|
US3760237A
(en)
|
1972-06-21 |
1973-09-18 |
Gen Electric |
Solid state lamp assembly having conical light director
|
|
JPS5939839Y2
(ja)
|
1977-02-28 |
1984-11-08 |
株式会社三協精機製作所 |
直流電動機の速度制御回路
|
|
JPS53126570U
(pt)
|
1977-03-15 |
1978-10-07 |
|
|
|
US4152044A
(en)
|
1977-06-17 |
1979-05-01 |
International Telephone And Telegraph Corporation |
Galium aluminum arsenide graded index waveguide
|
|
JPS5479985A
(en)
|
1977-12-09 |
1979-06-26 |
Tokyo Shibaura Electric Co |
Ultrasonic scanning device
|
|
FR2436505A1
(fr)
|
1978-09-12 |
1980-04-11 |
Radiotechnique Compelec |
Dispositif optoelectronique a emetteur et recepteur couples
|
|
JPS604991B2
(ja)
|
1979-05-11 |
1985-02-07 |
株式会社東芝 |
ディスプレイ装置
|
|
JPS5927559Y2
(ja)
|
1979-06-08 |
1984-08-09 |
才市 岡本 |
防振装置
|
|
JPS587441U
(ja)
|
1981-07-08 |
1983-01-18 |
デイエツクスアンテナ株式会社 |
震動スイツチ
|
|
US4511425A
(en)
|
1983-06-13 |
1985-04-16 |
Dennison Manufacturing Company |
Heated pad decorator
|
|
US4675575A
(en)
|
1984-07-13 |
1987-06-23 |
E & G Enterprises |
Light-emitting diode assemblies and systems therefore
|
|
FR2586844B1
(fr)
|
1985-08-27 |
1988-04-29 |
Sofrela Sa |
Dispositif de signalisation utilisant des diodes electroluminescentes.
|
|
JPH0429580Y2
(pt)
|
1986-02-28 |
1992-07-17 |
|
|
|
JPH0416467Y2
(pt)
|
1986-03-31 |
1992-04-13 |
|
|
|
US4866005A
(en)
|
1987-10-26 |
1989-09-12 |
North Carolina State University |
Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
|
|
JPH0832120B2
(ja)
|
1988-05-27 |
1996-03-27 |
松下電器産業株式会社 |
音場可変装置
|
|
EP1022787B2
(de)
|
1989-05-31 |
2012-07-11 |
OSRAM Opto Semiconductors GmbH |
Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
|
|
US4946547A
(en)
|
1989-10-13 |
1990-08-07 |
Cree Research, Inc. |
Method of preparing silicon carbide surfaces for crystal growth
|
|
US5042048A
(en)
|
1990-03-02 |
1991-08-20 |
Meyer Brad E |
Target illuminators and systems employing same
|
|
US5167556A
(en)
|
1990-07-03 |
1992-12-01 |
Siemens Aktiengesellschaft |
Method for manufacturing a light emitting diode display means
|
|
US5130761A
(en)
|
1990-07-17 |
1992-07-14 |
Kabushiki Kaisha Toshiba |
Led array with reflector and printed circuit board
|
|
US5200022A
(en)
|
1990-10-03 |
1993-04-06 |
Cree Research, Inc. |
Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
|
|
US5122943A
(en)
|
1991-04-15 |
1992-06-16 |
Miles Inc. |
Encapsulated light emitting diode and method for encapsulation
|
|
US5351106A
(en)
|
1991-07-01 |
1994-09-27 |
Amergraph Corporation |
Exposure system
|
|
JP3151219B2
(ja)
|
1992-07-24 |
2001-04-03 |
テツセラ,インコーポレイテッド |
取り外し自在のリード支持体を備えた半導体接続構成体およびその製造方法
|
|
DE4228895C2
(de)
|
1992-08-29 |
2002-09-19 |
Bosch Gmbh Robert |
Kraftfahrzeug-Beleuchtungseinrichtung mit mehreren Halbleiterlichtquellen
|
|
JP3227295B2
(ja)
|
1993-12-28 |
2001-11-12 |
松下電工株式会社 |
発光ダイオードの製造方法
|
|
US5790298A
(en)
|
1994-05-03 |
1998-08-04 |
Gentex Corporation |
Method of forming optically transparent seal and seal formed by said method
|
|
DE4446566A1
(de)
|
1994-12-24 |
1996-06-27 |
Telefunken Microelectron |
Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
|
|
KR100372136B1
(ko)
|
1995-05-10 |
2003-03-15 |
코닌클리케 필립스 일렉트로닉스 엔.브이. |
반도체디바이스및그제조에적합한캐리어로드
|
|
DE19549818B4
(de)
|
1995-09-29 |
2010-03-18 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Halbleiter-Bauelement
|
|
AU2304997A
(en)
|
1996-03-19 |
1997-10-10 |
Donnelly Mirrors Limited |
Electro-optic rearview mirror system
|
|
US6600175B1
(en)
|
1996-03-26 |
2003-07-29 |
Advanced Technology Materials, Inc. |
