BRPI1006482A2 - interface elétrica - Google Patents

interface elétrica

Info

Publication number
BRPI1006482A2
BRPI1006482A2 BRPI1006482A BRPI1006482A BRPI1006482A2 BR PI1006482 A2 BRPI1006482 A2 BR PI1006482A2 BR PI1006482 A BRPI1006482 A BR PI1006482A BR PI1006482 A BRPI1006482 A BR PI1006482A BR PI1006482 A2 BRPI1006482 A2 BR PI1006482A2
Authority
BR
Brazil
Prior art keywords
electrical interface
interface
electrical
Prior art date
Application number
BRPI1006482A
Other languages
English (en)
Inventor
Alaa A Elmoursi
James J Benke
Javed A Mapkar
Robert W Mueller
William E Beatty
Xin Zhou
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of BRPI1006482A2 publication Critical patent/BRPI1006482A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
    • H01R4/304—Clamped connections, spring connections utilising a screw or nut clamping member having means for improving contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Non-Insulated Conductors (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Contacts (AREA)
  • Laminated Bodies (AREA)
BRPI1006482A 2009-03-18 2010-03-18 interface elétrica BRPI1006482A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/406,509 US7862342B2 (en) 2009-03-18 2009-03-18 Electrical interfaces including a nano-particle layer
PCT/IB2010/000577 WO2010106424A2 (en) 2009-03-18 2010-03-18 Electrical interfaces including a nano-particle layer

Publications (1)

Publication Number Publication Date
BRPI1006482A2 true BRPI1006482A2 (pt) 2016-03-01

Family

ID=42561157

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1006482A BRPI1006482A2 (pt) 2009-03-18 2010-03-18 interface elétrica

Country Status (6)

Country Link
US (1) US7862342B2 (pt)
EP (1) EP2409362B1 (pt)
CN (2) CN202205478U (pt)
BR (1) BRPI1006482A2 (pt)
ES (1) ES2745110T3 (pt)
WO (1) WO2010106424A2 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7862342B2 (en) * 2009-03-18 2011-01-04 Eaton Corporation Electrical interfaces including a nano-particle layer
US8853540B2 (en) * 2011-04-19 2014-10-07 Commscope, Inc. Of North Carolina Carbon nanotube enhanced conductors for communications cables and related communications cables and methods
US20150064458A1 (en) * 2013-08-28 2015-03-05 Eaton Corporation Functionalizing injection molded parts using nanofibers
CN108778011B (zh) 2016-03-16 2021-02-12 东洋纺株式会社 可穿戴智能装置
TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
DE102017104922A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung von elektrischen Leitern
RU181978U1 (ru) * 2017-12-01 2018-07-31 МСД Текнолоджис С.а.р.л. Бумага из углеродных нанотрубок с электрическими выводами
US10707596B2 (en) * 2018-09-21 2020-07-07 Carbice Corporation Coated electrical connectors and methods of making and using thereof
EP3855569B1 (en) * 2020-01-27 2025-04-02 Siemens Aktiengesellschaft Electrical device and method of forming an electrical joint
CN120674875A (zh) * 2024-03-19 2025-09-19 维谛公司 电连接器系统

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JPS59123368U (ja) * 1983-02-08 1984-08-20 株式会社ニコン プリント板の接続構造
JPS60163672U (ja) * 1984-04-06 1985-10-30 富士通株式会社 電路材の接続構造
US5147988A (en) * 1990-05-22 1992-09-15 Appleton Arthur I Switching electrical receptacle
JP2915816B2 (ja) * 1995-01-12 1999-07-05 日本碍子株式会社 導通補助材及びそれを用いたコネクタ
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US7223105B2 (en) * 1999-12-16 2007-05-29 Paricon Technologies Corporation Cable connector incorporating anisotropically conductive elastomer
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JP4944341B2 (ja) * 2002-02-26 2012-05-30 日本電気株式会社 リチウムイオン二次電池用負極の製造方法
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KR100827861B1 (ko) * 2003-05-22 2008-05-07 지벡스 퍼포먼스 머티리얼즈, 엘엘씨 나노복합물 및 이의 제조 방법
DE10325683B3 (de) * 2003-06-02 2004-12-09 Siemens Ag Trennschalteranordnung
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
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JP4151541B2 (ja) * 2003-09-26 2008-09-17 松下電器産業株式会社 配線基板およびその製造方法
US7025607B1 (en) * 2005-01-10 2006-04-11 Endicott Interconnect Technologies, Inc. Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
TWI420628B (zh) * 2005-03-28 2013-12-21 台灣積體電路製造股份有限公司 奈米碳管結合墊結構及其方法
US7645497B2 (en) * 2005-06-02 2010-01-12 Eastman Kodak Company Multi-layer conductor with carbon nanotubes
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US7545030B2 (en) * 2005-12-30 2009-06-09 Intel Corporation Article having metal impregnated within carbon nanotube array
JP2007294554A (ja) * 2006-04-24 2007-11-08 Sumitomo Electric Ind Ltd 凸状構造部材
KR100813243B1 (ko) * 2006-07-04 2008-03-13 삼성에스디아이 주식회사 탄소나노튜브를 이용한 반도체 소자의 층간 배선 및 그제조 방법
US7535099B2 (en) * 2006-09-26 2009-05-19 Intel Corporation Sintered metallic thermal interface materials for microelectronic cooling assemblies
CN100402620C (zh) * 2006-11-13 2008-07-16 浙江理工大学 一种制备高性能导电胶的方法
KR100881621B1 (ko) * 2007-01-12 2009-02-04 삼성전자주식회사 반도체 장치 및 그 형성방법
CN101315913A (zh) * 2008-06-12 2008-12-03 上海芯光科技有限公司 一种轻质高导热效率的功率器的封装件
CN101330080B (zh) * 2008-07-23 2011-09-07 广州南科集成电子有限公司 一种高导通电压正装led集成芯片及制造方法
US7862342B2 (en) * 2009-03-18 2011-01-04 Eaton Corporation Electrical interfaces including a nano-particle layer

Also Published As

Publication number Publication date
EP2409362A2 (en) 2012-01-25
CN101840746A (zh) 2010-09-22
WO2010106424A2 (en) 2010-09-23
US7862342B2 (en) 2011-01-04
CN101840746B (zh) 2015-06-03
EP2409362B1 (en) 2019-07-24
WO2010106424A3 (en) 2010-11-18
ES2745110T3 (es) 2020-02-27
CN202205478U (zh) 2012-04-25
US20100240265A1 (en) 2010-09-23

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]