BRPI1013063A2 - dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão - Google Patents

dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão

Info

Publication number
BRPI1013063A2
BRPI1013063A2 BRPI1013063A BRPI1013063A BRPI1013063A2 BR PI1013063 A2 BRPI1013063 A2 BR PI1013063A2 BR PI1013063 A BRPI1013063 A BR PI1013063A BR PI1013063 A BRPI1013063 A BR PI1013063A BR PI1013063 A2 BRPI1013063 A2 BR PI1013063A2
Authority
BR
Brazil
Prior art keywords
heat spreader
thermosiphon heat
manufacturing
thermosiphon
conduits
Prior art date
Application number
BRPI1013063A
Other languages
English (en)
Inventor
Peng Feng
Peng Li Hai
Yang Hua
Heningsson Uno
Tsoi Vadim
ping hong Yu
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Publication of BRPI1013063A2 publication Critical patent/BRPI1013063A2/pt
Publication of BRPI1013063A8 publication Critical patent/BRPI1013063A8/pt
Publication of BRPI1013063B1 publication Critical patent/BRPI1013063B1/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão a presente invenção refere-se a um dispositivo de propagação de calor (1) que compreende uma seção que forma uma primeira porção de câmara e uma segunda porção de câmara, uma pluralidade de primeiros condutos (hn, 12n), e pelo menos dois segundos condutos (13, 14). uma interconexão da primeira e segunda porções de câmara é provida por meio de pelo menos dois segundos condutos (13, 14). peças/porções integrais são providas, tais como cavidades (4), barreiras (1108) e aletas (23).
BRPI1013063-2A 2009-05-18 2010-05-18 dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão BRPI1013063B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0900622 2009-05-18
SE0900622-2 2009-05-18
PCT/IB2010/001351 WO2010150064A1 (en) 2009-05-18 2010-05-18 Heat spreading device and method therefore

Publications (3)

Publication Number Publication Date
BRPI1013063A2 true BRPI1013063A2 (pt) 2019-07-09
BRPI1013063A8 BRPI1013063A8 (pt) 2019-07-30
BRPI1013063B1 BRPI1013063B1 (pt) 2020-11-17

Family

ID=43386076

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1013063-2A BRPI1013063B1 (pt) 2009-05-18 2010-05-18 dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão

Country Status (5)