Solid state white light emitter and display using same
|
|
DE19621124A1
(de)
|
1996-05-24 |
1997-11-27 |
Siemens Ag |
Optoelektronischer Wandler und dessen Herstellungsverfahren
|
|
JPH09321343A
(ja)
|
1996-05-31 |
1997-12-12 |
Dowa Mining Co Ltd |
光通信用の部品装置
|
|
DE19638667C2
(de)
|
1996-09-20 |
2001-05-17 |
Osram Opto Semiconductors Gmbh |
Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
|
|
JP3672280B2
(ja)
|
1996-10-29 |
2005-07-20 |
株式会社シチズン電子 |
スルーホール電極付き電子部品の製造方法
|
|
FR2759188B1
(fr)
|
1997-01-31 |
1999-04-30 |
Thery Hindrick |
Dispositif de signalisation lumineuse, notamment pour regulation du trafic routier
|
|
JP3741512B2
(ja)
|
1997-04-14 |
2006-02-01 |
ローム株式会社 |
Ledチップ部品
|
|
JP3882266B2
(ja)
|
1997-05-19 |
2007-02-14 |
日亜化学工業株式会社 |
半導体装置
|
|
US5813753A
(en)
|
1997-05-27 |
1998-09-29 |
Philips Electronics North America Corporation |
UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
|
|
DE19723176C1
(de)
|
1997-06-03 |
1998-08-27 |
Daimler Benz Ag |
Leistungshalbleiter-Bauelement und Verfahren zu dessen Herstellung
|
|
US6784463B2
(en)
|
1997-06-03 |
2004-08-31 |
Lumileds Lighting U.S., Llc |
III-Phospide and III-Arsenide flip chip light-emitting devices
|
|
WO1999007023A1
(de)
|
1997-07-29 |
1999-02-11 |
Osram Opto Semiconductors Gmbh & Co. Ohg |
Optoelektronisches bauelement
|
|
US6183100B1
(en)
|
1997-10-17 |
2001-02-06 |
Truck-Lite Co., Inc. |
Light emitting diode 360° warning lamp
|
|
DE19755734A1
(de)
|
1997-12-15 |
1999-06-24 |
Siemens Ag |
Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
|
|
RU2134000C1
(ru)
*
|
1997-12-31 |
1999-07-27 |
Абрамов Владимир Семенович |
Светодиодное устройство
|
|
DE19829197C2
(de)
|
1998-06-30 |
2002-06-20 |
Siemens Ag |
Strahlungsaussendendes und/oder -empfangendes Bauelement
|
|
US7253445B2
(en)
|
1998-07-28 |
2007-08-07 |
Paul Heremans |
High-efficiency radiating device
|
|
US5959316A
(en)
|
1998-09-01 |
1999-09-28 |
Hewlett-Packard Company |
Multiple encapsulation of phosphor-LED devices
|
|
US6274924B1
(en)
|
1998-11-05 |
2001-08-14 |
Lumileds Lighting, U.S. Llc |
Surface mountable LED package
|
|
JP3334864B2
(ja)
|
1998-11-19 |
2002-10-15 |
松下電器産業株式会社 |
電子装置
|
|
JP4279388B2
(ja)
|
1999-01-29 |
2009-06-17 |
日亜化学工業株式会社 |
光半導体装置及びその形成方法
|
|
JP3349109B2
(ja)
|
1999-03-04 |
2002-11-20 |
株式会社シチズン電子 |
表面実装型発光ダイオード及びその製造方法
|
|
US6259608B1
(en)
|
1999-04-05 |
2001-07-10 |
Delphi Technologies, Inc. |
Conductor pattern for surface mount devices and method therefor
|
|
JP2001042792A
(ja)
|
1999-05-24 |
2001-02-16 |
Sony Corp |
Led表示装置
|
|
CA2314679A1
(en)
|
1999-07-28 |
2001-01-28 |
William Kelly |
Improvements in and relating to ring lighting
|
|
JP2001060072A
(ja)
|
1999-08-23 |
2001-03-06 |
Matsushita Electric Ind Co Ltd |
表示装置
|
|
US6710373B2
(en)
|
1999-09-27 |
2004-03-23 |
Shih-Yi Wang |
Means for mounting photoelectric sensing elements, light emitting diodes, or the like
|
|
US6296367B1
(en)
|
1999-10-15 |
2001-10-02 |
Armament Systems And Procedures, Inc. |
Rechargeable flashlight with step-up voltage converter and recharger therefor
|
|
RU2179353C2
(ru)
*
|
1999-11-15 |
2002-02-10 |
Федеральное государственное унитарное предприятие "НИИПП" |
Полупроводниковый излучающий диод
|
|
US6486499B1
(en)
*
|
1999-12-22 |
2002-11-26 |
Lumileds Lighting U.S., Llc |
III-nitride light-emitting device with increased light generating capability
|
|
DE19964252A1
(de)
|
1999-12-30 |
2002-06-06 |
Osram Opto Semiconductors Gmbh |
Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle
