BRPI1009759A2 - método para depositar metal. - Google Patents

método para depositar metal.

Info

Publication number
BRPI1009759A2
BRPI1009759A2 BRPI1009759A BRPI1009759A BRPI1009759A2 BR PI1009759 A2 BRPI1009759 A2 BR PI1009759A2 BR PI1009759 A BRPI1009759 A BR PI1009759A BR PI1009759 A BRPI1009759 A BR PI1009759A BR PI1009759 A2 BRPI1009759 A2 BR PI1009759A2
Authority
BR
Brazil
Prior art keywords
depositing metal
depositing
metal
Prior art date
Application number
BRPI1009759A
Other languages
English (en)
Inventor
Martyn John Hucker
Michael Dunleavy
Sajad Haq
Original Assignee
Bae Systems Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bae Systems Plc filed Critical Bae Systems Plc
Publication of BRPI1009759A2 publication Critical patent/BRPI1009759A2/pt
Publication of BRPI1009759B1 publication Critical patent/BRPI1009759B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
    • C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
BRPI1009759-7A 2009-02-27 2010-02-25 método para depositar metal. BRPI1009759B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0903642.7 2009-02-27
GBGB0903642.7A GB0903642D0 (en) 2009-02-27 2009-02-27 Electroless metal deposition for micron scale structures
PCT/GB2010/050317 WO2010097620A1 (en) 2009-02-27 2010-02-25 Electroless metal deposition for micron scale structures

Publications (2)

Publication Number Publication Date
BRPI1009759A2 true BRPI1009759A2 (pt) 2016-03-15
BRPI1009759B1 BRPI1009759B1 (pt) 2020-01-21

Family

ID=41171381

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1009759-7A BRPI1009759B1 (pt) 2009-02-27 2010-02-25 método para depositar metal.

Country Status (9)

Country Link
US (1) US9260783B2 (pt)
EP (1) EP2401418B1 (pt)
AU (1) AU2010217389B2 (pt)
BR (1) BRPI1009759B1 (pt)
CA (1) CA2753761A1 (pt)
ES (1) ES2552255T3 (pt)
GB (1) GB0903642D0 (pt)
IL (1) IL214842A0 (pt)
WO (1) WO2010097620A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3013995A1 (fr) * 2013-11-29 2015-06-05 Commissariat Energie Atomique Procede ameliore de metallisation d'un materiau poreux
US20160122233A1 (en) * 2014-11-05 2016-05-05 Corning Incorporated Coated glass sleeves and methods of coating glass sleeves
EP3508809A1 (en) 2018-01-05 2019-07-10 BAE SYSTEMS plc Lightweight tuneable insulated chaff material
US11251536B2 (en) 2018-01-05 2022-02-15 Bae Systems Plc Lightweight tuneable insulated chaff material
GB2601782B (en) 2020-12-10 2024-09-11 Bae Systems Plc Countermeasure device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1143883A (pt) * 1900-01-01
US4695489A (en) 1986-07-28 1987-09-22 General Electric Company Electroless nickel plating composition and method
US4904633A (en) * 1986-12-18 1990-02-27 Nippon Shokubai Kagaku Kogyo Co., Ltd. Catalyst for purifying exhaust gas and method for production thereof
JPH0243373A (ja) * 1988-08-03 1990-02-13 Nippon Mining Co Ltd 無電解金めつき液
US5130168A (en) 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
NO304746B1 (no) 1989-05-04 1999-02-08 Ad Tech Holdings Ltd Gjenstand som motstÕr mikrobiologisk vekst bestÕende av et ikke-ledende subtrat som er belagt med et trat som er belagt medfremgangsmate for a avsette
DE630991T1 (de) * 1992-11-25 1995-07-13 Kanto Kagaku Stromloses goldbeschichtungsbad.
JP4559009B2 (ja) * 2000-01-21 2010-10-06 リサーチ・トライアングル・インスティチュート 熱的機械的安定金属／多孔質基体複合膜の形成方法
US6361824B1 (en) 2000-07-31 2002-03-26 Nanocrystal Imaging Corp. Process for providing a highly reflective coating to the interior walls of microchannels
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
US20050006339A1 (en) 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
WO2005055118A2 (en) * 2003-11-29 2005-06-16 Cross Match Technologies, Inc. Polymer ceramic slip and method of manufacturing ceramic green bodies therefrom
JP2005174824A (ja) * 2003-12-12 2005-06-30 Tanaka Kikinzoku Kogyo Kk 金属ペースト及び該金属ペーストを用いた膜形成方法
WO2007105736A1 (ja) * 2006-03-13 2007-09-20 Ngk Insulators, Ltd. ハニカム触媒体
US8006637B2 (en) * 2007-03-29 2011-08-30 Corning Incorporated Method and apparatus for membrane deposition
GB0812486D0 (en) 2008-07-08 2009-04-29 Bae Systems Plc Electrical Power Sources
GB0812483D0 (en) 2008-07-08 2009-01-07 Bae Systems Plc Electrical Circuit Assemblies and Structural Components Incorporating same

Also Published As

Publication number Publication date
CA2753761A1 (en) 2010-09-02
GB0903642D0 (en) 2009-09-30
EP2401418A1 (en) 2012-01-04
EP2401418B1 (en) 2015-10-07
ES2552255T3 (es) 2015-11-26
BRPI1009759B1 (pt) 2020-01-21
WO2010097620A1 (en) 2010-09-02
AU2010217389A1 (en) 2011-09-15
IL214842A0 (en) 2011-12-01
WO2010097620A4 (en) 2010-11-25
US9260783B2 (en) 2016-02-16
AU2010217389B2 (en) 2014-03-06
US20110305825A1 (en) 2011-12-15

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 25/02/2010, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 16A ANUIDADE.