BRPI1012847A2 - resina de poliamida - Google Patents

resina de poliamida

Info

Publication number
BRPI1012847A2
BRPI1012847A2 BRPI1012847A BRPI1012847A BRPI1012847A2 BR PI1012847 A2 BRPI1012847 A2 BR PI1012847A2 BR PI1012847 A BRPI1012847 A BR PI1012847A BR PI1012847 A BRPI1012847 A BR PI1012847A BR PI1012847 A2 BRPI1012847 A2 BR PI1012847A2
Authority
BR
Brazil
Prior art keywords
polyamide resin
polyamide
resin
Prior art date
Application number
BRPI1012847A
Other languages
English (en)
Inventor
Kuwahara Hisayuki
Ishii Kentaro
Ayuba Shinichi
Ogawa Shun
Sumino Takahiko
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of BRPI1012847A2 publication Critical patent/BRPI1012847A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/28—Preparatory processes
    • C08G69/30—Solid state polycondensation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/28—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0083—Nucleating agents promoting the crystallisation of the polymer matrix
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI1012847A 2009-05-28 2010-05-28 resina de poliamida BRPI1012847A2 (pt)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2009129217 2009-05-28
JP2009211832 2009-09-14
JP2009211833 2009-09-14
JP2009211840 2009-09-14
JP2009211831 2009-09-14
PCT/JP2010/059137 WO2010137703A1 (ja) 2009-05-28 2010-05-28 ポリアミド樹脂

Publications (1)

Publication Number Publication Date
BRPI1012847A2 true BRPI1012847A2 (pt) 2018-06-19

Family

ID=43222806

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1012847A BRPI1012847A2 (pt) 2009-05-28 2010-05-28 resina de poliamida

Country Status (9)

Country Link
US (2) US20120065327A1 (pt)
EP (1) EP2436717B1 (pt)
JP (1) JP5640975B2 (pt)
KR (1) KR101689907B1 (pt)
CN (1) CN102449028B (pt)
BR (1) BRPI1012847A2 (pt)
RU (1) RU2544013C2 (pt)
SG (1) SG176237A1 (pt)
WO (1) WO2010137703A1 (pt)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2327737B1 (en) * 2008-09-18 2016-07-20 Mitsubishi Gas Chemical Company, Inc. Polyamide resin
WO2011021633A1 (ja) 2009-08-20 2011-02-24 三菱瓦斯化学株式会社 ポリアミド
JP5857741B2 (ja) * 2009-09-14 2016-02-10 三菱瓦斯化学株式会社 ポリアミド樹脂組成物
JP5857742B2 (ja) 2009-09-14 2016-02-10 三菱瓦斯化学株式会社 難燃性ポリアミド樹脂組成物
DE102010004743A1 (de) * 2010-01-14 2011-07-21 Merck Patent GmbH, 64293 Laseradditiv
EP2744845B1 (en) * 2011-08-19 2019-01-09 Solvay Specialty Polymers USA, LLC Improved polyamide compositions for led applications
EP2604643B1 (en) * 2011-09-12 2018-05-30 Mitsubishi Gas Chemical Company, Inc. Thin-wall article
KR20140107445A (ko) * 2011-12-16 2014-09-04 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 성형품
EP2886687A4 (en) * 2012-08-14 2016-03-30 Mitsubishi Gas Chemical Co POLYETHERPOLYAMIDFASER
US20150291736A1 (en) * 2012-11-08 2015-10-15 Mitsubishi Gas Chemical Company, Inc. Method for producing polyamide
KR102161076B1 (ko) * 2013-07-10 2020-09-29 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리아미드 수지의 제조방법
JP6131151B2 (ja) * 2013-09-03 2017-05-17 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2015101675A (ja) * 2013-11-26 2015-06-04 チェイル インダストリーズ インコーポレイテッド ポリアミド成形体およびその製造方法
CN103834006B (zh) * 2014-03-21 2016-03-16 山东广垠新材料有限公司 一种耐高温尼龙多元共聚物及其制备方法
WO2015174345A1 (ja) * 2014-05-13 2015-11-19 三菱瓦斯化学株式会社 ポリアミドの製造方法
KR102341964B1 (ko) * 2014-10-07 2021-12-23 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리아미드 수지의 제조방법
CA2975865C (en) * 2015-03-03 2022-09-06 Unitika Ltd. Polyamide resin composition
US9562191B2 (en) * 2015-04-01 2017-02-07 Citizen Finedevice Co., Ltd. Compositions and methods for removing ions from liquid crystal materials
JP6954120B2 (ja) * 2015-12-22 2021-10-27 宇部興産株式会社 ポリアミド樹脂組成物、及びそれからなる成形品
EP3187528B1 (en) 2015-12-31 2020-08-19 Samsung Electronics Co., Ltd. Composition for preparing transparent polymer film, transparent polymer film, and electronic device including same
EP3412705B1 (en) * 2016-02-02 2023-09-27 Mitsubishi Gas Chemical Company, Inc. Polyamide resin, molded article, method for producing polyamide resin
JP6951075B2 (ja) 2016-03-16 2021-10-20 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物および成形品
WO2017159418A1 (ja) * 2016-03-16 2017-09-21 三菱エンジニアリングプラスチックス株式会社 ポリアミド樹脂組成物および成形品
KR101816434B1 (ko) * 2016-09-06 2018-01-08 현대자동차주식회사 발포사출용 탄소 장섬유 강화 열가소성 수지 조성물 및 이를 사용하여 제조된 성형품
WO2018180401A1 (ja) * 2017-03-28 2018-10-04 三菱瓦斯化学株式会社 樹脂組成物、成形品、フィルムおよび多層フィルム
CN109553768B (zh) * 2017-09-26 2021-09-24 上海凯赛生物技术股份有限公司 一种聚酰胺及其制备方法
CN109957107B (zh) * 2017-12-25 2022-07-19 上海凯赛生物技术股份有限公司 一种聚酯酰胺及其制备方法
US11872788B2 (en) 2018-04-24 2024-01-16 Mitsubishi Gas Chemical Company, Inc. Multilayered article and multilayered container
WO2019208500A1 (ja) * 2018-04-24 2019-10-31 三菱瓦斯化学株式会社 多層体および多層容器
US20210317266A1 (en) * 2018-08-21 2021-10-14 Mitsubishi Gas Chemical Company, Inc. Method for producing an amorphous polyamide resin
CN109762329B (zh) * 2018-12-14 2021-07-20 中广核俊尔新材料有限公司 一种抗静电、耐高温黄变阻燃尼龙复合材料及其制备方法
EP3927760B1 (en) * 2019-02-19 2024-10-16 Solvay Specialty Polymers USA, LLC. Mobile electronic device article or component comprising a polyamide
CN114144473B (zh) * 2019-07-11 2023-01-03 东丽株式会社 聚酰胺树脂组合物及将其成型而成的成型品
CN112662172B (zh) * 2020-12-09 2022-10-18 珠海万通特种工程塑料有限公司 一种半芳香族聚酰胺树脂组合物及其制备方法与应用
JP2022174909A (ja) * 2021-05-12 2022-11-25 三菱瓦斯化学株式会社 樹脂組成物および成形品
CN115536838B (zh) * 2021-06-30 2024-02-09 上海凯赛生物技术股份有限公司 一种共聚酰胺树脂、纤维及其制备方法与应用
CN115418118B (zh) * 2022-09-26 2023-03-28 福建乐钛科技有限公司 锦纶色母粒用钛白粉的制备方法
CN118772399B (zh) * 2024-09-10 2024-11-19 川化集团有限责任公司 一种生物基可降解尼龙及其制备方法