|
|
DE10002521A1
(de)
|
2000-01-21 |
2001-08-09 |
Infineon Technologies Ag |
Elektrooptisches Datenübertragungsmodul
|
|
US6224216B1
(en)
|
2000-02-18 |
2001-05-01 |
Infocus Corporation |
System and method employing LED light sources for a projection display
|
|
JP3729012B2
(ja)
|
2000-02-24 |
2005-12-21 |
松下電工株式会社 |
Ledモジュール
|
|
US6517218B2
(en)
|
2000-03-31 |
2003-02-11 |
Relume Corporation |
LED integrated heat sink
|
|
US20020123163A1
(en)
|
2000-04-24 |
2002-09-05 |
Takehiro Fujii |
Edge-emitting light-emitting semiconductor device and method of manufacture thereof
|
|
US6330111B1
(en)
|
2000-06-13 |
2001-12-11 |
Kenneth J. Myers, Edward Greenberg |
Lighting elements including light emitting diodes, microprism sheet, reflector, and diffusing agent
|
|
JP4431756B2
(ja)
|
2000-06-23 |
2010-03-17 |
富士電機システムズ株式会社 |
樹脂封止型半導体装置
|
|
US6737801B2
(en)
|
2000-06-28 |
2004-05-18 |
The Fox Group, Inc. |
Integrated color LED chip
|
|
JP2002033058A
(ja)
|
2000-07-14 |
2002-01-31 |
Sony Corp |
電界放出型表示装置用の前面板
|
|
DE10041328B4
(de)
|
2000-08-23 |
2018-04-05 |
Osram Opto Semiconductors Gmbh |
Verpackungseinheit für Halbleiterchips
|
|
US6614103B1
(en)
|
2000-09-01 |
2003-09-02 |
General Electric Company |
Plastic packaging of LED arrays
|
|
EP1187226B1
(en)
|
2000-09-01 |
2012-12-26 |
Citizen Electronics Co., Ltd. |
Surface-mount type light emitting diode and method of manufacturing same
|
|
JP3839236B2
(ja)
|
2000-09-18 |
2006-11-01 |
株式会社小糸製作所 |
車両用灯具
|
|
JP2002151928A
(ja)
|
2000-11-08 |
2002-05-24 |
Toshiba Corp |
アンテナ、及びアンテナを内蔵する電子機器
|
|
WO2002051826A1
(en)
*
|
2000-12-22 |
2002-07-04 |
Eastman Chemical Company |
Continuous process for producing l-ascorbic acid
|
|
AT410266B
(de)
|
2000-12-28 |
2003-03-25 |
Tridonic Optoelectronics Gmbh |
Lichtquelle mit einem lichtemittierenden element
|
|
US6940704B2
(en)
|
2001-01-24 |
2005-09-06 |
Gelcore, Llc |
Semiconductor light emitting device
|
|
US6746889B1
(en)
|
2001-03-27 |
2004-06-08 |
Emcore Corporation |
Optoelectronic device with improved light extraction
|
|
EP1386357A1
(en)
|
2001-04-23 |
2004-02-04 |
Plasma Ireland Limited |
Illuminator
|
|
US20020163001A1
(en)
|
2001-05-04 |
2002-11-07 |
Shaddock David Mulford |
Surface mount light emitting device package and fabrication method
|
|
JP3844196B2
(ja)
|
2001-06-12 |
2006-11-08 |
シチズン電子株式会社 |
発光ダイオードの製造方法
|
|
JP2002374007A
(ja)
|
2001-06-15 |
2002-12-26 |
Toyoda Gosei Co Ltd |
発光装置
|
|
TW543128B
(en)
|
2001-07-12 |
2003-07-21 |
Highlink Technology Corp |
Surface mounted and flip chip type LED package
|
|
US20030015708A1
(en)
|
2001-07-23 |
2003-01-23 |
Primit Parikh |
Gallium nitride based diodes with low forward voltage and low reverse current operation
|
|
US6700136B2
(en)
|
2001-07-30 |
2004-03-02 |
General Electric Company |
Light emitting device package
|
|
US6812481B2
(en)
|
2001-09-03 |
2004-11-02 |
Toyoda Gosei Co., Ltd. |
LED device and manufacturing method thereof
|
|
EP1437776B1
(en)
|
2001-10-12 |
2011-09-21 |
Nichia Corporation |
Light emitting device and method for manufacture thereof
|
|
WO2003044870A1
(fr)
|
2001-11-22 |
2003-05-30 |
Mireille Georges |
Dispositif optique d'eclairage a diodes electroluminescentes
|
|
DE10241989A1
(de)
|
2001-11-30 |
2003-06-18 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauelement
|
|
JP4009097B2
(ja)
|
2001-12-07 |
2007-11-14 |
日立電線株式会社 |
発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
|
|
KR100439402B1
(ko)
|
2001-12-24 |
2004-07-09 |
삼성전기주식회사 |