Country Link
US (1) US9423192B2 (pt)
EP (1) EP2433480B1 (pt)
CN (1) CN102440086B (pt)
BR (1) BRPI1013063B1 (pt)
WO (1) WO2010150064A1 (pt)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
EP2848101B1 (en) 2012-05-07 2019-04-10 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20140182132A1 (en) * 2013-01-01 2014-07-03 Asia Vital Components Co., Ltd. Method of manufacturing a vapor chamber structure
FR3010274B1 (fr) * 2013-08-27 2016-10-21 Valeo Equip Electr Moteur Bloc convertisseur de puissance de vehicule electrique ou hybride
DK177987B1 (da) * 2013-09-16 2015-02-16 Dantherm Cooling As Varmeveksler samt fremgangsmåde og anvendelse
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
CN108801012B (zh) * 2014-08-28 2020-10-23 阿威德热合金有限公司 具有一体式部件的热虹吸装置
US20160061532A1 (en) * 2014-09-02 2016-03-03 Aavid Thermalloy, Llc Evaporator and condenser section structure for thermosiphon
US11397057B2 (en) * 2014-09-26 2022-07-26 Asia Vital Components Co., Ltd. Vapor chamber structure
FR3027379B1 (fr) * 2014-10-15 2019-04-26 Euro Heat Pipes Caloduc plat avec fonction reservoir
US9713286B2 (en) * 2015-03-03 2017-07-18 International Business Machines Corporation Active control for two-phase cooling
JP2018513342A (ja) * 2015-04-21 2018-05-24 アアヴィッド・サーマロイ・エルエルシー マルチポート管及び流れ配置を備えたサーモサイホン
TWI602497B (zh) * 2015-09-16 2017-10-11 宏碁股份有限公司 散熱模組
US9835382B2 (en) 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
US10353445B2 (en) * 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
CN106231871B (zh) * 2016-08-23 2018-04-20 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
US10018427B2 (en) * 2016-09-08 2018-07-10 Taiwan Microloops Corp. Vapor chamber structure
EP3404710A1 (en) * 2017-05-18 2018-11-21 Diabatix BVBA Heat sink and method for producing same
EP3655718A4 (en) 2017-07-17 2021-03-17 Alexander Poltorak MULTIFRACTAL HEAT SINK SYSTEM AND PROCESS
DE112018003831T5 (de) * 2017-07-28 2020-04-09 Dana Canada Corporation Ultradünne wärmetauscher für das wärmemanagement
DE102017217537B4 (de) * 2017-10-02 2021-10-21 Danfoss Silicon Power Gmbh Leistungsmodul mit integrierter Kühleinrichtung
TWI639379B (zh) 2017-12-26 2018-10-21 訊凱國際股份有限公司 散熱結構
KR102679860B1 (ko) * 2019-04-25 2024-07-02 한온시스템 주식회사 냉각 장치
US11792963B2 (en) 2018-05-16 2023-10-17 Hanon Systems Cooling apparatus
US12009283B2 (en) 2018-08-24 2024-06-11 Washington University Methods and systems for evaporation of liquid from droplet confined on hollow pillar
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
EP3723463B1 (en) * 2019-04-10 2023-03-01 ABB Schweiz AG Heat exchanger with integrated two-phase heat spreader
CN113711350B (zh) * 2019-04-29 2023-11-28 高通股份有限公司 包括压电结构的多相散热器件
AT522831B1 (de) * 2019-08-08 2023-05-15 Dau Gmbh & Co Kg Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau
CN112783299B (zh) * 2019-11-06 2023-10-13 富联精密电子(天津)有限公司 Lts散热器及具有该lts散热器的电子设备
US10999952B1 (en) * 2020-01-02 2021-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
US12141508B2 (en) 2020-03-16 2024-11-12 Washington University Systems and methods for forming micropillar array
EP3893274A1 (en) * 2020-04-07 2021-10-13 ABB Schweiz AG Cooling element and method of manufacturing a cooling element
US12477696B2 (en) 2021-01-21 2025-11-18 Nvidia Corporation Intelligent cold plate system with active and passive features for a datacenter cooling system
FI20215154A1 (en) * 2021-02-15 2022-08-16 Teknologian Tutkimuskeskus Vtt Oy Heat dissipation apparatus
US20230225080A1 (en) * 2022-01-12 2023-07-13 Arista Networks, Inc. Hybrid heatsink system
US12196496B2 (en) * 2022-09-25 2025-01-14 Aic Inc. Liquid-cooled cooling structure
EP4345575B1 (fr) * 2022-09-28 2024-09-04 Bull Sas Procédé de fabrication d'un dissipateur thermique
CN115696723B (zh) * 2022-10-21 2026-02-17 华为数字能源技术有限公司 一种电子组件及电子设备
EP4387405A1 (en) * 2022-12-14 2024-06-19 Huawei Technologies Co., Ltd. Apparatus for transferring heat from a heat source to air
TWI859751B (zh) * 2023-03-01 2024-10-21 和碩聯合科技股份有限公司 水冷結構
WO2024210775A1 (en) * 2023-04-03 2024-10-10 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink
TWI903761B (zh) * 2024-09-18 2025-11-01 鑫創電子股份有限公司 電子或電腦產品水冷散熱裝置

