão de conjunto integrado

Country Status (8)

Country Link
US (1) US8467737B2 (pt)
EP (1) EP2380237B1 (pt)
JP (1) JP5323946B2 (pt)
KR (1) KR20110091037A (pt)
CN (2) CN101854203A (pt)
BR (1) BRPI0923894A2 (pt)
TW (1) TWI396393B (pt)
WO (1) WO2010078199A2 (pt)

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US8467737B2 (en) 2008-12-31 2013-06-18 Intel Corporation Integrated array transmit/receive module
US8706049B2 (en) * 2008-12-31 2014-04-22 Intel Corporation Platform integrated phased array transmit/receive module
KR101025822B1 (ko) * 2009-06-11 2011-03-30 한국조폐공사 전자기 밴드갭 패턴의 보안코드 인식장치
KR101007288B1 (ko) 2009-07-29 2011-01-13 삼성전기주식회사 인쇄회로기판 및 전자제품
JP5172925B2 (ja) * 2010-09-24 2013-03-27 株式会社東芝 無線装置
JP5736716B2 (ja) * 2010-10-15 2015-06-17 富士通株式会社 電子装置及びその製造方法、送受信装置
WO2013123089A1 (en) * 2012-02-17 2013-08-22 Cohen Nathaniel L Apparatus for using microwave energy for insect and pest control and methods thereof
CN107276641B (zh) * 2012-03-02 2021-07-02 凯萨股份有限公司 双工通信系统和方法
JP5983760B2 (ja) 2012-11-07 2016-09-06 株式会社村田製作所 アレーアンテナ
WO2014100058A1 (en) 2012-12-17 2014-06-26 Waveconnex, Inc. Modular electronics
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
CN103152622A (zh) * 2013-01-22 2013-06-12 深圳感臻科技有限公司 一种多媒体播放设备
KR20150132459A (ko) * 2013-03-15 2015-11-25 키사, 아이엔씨. Ehf 보안 통신 장치
JP6095444B2 (ja) * 2013-03-29 2017-03-15 富士通テン株式会社 アンテナ装置およびレーダ装置
US9667290B2 (en) * 2015-04-17 2017-05-30 Apple Inc. Electronic device with millimeter wave antennas
US10361476B2 (en) * 2015-05-26 2019-07-23 Qualcomm Incorporated Antenna structures for wireless communications
US9722305B2 (en) 2015-08-20 2017-08-01 Google Inc. Balanced multi-layer printed circuit board for phased-array antenna
CN107369653A (zh) * 2016-05-13 2017-11-21 北京中电网信息技术有限公司 一种高干扰组件的系统级封装方法、结构及分离阵列结构
CN109314314B (zh) * 2016-06-29 2021-08-27 胡贝尔和茹纳股份公司 阵列天线
US10490907B2 (en) * 2016-09-27 2019-11-26 Google Llc Suppression of surface waves in printed circuit board-based phased-array antennas
US11211710B2 (en) * 2017-03-17 2021-12-28 Mitsubishi Electric Corporation Array antenna apparatus and method for fabricating same
KR101962821B1 (ko) * 2018-01-18 2019-07-31 동우 화인켐 주식회사 필름 안테나 및 이를 포함하는 디스플레이 장치
KR102147336B1 (ko) * 2018-01-23 2020-08-24 동우 화인켐 주식회사 필름 안테나-회로 연결 구조체 및 이를 포함하는 디스플레이 장치
US11024981B2 (en) * 2018-04-13 2021-06-01 Mediatek Inc. Multi-band endfire antennas and arrays
KR20200024408A (ko) * 2018-08-28 2020-03-09 삼성전자주식회사 안테나 어레이를 포함하는 전자 장치
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
KR102593888B1 (ko) * 2019-06-13 2023-10-24 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
JP2023164103A (ja) * 2022-04-28 2023-11-10 日本特殊陶業株式会社 アレイアンテナ

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Also Published As

Publication number Publication date
CN101854203A (zh) 2010-10-06
TW201101716A (en) 2011-01-01
EP2380237A2 (en) 2011-10-26
US8467737B2 (en) 2013-06-18
CN105845660A (zh) 2016-08-10
EP2380237B1 (en) 2018-07-18
JP5323946B2 (ja) 2013-10-23
EP2380237A4 (en) 2015-08-12
WO2010078199A2 (en) 2010-07-08
US20100167666A1 (en) 2010-07-01
TWI396393B (zh) 2013-05-11
JP2012514426A (ja) 2012-06-21
CN105845660B (zh) 2020-01-21
KR20110091037A (ko) 2011-08-10
WO2010078199A3 (en) 2010-10-14

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 10A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2546 DE 22-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.