발광다이오드 패키지
|
|
US6480389B1
(en)
|
2002-01-04 |
2002-11-12 |
Opto Tech Corporation |
Heat dissipation structure for solid-state light emitting device package
|
|
JP3973082B2
(ja)
|
2002-01-31 |
2007-09-05 |
シチズン電子株式会社 |
両面発光ledパッケージ
|
|
US6924514B2
(en)
|
2002-02-19 |
2005-08-02 |
Nichia Corporation |
Light-emitting device and process for producing thereof
|
|
JP2003258305A
(ja)
|
2002-02-27 |
2003-09-12 |
Oki Degital Imaging:Kk |
半導体素子アレイ
|
|
JP3939177B2
(ja)
|
2002-03-20 |
2007-07-04 |
シャープ株式会社 |
発光装置の製造方法
|
|
WO2004044877A2
(en)
|
2002-11-11 |
2004-05-27 |
Cotco International Limited |
A display device and method for making same
|
|
CN2549313Y
(zh)
|
2002-04-17 |
2003-05-07 |
杨英琪 |
大厦风扇夜光灯
|
|
JP2003324214A
(ja)
|
2002-04-30 |
2003-11-14 |
Omron Corp |
発光モジュール
|
|
EP1536487A4
(en)
|
2002-05-28 |
2008-02-06 |
Matsushita Electric Works Ltd |
ELECTROLUMINESCENT ELEMENT, LIGHT EMITTING DEVICE AND SURFACE EMISSION LIGHTING DEVICE USING THE SAME
|
|
JP3707688B2
(ja)
|
2002-05-31 |
2005-10-19 |
スタンレー電気株式会社 |
発光装置およびその製造方法
|
|
JP4002476B2
(ja)
|
2002-06-18 |
2007-10-31 |
ローム株式会社 |
半導体装置
|
|
WO2004001862A1
(ja)
|
2002-06-19 |
2003-12-31 |
Sanken Electric Co., Ltd. |
半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
|
|
TW546799B
(en)
|
2002-06-26 |
2003-08-11 |
Lingsen Precision Ind Ltd |
Packaged formation method of LED and product structure
|
|
DE10229067B4
(de)
|
2002-06-28 |
2007-08-16 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
|
|
NO317228B1
(no)
|
2002-07-01 |
2004-09-20 |
Bard Eker Ind Design As |
Projektor
|
|
JP2004047748A
(ja)
|
2002-07-12 |
2004-02-12 |
Stanley Electric Co Ltd |
発光ダイオード
|
|
JP4118742B2
(ja)
|
2002-07-17 |
2008-07-16 |
シャープ株式会社 |
発光ダイオードランプおよび発光ダイオード表示装置
|
|
AU2003298561A1
(en)
|
2002-08-23 |
2004-05-13 |
Jonathan S. Dahm |
Method and apparatus for using light emitting diodes
|
|
US7224000B2
(en)
|
2002-08-30 |
2007-05-29 |
Lumination, Llc |
Light emitting diode component
|
|
KR200299491Y1
(ko)
|
2002-09-02 |
2003-01-03 |
코리아옵토 주식회사 |
표면실장형 발광다이오드
|
|
US7264378B2
(en)
|
2002-09-04 |
2007-09-04 |
Cree, Inc. |
Power surface mount light emitting die package
|
|
US7244965B2
(en)
|
2002-09-04 |
2007-07-17 |
Cree Inc, |
Power surface mount light emitting die package
|
|
JP2004103775A
(ja)
|
2002-09-09 |
2004-04-02 |
Eeshikku Kk |
チップled発光体の製造方法およびチップled発光体
|
|
DE10243247A1
(de)
|
2002-09-17 |
2004-04-01 |
Osram Opto Semiconductors Gmbh |
Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung
|
|
JP2004128057A
(ja)
|
2002-09-30 |
2004-04-22 |
Fuji Photo Film Co Ltd |
発光装置およびその製造方法
|
|
JP2004146815A
(ja)
|
2002-09-30 |
2004-05-20 |
Sanyo Electric Co Ltd |
発光素子
|
|
US6686609B1
(en)
|
2002-10-01 |
2004-02-03 |
Ultrastar Limited |
Package structure of surface mounting led and method of manufacturing the same
|
|
US6717353B1
(en)
|
2002-10-14 |
2004-04-06 |
Lumileds Lighting U.S., Llc |
Phosphor converted light emitting device
|
|
US6730940B1
(en)
|
2002-10-29 |
2004-05-04 |
Lumileds Lighting U.S., Llc |
Enhanced brightness light emitting device spot emitter
|
|
DE10255932A1
(de)
|
2002-11-29 |
2004-06-17 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauelement
|
|
US7692206B2
(en)
|
2002-12-06 |
2010-04-06 |
Cree, Inc. |
Composite leadframe LED package and method of making the same
|
|
KR100495215B1
(ko)
|
2002-12-27 |
2005-06-14 |
삼성전기주식회사 |
수직구조 갈륨나이트라이드 발광다이오드 및 그 제조방법
|
|
JP4633333B2
(ja)
|
2003-01-23 |
2011-02-16 |
株式会社光波 |
発光装置
|
|
JP4603368B2
(ja)
|
2003-02-28 |
2010-12-22 |
オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング |
構造化された金属被覆を施されたパッケージボディを有するオプトエレクトロニクス素子、この種の素子を製作する方法、およびプラスチックを含むボディに、構造化された金属被覆を施す方法
|
|
USD517025S1
(en)
|
2003-03-17 |
2006-03-14 |
Nichia Corporation |
Light emitting diode
|
|
US20040188696A1
(en)
|
2003-03-28 |
2004-09-30 |
Gelcore, Llc |
LED power package
|
|
JP4504662B2
(ja)
|
2003-04-09 |
2010-07-14 |
シチズン電子株式会社 |
Ledランプ
|
|
EP1620903B1
(en)
|
2003-04-30 |
2017-08-16 |
Cree, Inc. |
High-power solid state light emitter package
|
|
US7087936B2
(en)
|
2003-04-30 |
2006-08-08 |
Cree, Inc. |
Methods of forming light-emitting devices having an antireflective layer that has a graded index of refraction
|
|
JP4341951B2
(ja)
|
2003-05-07 |
2009-10-14 |
シチズン電子株式会社 |
発光ダイオード及びそのパッケージ構造
|
|
JP2004335880A
(ja)
|
2003-05-09 |
2004-11-25 |
Toshiba Lighting & Technology Corp |
発光装置
|
|
US7021797B2
(en)
|
2003-05-13 |
2006-04-04 |
Light Prescriptions Innovators, Llc |
Optical device for repositioning and redistributing an LED's light
|
|
JP2004342870A
(ja)
|
2003-05-16 |
2004-12-02 |
Stanley Electric Co Ltd |
大電流駆動用発光ダイオード
|
|
JP4030463B2
(ja)
|
2003-05-20 |
2008-01-09 |
三洋電機株式会社 |
Led光源及びその製造方法
|
|
JP2004356506A
(ja)
|
2003-05-30 |
2004-12-16 |
Stanley Electric Co Ltd |
ガラス封止型発光ダイオード
|
|
JP3977774B2
(ja)
|
2003-06-03 |
2007-09-19 |
ローム株式会社 |
光半導体装置
|
|
JP4120813B2
(ja)
|
2003-06-12 |
2008-07-16 |
セイコーエプソン株式会社 |
光学部品およびその製造方法
|
|
JP4034241B2
(ja)
|
2003-06-27 |
2008-01-16 |
日本ライツ株式会社 |
光源装置および光源装置の製造方法
|
|
JP4360858B2
(ja)
|
2003-07-29 |
2009-11-11 |
シチズン電子株式会社 |
表面実装型led及びそれを用いた発光装置
|
|
US6876008B2
(en)
|
2003-07-31 |
2005-04-05 |
Lumileds Lighting U.S., Llc |
Mount for semiconductor light emitting device
|
|
JP2005064047A
(ja)
|
2003-08-13 |
2005-03-10 |
Citizen Electronics Co Ltd |
発光ダイオード
|
|
US6995402B2
(en)
|
2003-10-03 |
2006-02-07 |
Lumileds Lighting, U.S., Llc |
Integrated reflector cup for a light emitting device mount
|
|
US20050077535A1
(en)
|
2003-10-08 |
2005-04-14 |
Joinscan Electronics Co., Ltd |
LED and its manufacturing process
|
|
TWI291770B
(en)
|
2003-11-14 |
2007-12-21 |
Hon Hai Prec Ind Co Ltd |
Surface light source device and light emitting diode
|
|
US6932497B1
(en)
|
2003-12-17 |
2005-08-23 |
Jean-San Huang |
Signal light and rear-view mirror arrangement
|
|
JP2005183531A
(ja)
|
2003-12-17 |
2005-07-07 |
Sharp Corp |
半導体発光装置
|
|
US7102152B2
(en)
|
2004-10-14 |
2006-09-05 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Device and method for emitting output light using quantum dots and non-quantum fluorescent material
|
|
JP4442216B2
(ja)
|
2003-12-19 |
2010-03-31 |
豊田合成株式会社 |
Ledランプ装置
|
|
JP2005223222A
(ja)
|
2004-02-06 |
2005-08-18 |
Toyoda Gosei Co Ltd |
固体素子パッケージ
|
|
US7675231B2
(en)
|
2004-02-13 |
2010-03-09 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Light emitting diode display device comprising a high temperature resistant overlay
|
|
JP2005259754A
(ja)
|
2004-03-09 |
2005-09-22 |
Korai Kagi Kofun Yugenkoshi |
静電破壊防止可能な発光ダイオード装置
|
|
US20050199899A1
(en)
*
|
2004-03-11 |
2005-09-15 |
Ming-Der Lin |
Package array and package unit of flip chip LED
|
|
JP2005259972A
(ja)
|
2004-03-11 |
2005-09-22 |
Stanley Electric Co Ltd |
表面実装型led
|
|
JP2005310756A
(ja)
|
2004-03-26 |
2005-11-04 |
Koito Mfg Co Ltd |
光源モジュールおよび車両用前照灯
|
|
US7514867B2
(en)
|
2004-04-19 |
2009-04-07 |
Panasonic Corporation |
LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof
|
|
WO2005103199A1
(en)
*
|
2004-04-27 |
2005-11-03 |
Matsushita Electric Industrial Co., Ltd. |