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2064141A (en) * 1934-03-16 1936-12-15 Fedders Mfg Co Inc Method of making refrigerating apparatus
US3053514A (en) * 1949-11-18 1962-09-11 Olin Mathieson Sheet metal fabrications
US2877000A (en) * 1955-09-16 1959-03-10 Int Harvester Co Heat exchanger
US3035419A (en) * 1961-01-23 1962-05-22 Westinghouse Electric Corp Cooling device
US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
US3209062A (en) * 1963-01-25 1965-09-28 Westinghouse Electric Corp Mounting and coolant system for semiconductor heat generating devices
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US4002200A (en) * 1972-12-07 1977-01-11 Dean Products, Inc. Extended fin heat exchanger panel
US3831664A (en) * 1973-11-07 1974-08-27 Boeing Co Heat pipe interfaces
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US4235287A (en) * 1975-05-02 1980-11-25 Olin Corporation Heat exchange panel
US4180127A (en) * 1977-11-14 1979-12-25 Barber-Colman Company Multiple heat pipe heat exchanger and method for making
US4209064A (en) * 1978-08-25 1980-06-24 General Electric Company Panel-type radiator for electrical apparatus
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
DE3276594D1 (en) * 1981-04-08 1987-07-23 Secretary Industry Brit Improvements in or relating to heat metering
DE3203369C1 (de) * 1982-02-02 1983-10-13 Daimler-Benz Ag, 7000 Stuttgart Flächenheizkörper für Fahrzeuge
GB2161917B (en) * 1984-06-29 1989-05-24 Showa Aluminum Corp Solar water heater
HU192672B (en) * 1985-02-22 1987-06-29 Energiagazdalkodasi Intezet Radiator of ribbed tube
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
DE69016119T2 (de) * 1989-07-19 1995-08-31 Showa Aluminum Corp Wärmerohr.
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
US5238056A (en) * 1990-03-30 1993-08-24 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat exchanger with oscillating flow
DE4020265C1 (pt) * 1990-06-26 1991-04-18 Mercedes-Benz Aktiengesellschaft, 7000 Stuttgart, De
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US5327734A (en) 1992-05-15 1994-07-12 The United States Of America As Represented By The Secretary Of The Army Passive-active thermosyphon
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US5755278A (en) * 1993-12-08 1998-05-26 Fanuc, Ltd. Heat sink attached to a heat plate
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
JP3438087B2 (ja) * 1995-02-16 2003-08-18 アクトロニクス株式会社 リボン状プレートヒートパイプ
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
KR100211058B1 (ko) 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
SG64996A1 (en) 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
US6097597A (en) 1998-06-30 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus
JP2000091482A (ja) 1998-09-10 2000-03-31 Toshiba Corp 半導体素子用冷却器およびその製造方法
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US6148905A (en) 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
US6234242B1 (en) * 1999-04-30 2001-05-22 Motorola, Inc. Two-phase thermosyphon including a porous structural material having slots disposed therein
US6969506B2 (en) * 1999-08-17 2005-11-29 Battelle Memorial Institute Methods of conducting simultaneous exothermic and endothermic reactions
KR100338810B1 (ko) * 1999-11-08 2002-05-31 윤종용 냉각장치
US6257320B1 (en) * 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US6935411B2 (en) * 2000-06-08 2005-08-30 Mikros Manufacturing, Inc. Normal-flow heat exchanger
WO2002004876A1 (en) 2000-07-06 2002-01-17 Dantherm Hms A/S A cooling system for active and passive operation
US6679316B1 (en) * 2000-10-02 2004-01-20 The United States Of America As Represented By The Secretary Of The Air Force Passive thermal spreader and method
US6474074B2 (en) 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US7080680B2 (en) * 2001-09-05 2006-07-25 Showa Denko K.K. Heat sink, control device having the heat sink and machine tool provided with the device
KR100438825B1 (ko) * 2001-10-29 2004-07-05 삼성전자주식회사 단열 수단을 구비하는 열 전달 장치
US7061763B2 (en) 2002-01-29 2006-06-13 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
JP2003234590A (ja) * 2002-02-08 2003-08-22 Denso Corp 沸騰冷却装置
