BRPI1011372A2 - método e montagem para tratar um material plano a ser tratado e dispositivo para remover ou reter líquido de tratamento - Google Patents

método e montagem para tratar um material plano a ser tratado e dispositivo para remover ou reter líquido de tratamento

Info

Publication number
BRPI1011372A2
BRPI1011372A2 BRPI1011372A BRPI1011372A BRPI1011372A2 BR PI1011372 A2 BRPI1011372 A2 BR PI1011372A2 BR PI1011372 A BRPI1011372 A BR PI1011372A BR PI1011372 A BRPI1011372 A BR PI1011372A BR PI1011372 A2 BRPI1011372 A2 BR PI1011372A2
Authority
BR
Brazil
Prior art keywords
treating
treated
assembly
treatment liquid
flat material
Prior art date
Application number
BRPI1011372A
Other languages
English (en)
Inventor
Ferdinand Wiener
Henry Kunze
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI1011372A2 publication Critical patent/BRPI1011372A2/pt
Publication of BRPI1011372B1 publication Critical patent/BRPI1011372B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Advancing Webs (AREA)
BRPI1011372-0A 2009-05-13 2010-05-12 método e montagem para tratar um material plano a ser tratado, e dispositivo para remover ou reter líquido de tratamento e método para produzir uma placa de circuito BRPI1011372B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009021042 2009-05-13
DE102009021042.3 2009-05-13
PCT/EP2010/002939 WO2010130445A1 (de) 2009-05-13 2010-05-12 Verfahren und anlage zum behandeln von flächigem behandlungsgut und vorrichtung zum entfernen oder abhalten von behandlungsflüssigkeit

Publications (2)

Publication Number Publication Date
BRPI1011372A2 true BRPI1011372A2 (pt) 2016-03-15
BRPI1011372B1 BRPI1011372B1 (pt) 2019-12-10

Family

ID=42289719

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI1011372-0A BRPI1011372B1 (pt) 2009-05-13 2010-05-12 método e montagem para tratar um material plano a ser tratado, e dispositivo para remover ou reter líquido de tratamento e método para produzir uma placa de circuito
BRPI1011369A BRPI1011369A2 (pt) 2009-05-13 2010-05-12 método, estação de tratamento e montagem para tratar um material plano a ser tratado

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRPI1011369A BRPI1011369A2 (pt) 2009-05-13 2010-05-12 método, estação de tratamento e montagem para tratar um material plano a ser tratado

Country Status (9)

Country Link
US (2) US9713265B2 (pt)
EP (2) EP2430889B1 (pt)
JP (2) JP5512799B2 (pt)
KR (2) KR101284197B1 (pt)
CN (2) CN102422728B (pt)
BR (2) BRPI1011372B1 (pt)
MY (2) MY153831A (pt)
TW (2) TWI492684B (pt)
WO (2) WO2010130445A1 (pt)

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US20140020723A1 (en) * 2012-07-12 2014-01-23 James Murphy Mat cleaning system
DE102013207343B3 (de) 2013-04-23 2014-08-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut
EP2854490A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method and apparatus for a wet-chemical or electrochemical treatment
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
US10087984B2 (en) 2015-06-30 2018-10-02 Saint-Gobain Performance Plastics Corporation Plain bearing
JP6070804B2 (ja) * 2015-10-21 2017-02-01 Ｊｆｅスチール株式会社 基材へのスラリー塗布方法及び塗布装置
CN105543945B (zh) * 2015-12-09 2018-05-15 东莞市威力固电路板设备有限公司 挤水辊装置
CN105780096B (zh) * 2016-05-25 2018-06-22 南通汇丰电子科技有限公司 一种电镀传动装置
KR102731377B1 (ko) * 2016-11-28 2024-11-15 엘지디스플레이 주식회사 롤투롤 제조장치
TWI620905B (zh) * 2017-06-14 2018-04-11 住華科技股份有限公司 除液裝置
CN109323162B (zh) * 2018-06-27 2023-10-13 深圳市烨光璇电子科技有限公司 背光模组生产线
CN110834345B (zh) * 2018-08-17 2022-09-09 扬博科技股份有限公司 可操控夹具启闭的致动装置
US12420305B2 (en) * 2019-08-12 2025-09-23 Louisiana-Pacific Corp. Coating process for engineered-wood panels or components

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JPS5845399A (ja) 1981-09-10 1983-03-16 Electroplating Eng Of Japan Co メツキ装置
DE3603856C2 (de) 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
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Also Published As

Publication number Publication date
JP5512799B2 (ja) 2014-06-04
BRPI1011369A2 (pt) 2016-03-15
JP5410598B2 (ja) 2014-02-05
CN102422728B (zh) 2015-04-01
CN102422727A (zh) 2012-04-18
MY153831A (en) 2015-03-31
US9713265B2 (en) 2017-07-18
EP2430890B1 (de) 2014-12-10
US20120111365A1 (en) 2012-05-10
CN102422727B (zh) 2015-05-13
BRPI1011372B1 (pt) 2019-12-10
TWI492684B (zh) 2015-07-11
KR101341146B1 (ko) 2013-12-11
CN102422728A (zh) 2012-04-18
US20120080322A1 (en) 2012-04-05
EP2430889A1 (de) 2012-03-21
EP2430889B1 (de) 2014-04-30
EP2430890A1 (de) 2012-03-21
KR101284197B1 (ko) 2013-07-09
KR20120010276A (ko) 2012-02-02
HK1167985A1 (en) 2012-12-14
US9016230B2 (en) 2015-04-28
JP2012527104A (ja) 2012-11-01
TW201110838A (en) 2011-03-16
KR20120030414A (ko) 2012-03-28
MY156875A (en) 2016-04-15
WO2010130444A1 (de) 2010-11-18
WO2010130445A1 (de) 2010-11-18
TWI487442B (zh) 2015-06-01
TW201108890A (en) 2011-03-01
JP2012527103A (ja) 2012-11-01

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 12/05/2010, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 12/05/2010, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 16A ANUIDADE.