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US2510777A (en) * 1946-12-30 1950-06-06 Du Pont Polyamide treated with a hypophosphorous acid compound
JPS4715106B1 (pt) * 1964-08-29 1972-05-06
JPS5141906B2 (pt) 1972-09-07 1976-11-12
US3803102A (en) * 1972-08-21 1974-04-09 Pennwalt Corp Copolyamides from m-and p-xylylene diamines and an aliphatic dibasic acid mixture
JPS5432458B2 (pt) 1974-11-26 1979-10-15
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JPH06192416A (ja) * 1992-12-25 1994-07-12 Showa Denko Kk ポリアミド樹脂の製造方法
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JP4843876B2 (ja) * 2001-07-19 2011-12-21 三菱瓦斯化学株式会社 キシリレン基含有ポリアミド樹脂
JP4151354B2 (ja) * 2002-08-30 2008-09-17 東洋紡績株式会社 ポリアミドの連続製造方法
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JP4857634B2 (ja) * 2005-07-22 2012-01-18 三菱瓦斯化学株式会社 ポリアミド樹脂
JP2007031630A (ja) * 2005-07-29 2007-02-08 Mitsubishi Gas Chem Co Inc ポリアミド樹脂
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Also Published As

Publication number Publication date
US20120065327A1 (en) 2012-03-15
CN102449028A (zh) 2012-05-09
KR101689907B1 (ko) 2016-12-26
RU2544013C2 (ru) 2015-03-10
RU2011153710A (ru) 2013-07-10
JPWO2010137703A1 (ja) 2012-11-15
KR20120047846A (ko) 2012-05-14
EP2436717A4 (en) 2014-03-26
SG176237A1 (en) 2012-01-30
EP2436717B1 (en) 2020-10-28
JP5640975B2 (ja) 2014-12-17
EP2436717A1 (en) 2012-04-04
US20150166726A1 (en) 2015-06-18
WO2010137703A1 (ja) 2010-12-02
CN102449028B (zh) 2014-07-02

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]