Phosphor composition and method for producing the same, and light-emitting device using the same
|
|
JP2005347401A
(ja)
|
2004-06-01 |
2005-12-15 |
Meiko:Kk |
光素子チップ部品
|
|
TWM258416U
(en)
|
2004-06-04 |
2005-03-01 |
Lite On Technology Corp |
Power LED package module
|
|
US20070295975A1
(en)
|
2004-06-25 |
2007-12-27 |
Sanyo Electric Co., Ltd. |
Light-Emitting Device
|
|
WO2006005062A2
(en)
|
2004-06-30 |
2006-01-12 |
Cree, Inc. |
Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
|
|
JP2006019557A
(ja)
|
2004-07-02 |
2006-01-19 |
Fujikura Ltd |
発光装置とその実装方法、照明器具及びディスプレイ
|
|
WO2006016398A1
(ja)
|
2004-08-10 |
2006-02-16 |
Renesas Technology Corp. |
発光装置および発光装置の製造方法
|
|
JP4547569B2
(ja)
|
2004-08-31 |
2010-09-22 |
スタンレー電気株式会社 |
表面実装型led
|
|
JP4747726B2
(ja)
*
|
2004-09-09 |
2011-08-17 |
豊田合成株式会社 |
発光装置
|
|
EP1794808B1
(en)
|
2004-09-10 |
2017-08-09 |
Seoul Semiconductor Co., Ltd. |
Light emitting diode package having multiple molding resins
|
|
JP2006108517A
(ja)
|
2004-10-08 |
2006-04-20 |
Citizen Watch Co Ltd |
Led接続用基板及びそれを用いた照明装置及びそれを用いた表示装置
|
|
JP2006114854A
(ja)
|
2004-10-18 |
2006-04-27 |
Sharp Corp |
半導体発光装置、液晶表示装置用のバックライト装置
|
|
KR101080355B1
(ko)
|
2004-10-18 |
2011-11-04 |
삼성전자주식회사 |
발광다이오드와 그 렌즈
|
|
US20060097385A1
(en)
|
2004-10-25 |
2006-05-11 |
Negley Gerald H |
Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
|
|
EP1653255A3
(en)
|
2004-10-29 |
2006-06-21 |
Pentair Water Pool and Spa, Inc. |
Selectable beam lens for underwater light
|
|
US8816369B2
(en)
|
2004-10-29 |
2014-08-26 |
Led Engin, Inc. |
LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
|
|
JP4796293B2
(ja)
|
2004-11-04 |
2011-10-19 |
株式会社 日立ディスプレイズ |
照明装置の製造方法
|
|
US7303315B2
(en)
|
2004-11-05 |
2007-12-04 |
3M Innovative Properties Company |
Illumination assembly using circuitized strips
|
|
JP2006140281A
(ja)
|
2004-11-11 |
2006-06-01 |
Stanley Electric Co Ltd |
パワーled及びその製造方法
|
|
US7419839B2
(en)
|
2004-11-12 |
2008-09-02 |
Philips Lumileds Lighting Company, Llc |
Bonding an optical element to a light emitting device
|
|
US7119422B2
(en)
|
2004-11-15 |
2006-10-10 |
Unity Opto Technology Co., Ltd. |
Solid-state semiconductor light emitting device
|
|
US8541797B2
(en)
|
2004-11-18 |
2013-09-24 |
Koninklijke Philips N.V. |
Illuminator and method for producing such illuminator
|
|
JP4902114B2
(ja)
|
2004-12-16 |
2012-03-21 |
日亜化学工業株式会社 |
発光装置
|
|
WO2006065007A1
(en)
|
2004-12-16 |
2006-06-22 |
Seoul Semiconductor Co., Ltd. |
Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
|
|
JP4591071B2
(ja)
|
2004-12-20 |
2010-12-01 |
日亜化学工業株式会社 |
半導体装置
|
|
US7285802B2
(en)
|
2004-12-21 |
2007-10-23 |
3M Innovative Properties Company |
Illumination assembly and method of making same
|
|
US9793247B2
(en)
|
2005-01-10 |
2017-10-17 |
Cree, Inc. |
Solid state lighting component
|
|
US9070850B2
(en)
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
|
US7821023B2
(en)
|
2005-01-10 |
2010-10-26 |
Cree, Inc. |
Solid state lighting component
|
|
JP5140922B2
(ja)
|
2005-01-17 |
2013-02-13 |
オムロン株式会社 |
発光光源及び発光光源アレイ
|
|
TWI255566B
(en)
|
2005-03-04 |
2006-05-21 |
Jemitek Electronics Corp |
Led
|
|
US7262438B2
(en)
|
2005-03-08 |
2007-08-28 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
LED mounting having increased heat dissipation
|
|
US7994702B2
(en)
|
2005-04-27 |
2011-08-09 |
Prysm, Inc. |
Scanning beams displays based on light-emitting screens having phosphors
|
|
JP2006332234A
(ja)
|
2005-05-25 |
2006-12-07 |
Hitachi Aic Inc |