US6942019B2 (en) * 2002-03-25 2005-09-13 Ltx Corporation Apparatus and method for circuit board liquid cooling
JP2004037039A (ja) * 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
KR100569175B1 (ko) * 2002-08-07 2006-04-07 가부시키가이샤 덴소 카운터 스트림 모드 진동유동 열전달 장치
JP3967697B2 (ja) * 2002-08-21 2007-08-29 三星電子株式会社 平板型熱伝逹装置及びその製造方法
JP4380250B2 (ja) * 2002-08-28 2009-12-09 ソニー株式会社 熱輸送装置、電子機器装置及び熱輸送装置の製造方法
US20040065111A1 (en) 2002-10-08 2004-04-08 Sun Microsystems, Inc. Field replaceable packaged refrigeration module with thermosyphon for cooling electronic components
US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6648064B1 (en) * 2002-11-14 2003-11-18 Lsi Logic Corporation Active heat sink
JP2004190976A (ja) * 2002-12-12 2004-07-08 Sony Corp 熱輸送装置及び電子デバイス
KR100505554B1 (ko) * 2003-01-24 2005-08-03 아이큐리랩 홀딩스 리미티드 하이브리드형 냉각 장치
US7184265B2 (en) * 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
KR100505279B1 (ko) * 2003-05-31 2005-07-29 아이큐리랩 홀딩스 리미티드 드라이 아웃이 방지된 박판형 냉각장치
TW591984B (en) * 2003-07-04 2004-06-11 Sentelic Corp Micro-circulating flow channel system and its manufacturing method
US7025124B2 (en) * 2003-10-24 2006-04-11 Chin Wen Wang Supporting structure for planar heat pipe
FR2861894B1 (fr) * 2003-10-31 2008-01-18 Valeo Equip Electr Moteur Dispositif de refroidissement d'une electronique de puissance
US20050199372A1 (en) 2004-03-08 2005-09-15 Frazer James T. Cold plate and method of making the same
ATE527510T1 (de) 2004-03-31 2011-10-15 Belits Comp Systems Inc Kühlsystem auf thermosiphonbasis mit niedrigem profil für computer und andere elektrische geräte
US7958935B2 (en) 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7190580B2 (en) * 2004-07-01 2007-03-13 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
KR100619076B1 (ko) * 2005-04-11 2006-08-31 삼성전자주식회사 전자소자 방열용 히트싱크장치
JP4746361B2 (ja) * 2005-06-30 2011-08-10 株式会社東芝 電子機器
CN100554852C (zh) * 2005-09-23 2009-10-28 鸿富锦精密工业（深圳）有限公司 热管及散热模组
US7640967B2 (en) 2005-10-12 2010-01-05 International Truck Intellectual Property Company, Llc Thermosyphon heat reduction system for a motor vehicle engine compartment
US7317616B2 (en) * 2006-01-30 2008-01-08 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
TW200809477A (en) * 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
JP2008049796A (ja) 2006-08-23 2008-03-06 Denso Corp 車載電子機器の冷却装置
US8561673B2 (en) * 2006-09-26 2013-10-22 Olantra Fund X L.L.C. Sealed self-contained fluidic cooling device
JP4775287B2 (ja) 2006-10-18 2011-09-21 株式会社デンソー 熱交換器
JP2008126720A (ja) 2006-11-17 2008-06-05 Denso Corp クーリングモジュール
US20080115416A1 (en) 2006-11-22 2008-05-22 Keith Clark Garage door
US8833438B2 (en) * 2006-11-29 2014-09-16 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
JP4659769B2 (ja) 2007-01-25 2011-03-30 トヨタ自動車株式会社 冷却装置
KR100912538B1 (ko) * 2007-12-04 2009-08-18 한국전자통신연구원 평판형 마이크로 열이송 장치
US8210243B2 (en) * 2008-07-21 2012-07-03 International Business Machines Corporation Structure and apparatus for cooling integrated circuits using cooper microchannels
EP2149771B8 (de) * 2008-07-29 2017-03-15 MAHLE Behr GmbH & Co. KG Vorrichtung zur Kühlung einer Wärmequelle eines Kraftfahrzeugs
JP5262822B2 (ja) * 2009-02-23 2013-08-14 日本軽金属株式会社 液冷ジャケットの製造方法
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
BRPI0924849B1 (pt) * 2009-06-17 2019-12-31 Huawei Tech Co Ltd dispositivo de dissipação de calor e módulo de frequência de rádio com o mesmo
US20100326644A1 (en) * 2009-06-30 2010-12-30 Shui-Hsu Hung Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same
US8785024B2 (en) * 2010-02-23 2014-07-22 GM Global Technology Operations LLC Combination of heat pipe and louvered fins for air-cooling of Li-Ion battery cell and pack
TWI423015B (zh) * 2010-07-21 2014-01-11 奇鋐科技股份有限公司 Pressure gradient driven thin plate type low pressure heat siphon plate
US8797741B2 (en) * 2010-10-21 2014-08-05 Raytheon Company Maintaining thermal uniformity in micro-channel cold plates with two-phase flows
US8810448B1 (en) * 2010-11-18 2014-08-19 Raytheon Company Modular architecture for scalable phased array radars
DE112012001774T5 (de) * 2011-04-19 2014-01-23 Modine Manufacturing Co. Wärmetauscher

