BRPI1008699A2 - método para a produção de molde e estrutura de elétrodo empregada pelo mesmo - Google Patents

método para a produção de molde e estrutura de elétrodo empregada pelo mesmo

Info

Publication number
BRPI1008699A2
BRPI1008699A2 BRPI1008699A BRPI1008699A BRPI1008699A2 BR PI1008699 A2 BRPI1008699 A2 BR PI1008699A2 BR PI1008699 A BRPI1008699 A BR PI1008699A BR PI1008699 A BRPI1008699 A BR PI1008699A BR PI1008699 A2 BRPI1008699 A2 BR PI1008699A2
Authority
BR
Brazil
Prior art keywords
same
electrode structure
structure employed
producing mold
mold
Prior art date
Application number
BRPI1008699A
Other languages
English (en)
Inventor
Akinobu Isurugi
Kiyoshi Minoura
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI1008699A2 publication Critical patent/BRPI1008699A2/pt

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/045—Anodisation of aluminium or alloys based thereon for forming AAO templates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/12—Anodising more than once, e.g. in different baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • ing And Chemical Polishing (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Weting (AREA)
BRPI1008699A 2009-02-17 2010-02-16 método para a produção de molde e estrutura de elétrodo empregada pelo mesmo BRPI1008699A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009034148 2009-02-17
PCT/JP2010/000937 WO2010095415A1 (ja) 2009-02-17 2010-02-16 型の製造方法およびそれに用いられる電極構造

Publications (1)

Publication Number Publication Date
BRPI1008699A2 true BRPI1008699A2 (pt) 2016-03-08

Family

ID=42633704

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1008699A BRPI1008699A2 (pt) 2009-02-17 2010-02-16 método para a produção de molde e estrutura de elétrodo empregada pelo mesmo

Country Status (7)

Country Link
US (1) US20110297640A1 (pt)
EP (1) EP2400044B1 (pt)
JP (1) JP4758521B2 (pt)
CN (1) CN102227520B (pt)
BR (1) BRPI1008699A2 (pt)
RU (1) RU2011138232A (pt)
WO (1) WO2010095415A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2405036B1 (en) * 2009-03-05 2017-11-08 Sharp Kabushiki Kaisha Mold manufacturing method and electrode structure for use therein
WO2011043464A1 (ja) * 2009-10-09 2011-04-14 シャープ株式会社 型および型の製造方法ならびに反射防止膜
CN102791909B (zh) 2010-03-09 2015-05-20 夏普株式会社 阳极氧化层的形成方法、模具的制造方法以及防反射膜的制造方法
RU2550871C9 (ru) * 2010-08-16 2016-05-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный университет имени М.В. Ломоносова" (МГУ) Штамп для морфологической модификации полимеров, способ его получения и способ формирования супергидрофильных и супергидрофобных самоочищающихся покрытий с его использованием
CN103228820B (zh) * 2010-11-30 2016-04-13 夏普株式会社 电极结构、基材保持装置以及阳极氧化层的形成方法
CN108675258B (zh) * 2018-04-25 2019-12-31 清华大学深圳研究生院 基于多孔氧化铝的薄膜组件及其制备方法
EP4143615A1 (en) 2020-04-27 2023-03-08 Glint Photonics, Inc. Method for producing optical article with anti-reflective surface, and optical article with anti-reflective surface

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002542A (en) * 1976-02-09 1977-01-11 Corning Glass Works Thin film capacitor and method
JP3308091B2 (ja) * 1994-02-03 2002-07-29 東京エレクトロン株式会社 表面処理方法およびプラズマ処理装置
US7048841B2 (en) * 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
DE10019720A1 (de) * 2000-04-20 2001-10-31 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
JP4104465B2 (ja) * 2003-01-15 2008-06-18 株式会社荏原製作所 電解めっき装置
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7374646B2 (en) * 2003-01-31 2008-05-20 Ebara Corporation Electrolytic processing apparatus and substrate processing method
US20050023149A1 (en) * 2003-06-05 2005-02-03 Tsutomu Nakada Plating apparatus, plating method and substrate processing apparatus
US20070235342A1 (en) * 2004-10-01 2007-10-11 Canon Kabushiki Kaisha Method for manufacturing nanostructure
KR100893251B1 (ko) * 2004-12-03 2009-04-17 샤프 가부시키가이샤 반사 방지재, 광학 소자, 및 표시 장치 및 스탬퍼의 제조방법 및 스탬퍼를 이용한 반사 방지재의 제조 방법
KR101214663B1 (ko) * 2006-06-30 2012-12-21 카나가와 아카데미 오브 사이언스 앤드 테크놀로지 주형, 주형의 제조 방법 및 시트의 제조 방법

Also Published As

Publication number Publication date
JPWO2010095415A1 (ja) 2012-08-23
JP4758521B2 (ja) 2011-08-31
EP2400044A1 (en) 2011-12-28
WO2010095415A1 (ja) 2010-08-26
EP2400044B1 (en) 2016-09-07
EP2400044A4 (en) 2012-07-25
CN102227520B (zh) 2016-01-06
US20110297640A1 (en) 2011-12-08
RU2011138232A (ru) 2013-03-27
CN102227520A (zh) 2011-10-26

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A E 6A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2384 DE 13-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.