反射機能を有するled装置
|
|
CN1874011A
(zh)
|
2005-06-03 |
2006-12-06 |
邢陈震仑 |
一种发光二极管装置
|
|
JP4064412B2
(ja)
|
2005-06-07 |
2008-03-19 |
株式会社フジクラ |
発光素子実装用基板および発光素子モジュール
|
|
US9412926B2
(en)
|
2005-06-10 |
2016-08-09 |
Cree, Inc. |
High power solid-state lamp
|
|
US8669572B2
(en)
|
2005-06-10 |
2014-03-11 |
Cree, Inc. |
Power lamp package
|
|
JP2007012323A
(ja)
|
2005-06-28 |
2007-01-18 |
Cheil Ind Co Ltd |
面光源装置及び液晶表示装置
|
|
KR100757196B1
(ko)
|
2005-08-01 |
2007-09-07 |
서울반도체 주식회사 |
실리콘 렌즈를 구비하는 발광소자
|
|
US20070034886A1
(en)
|
2005-08-11 |
2007-02-15 |
Wong Boon S |
PLCC package with integrated lens and method for making the package
|
|
JP3948488B2
(ja)
|
2005-09-09 |
2007-07-25 |
松下電工株式会社 |
発光装置
|
|
US20070096139A1
(en)
|
2005-11-02 |
2007-05-03 |
3M Innovative Properties Company |
Light emitting diode encapsulation shape control
|
|
JP4724618B2
(ja)
|
2005-11-11 |
2011-07-13 |
株式会社 日立ディスプレイズ |
照明装置及びそれを用いた液晶表示装置
|
|
JP2007184542A
(ja)
|
2005-12-09 |
2007-07-19 |
Matsushita Electric Ind Co Ltd |
発光モジュールとその製造方法並びにそれを用いたバックライト装置
|
|
JP2007201420A
(ja)
|
2005-12-27 |
2007-08-09 |
Sharp Corp |
半導体発光装置、半導体発光素子、および半導体発光装置の製造方法
|
|
JP2007189150A
(ja)
|
2006-01-16 |
2007-07-26 |
Enomoto Co Ltd |
低背ledデバイス用リードフレーム及びその製造方法
|
|
US7528422B2
(en)
|
2006-01-20 |
2009-05-05 |
Hymite A/S |
Package for a light emitting element with integrated electrostatic discharge protection
|
|
US20070170449A1
(en)
|
2006-01-24 |
2007-07-26 |
Munisamy Anandan |
Color sensor integrated light emitting diode for LED backlight
|
|
USD572670S1
(en)
|
2006-03-30 |
2008-07-08 |
Nichia Corporation |
Light emitting diode
|
|
JP2007273763A
(ja)
|
2006-03-31 |
2007-10-18 |
Sony Corp |
半導体装置およびその製造方法
|
|
WO2007121486A2
(en)
|
2006-04-18 |
2007-10-25 |
Lamina Lighting, Inc. |
Optical devices for controlled color mixing
|
|
US7635915B2
(en)
|
2006-04-26 |
2009-12-22 |
Cree Hong Kong Limited |
Apparatus and method for use in mounting electronic elements
|
|
JP4830768B2
(ja)
|
2006-05-10 |
2011-12-07 |
日亜化学工業株式会社 |
半導体発光装置及び半導体発光装置の製造方法
|
|
US20070269586A1
(en)
|
2006-05-17 |
2007-11-22 |
3M Innovative Properties Company |
Method of making light emitting device with silicon-containing composition
|
|
JP5119610B2
(ja)
|
2006-05-26 |
2013-01-16 |
日亜化学工業株式会社 |
発光ダイオード
|
|
KR100789951B1
(ko)
|
2006-06-09 |
2008-01-03 |
엘지전자 주식회사 |
발광 유닛 제작 장치 및 방법
|
|
KR100904152B1
(ko)
|
2006-06-30 |
2009-06-25 |
서울반도체 주식회사 |
히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
|
|
TWM303325U
(en)
|
2006-07-13 |
2006-12-21 |
Everlight Electronics Co Ltd |
Light emitting diode package
|
|
US7960819B2
(en)
|
2006-07-13 |
2011-06-14 |
Cree, Inc. |
Leadframe-based packages for solid state emitting devices
|
|
RU2317612C1
(ru)
*
|
2006-07-24 |
2008-02-20 |
Александр Эдуардович Пуйша |
Светодиодное устройство
|
|
US7943952B2
(en)
|
2006-07-31 |
2011-05-17 |
Cree, Inc. |
Method of uniform phosphor chip coating and LED package fabricated using method
|
|
US7804147B2
(en)
|
2006-07-31 |
2010-09-28 |
Cree, Inc. |
Light emitting diode package element with internal meniscus for bubble free lens placement
|
|
JP5564162B2
(ja)
|
2006-09-29 |
2014-07-30 |
フューチャー ライト リミテッド ライアビリティ カンパニー |
発光ダイオード装置
|
|
TWI313943B
(en)
|
2006-10-24 |
2009-08-21 |
Chipmos Technologies Inc |
Light emitting chip package and manufacturing thereof
|
|
USD572210S1
(en)
|
2006-11-01 |
2008-07-01 |
Lg Innotek Co., Ltd. |
Light-emitting diode (LED)
|
|
KR101329413B1
(ko)
|
2006-12-19 |
2013-11-14 |
엘지디스플레이 주식회사 |
광학 렌즈, 이를 구비하는 광학 모듈 및 이를 구비하는백라이트 유닛