Also Published As

Publication number Publication date
WO2010150064A1 (en) 2010-12-29
EP2433480B1 (en) 2013-05-01
BRPI1013063B1 (pt) 2020-11-17
US9423192B2 (en) 2016-08-23
CN102440086B (zh) 2015-03-25
BRPI1013063A8 (pt) 2019-07-30
US20120111553A1 (en) 2012-05-10
EP2433480A1 (en) 2012-03-28
EP2433480A4 (en) 2012-05-16
CN102440086A (zh) 2012-05-02

Similar Documents

Publication Publication Date Title
BRPI1013063A2 (pt) dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão
BR112013030665A2 (pt) arquitetura elétrica para distribuição de energia para equipamento submarino
BR112014000164A2 (pt) método para manufatura de uma casca de confeitaria aerada
FR2960241B1 (fr) Compositions notamment de transfert de chaleur
MX2009013354A (es) Compuestos de triarilo y composiciones que los contienen.
BR112013005227A2 (pt) &#34;módulo de arrefecimento e método para o fabrico de um módulo de arrefecimento&#34;.
EP2863725A4 (en) LED HEAT DISSIPATION STRUCTURE
SMT201600131B (it) Procedimento per la produzione di piastrine
IT1395260B1 (it) Struttura di raffreddamento di un gruppo elettrico per motocicli.
PL2675931T3 (pl) Stop Nl-Mo-Cr o niskiej rozszerzalności cieplnej w wysokiej temperaturze
BR112014027035A2 (pt) camisa de cilindro e respectivo método de produção
UY32704A (es) Compuestos de 2,3-dihidro-1h-indeno
MX2012000389A (es) Imidazoles fusionados y composiciones que los comprenden para el tratamiento de enfermedades parasitarias, tales como, por ejemplo, malaria.
EP2937908A4 (en) TRANSISTOR, TRANSISTOR HEAT DISTRIBUTION STRUCTURE, AND TRANSISTOR MANUFACTURING PROCESS
FR2995426B1 (fr) Methode de simulation des charges aerodynamiques instationnaires sur une structure externe d&#39;avion.
IT1403244B1 (it) Procedimento per la produzione di lipidi da biomassa.
EP2996696A4 (en) 4&#39;-AZIDO, 3&#39;-DEOXY-3&#39;-FLUOR-SUBSTITUTED NUCLEOSIDE DERIVATIVES
MX2015011621A (es) Instalacion de limpieza para componentes constructivos fabricados industrialmente.
EP2849207A4 (en) THERMAL REMOVAL SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
DK2491279T3 (da) Tætning imellem to elementer, som har forskellige termiske udvidelseskoefficienter
BRPI0816626A2 (pt) processo de fabricação de pelo menos um composto diéster
BR112013027240A2 (pt) chocolate termicamente tolerante
MX2013001612A (es) Moduladores de trpv3 novedosos.
UY32132A (es) Compuestos de imidazol y de triazol, su uso, así como productos que los contienen
EP3962254A4 (en) HEAT DISSIPATION STRUCTURE

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 17/11/2020, OBSERVADAS AS CONDICOES LEGAIS.