|
|
US7687823B2
(en)
|
2006-12-26 |
2010-03-30 |
Nichia Corporation |
Light-emitting apparatus and method of producing the same
|
|
JP5168152B2
(ja)
|
2006-12-28 |
2013-03-21 |
日亜化学工業株式会社 |
発光装置
|
|
CN101507004B
(zh)
|
2006-12-28 |
2011-04-20 |
日亚化学工业株式会社 |
发光装置、封装体、发光装置的制造方法、封装体的制造方法以及封装体制造用模具
|
|
KR100788265B1
(ko)
|
2006-12-28 |
2007-12-27 |
서울반도체 주식회사 |
다수의 수직형 발광소자를 구비하는 발광 다이오드 패키지
|
|
US7800304B2
(en)
|
2007-01-12 |
2010-09-21 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Multi-chip packaged LED light source
|
|
JP5106862B2
(ja)
|
2007-01-15 |
2012-12-26 |
昭和電工株式会社 |
発光ダイオードパッケージ
|
|
CN100550374C
(zh)
|
2007-01-30 |
2009-10-14 |
深圳市联众达光电有限公司 |
Led封装结构及封装方法
|
|
JP4689637B2
(ja)
|
2007-03-23 |
2011-05-25 |
シャープ株式会社 |
半導体発光装置
|
|
US7964888B2
(en)
|
2007-04-18 |
2011-06-21 |
Cree, Inc. |
Semiconductor light emitting device packages and methods
|
|
US7622795B2
(en)
|
2007-05-15 |
2009-11-24 |
Nichepac Technology Inc. |
Light emitting diode package
|
|
US7923831B2
(en)
|
2007-05-31 |
2011-04-12 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
LED-based light source having improved thermal dissipation
|
|
DE202007012162U1
(de)
|
2007-06-05 |
2008-03-20 |
Seoul Semiconductor Co., Ltd. |
LED-Gehäuse
|
|
US7843060B2
(en)
|
2007-06-11 |
2010-11-30 |
Cree, Inc. |
Droop-free high output light emitting devices and methods of fabricating and operating same
|
|
JP4107349B2
(ja)
|
2007-06-20 |
2008-06-25 |
ソニー株式会社 |
光源装置、表示装置
|
|
USD576574S1
(en)
|
2007-07-17 |
2008-09-09 |
Rohm Co., Ltd. |
Light emitting diode module
|
|
US7968899B2
(en)
|
2007-08-27 |
2011-06-28 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
LED light source having improved resistance to thermal cycling
|
|
DE102007041136A1
(de)
|
2007-08-30 |
2009-03-05 |
Osram Opto Semiconductors Gmbh |
LED-Gehäuse
|
|
JP2007329516A
(ja)
|
2007-09-14 |
2007-12-20 |
Sharp Corp |
半導体発光装置
|
|
CN101388161A
(zh)
|
2007-09-14 |
2009-03-18 |
科锐香港有限公司 |
Led表面安装装置和并入有此装置的led显示器
|
|
US9012937B2
(en)
*
|
2007-10-10 |
2015-04-21 |
Cree, Inc. |
Multiple conversion material light emitting diode package and method of fabricating same
|
|
US7524087B1
(en)
|
2007-11-16 |
2009-04-28 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Optical device
|
|
US8049230B2
(en)
|
2008-05-16 |
2011-11-01 |
Cree Huizhou Opto Limited |
Apparatus and system for miniature surface mount devices
|
|
EA019225B1
(ru)
|
2008-06-15 |
2014-02-28 |
Ривинью Лтд. |
Способ изготовления линзы для установки на светодиоде
|
|
JP5284006B2
(ja)
|
2008-08-25 |
2013-09-11 |
シチズン電子株式会社 |
発光装置
|
|
US9425172B2
(en)
|
2008-10-24 |
2016-08-23 |
Cree, Inc. |
Light emitter array
|
|
GB2466633A
(en)
|
2008-12-12 |
2010-07-07 |
Glory Science Co Ltd |
Method of manufacturing a light emitting unit
|
|
JP2010199547A
(ja)
|
2009-01-30 |
2010-09-09 |
Nichia Corp |
発光装置及びその製造方法
|
|
US20110049545A1
(en)
|
2009-09-02 |
2011-03-03 |
Koninklijke Philips Electronics N.V. |
Led package with phosphor plate and reflective substrate
|
|
US8778706B2
(en)
|
2009-11-05 |
2014-07-15 |
Luminit Llc |
Method to provide microstructure for encapsulated high-brightness LED chips
|
|
JP5678629B2
(ja)
|
2010-02-09 |
2015-03-04 |
ソニー株式会社 |
発光装置の製造方法
|
|
KR101659357B1
(ko)
|
2010-05-12 |
2016-09-23 |
엘지이노텍 주식회사 |
발광소자패키지
|
|
WO2012099145A1
(ja)
|
2011-01-20 |
2012-07-26 |
シャープ株式会社 |
発光装置、照明装置、表示装置及び発光装置の製造方法
|
|
US20120257386A1
(en)
|
2011-06-24 |
2012-10-11 |
Xicato, Inc. |
Led based illumination module with a reflective mask
|