CA1027259A - Double extruded semiconductor mount - Google Patents

Double extruded semiconductor mount

Info

Publication number: CA1027259A
Authority: CA; Canada
Prior art keywords: semiconductor mount; double extruded; extruded semiconductor; mount; double
Prior art date: 1974-10-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA229,779A

Other languages

English (en)

French (fr)

Other versions

CA229779S (en

Inventor

Russell A. Nippert

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Luvata Ohio Inc

Original Assignee

Nippert Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-10-03

Filing date

1975-06-20

Publication date

1978-02-28

1975-06-20 Application filed by Nippert Co filed Critical Nippert Co

1978-02-28 Application granted granted Critical

1978-02-28 Publication of CA1027259A publication Critical patent/CA1027259A/en

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
- H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49925—Inward deformation of aperture or hollow body wall
- Y10T29/49934—Inward deformation of aperture or hollow body wall by axially applying force
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/49—Member deformed in situ
- Y10T403/4991—Both members deformed

CA229,779A 1974-10-03 1975-06-20 Double extruded semiconductor mount Expired CA1027259A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US511939A US3918625A (en)	1974-10-03	1974-10-03	Method of making a double extruded semiconductor joint

Publications (1)

Publication Number	Publication Date
CA1027259A true CA1027259A (en)	1978-02-28

Family

ID=24037049

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA229,779A Expired CA1027259A (en)	1974-10-03	1975-06-20	Double extruded semiconductor mount

Country Status (11)

Country	Link
US (1)	US3918625A (ja)
JP (1)	JPS5731297B2 (ja)
CA (1)	CA1027259A (ja)
CH (1)	CH590559A5 (ja)
DE (1)	DE2529789C3 (ja)
DK (1)	DK445375A (ja)
FR (1)	FR2287106A1 (ja)
GB (1)	GB1525122A (ja)
IT (1)	IT1036425B (ja)
NL (1)	NL176413C (ja)
SE (1)	SE408352B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4192063A (en) *	1975-12-10	1980-03-11	Yoshio Sato	Method for manufacturing a base of a semi-conductor device
US4049185A (en) *	1977-03-11	1977-09-20	The Nippert Company	Method of forming double extruded mount
US4624303A (en) *	1985-04-29	1986-11-25	The Nippert Company	Heat sink mounting and method of making
US4985978A (en) *	1988-03-01	1991-01-22	Textron Inc.	Method for assembling a self-clinching fastening structure
US6453558B1 (en) *	2001-04-06	2002-09-24	Arvinmeritor, Inc.	Method of locking together exhaust components
US7247564B2 (en) *	2004-06-28	2007-07-24	Hewlett-Packard Development Company, L.P.	Electronic device
US10446351B2 (en) *	2017-06-06	2019-10-15	Littelfuse, Inc.	Electrical contact assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2419469A (en) *	1943-04-24	1947-04-22	Gen Electric	Manufacturing method for electrical contacts
US3042428A (en) *	1954-04-05	1962-07-03	Gen Electric	Copper-aluminum tubular connector
US3191268A (en) *	1958-02-28	1965-06-29	Gen Motors Corp	Process for encapsulating transistors
NL266908A (ja) *	1959-05-15
NL270996A (ja) *	1960-11-09
US3198874A (en) *	1961-01-23	1965-08-03	Standard Pressed Steel Co	Semi-conductor housings and method of making the same
US3197843A (en) *	1961-05-19	1965-08-03	Nippert Electric Products Comp	Method of forming a mount for semiconductors
NL142278B (nl) *	1964-06-20	1974-05-15	Philips Nv	Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.
NL7115486A (ja) *	1970-11-16	1972-05-18

1974
- 1974-10-03 US US511939A patent/US3918625A/en not_active Expired - Lifetime
1975
- 1975-06-17 SE SE7506919A patent/SE408352B/xx not_active IP Right Cessation
- 1975-06-20 CA CA229,779A patent/CA1027259A/en not_active Expired
- 1975-07-02 IT IT68717/75A patent/IT1036425B/it active
- 1975-07-03 DE DE2529789A patent/DE2529789C3/de not_active Expired
- 1975-07-31 FR FR7524053A patent/FR2287106A1/fr active Granted
- 1975-08-14 JP JP9905575A patent/JPS5731297B2/ja not_active Expired
- 1975-08-25 CH CH1097675A patent/CH590559A5/xx not_active IP Right Cessation
- 1975-09-05 NL NLAANVRAGE7510492,A patent/NL176413C/xx not_active IP Right Cessation
- 1975-10-02 DK DK445375A patent/DK445375A/da unknown
- 1975-10-02 GB GB40421/75A patent/GB1525122A/en not_active Expired

Also Published As

Publication number	Publication date
DE2529789A1 (de)	1976-04-15
FR2287106B1 (ja)	1982-05-28
DE2529789B2 (de)	1980-07-03
SE408352B (sv)	1979-06-05
NL176413B (nl)	1984-11-01
JPS5731297B2 (ja)	1982-07-03
SE7506919L (sv)	1976-04-05
CH590559A5 (ja)	1977-08-15
DK445375A (da)	1976-04-04
NL7510492A (nl)	1976-04-06
NL176413C (nl)	1985-04-01
JPS5148276A (ja)	1976-04-24
US3918625A (en)	1975-11-11
GB1525122A (en)	1978-09-20
DE2529789C3 (de)	1981-12-10
IT1036425B (it)	1979-10-30
FR2287106A1 (fr)	1976-04-30

Publication	Publication Date	Title
AU475560B2 (en)	1976-08-26	Extrusion
CA1023316A (en)	1977-12-27	Extrusion device
CA1029098A (en)	1978-04-04	Composite transistor circuit
AU8214975A (en)	1976-12-23	Complementary transistor structure
AU497677B2 (en)	1978-12-21	Extrusion method
CA1026060A (en)	1978-02-14	Adhesive extruding nozzle - guidance arrangement
CA1015070A (en)	1977-08-02	Semiconductor components
CA1026335A (en)	1978-02-14	Substituted 1-sulfonylbenzimidazoles
CA1027675A (en)	1978-03-07	Mask-exposure scheme
CA1018478A (en)	1977-10-04	Extrusion process
CA1030184A (en)	1978-04-25	Threaded connections
AU497162B2 (en)	1978-12-07	Extrusion press
CA1009176A (en)	1977-04-26	Parison unloader
GB1514750A (en)	1978-06-21	Extrusion
CA1022407A (en)	1977-12-13	Extrusion tool
AU493168B2 (en)	1976-06-24	Semiconductor assemblies
AU490907B2 (en)	1977-04-07	2-phenylimino imidazolidines
AU7687474A (en)	1976-06-24	Semiconductor assemblies
AU487139B2 (en)	1977-04-28	Extrusion apparatus
AU478424B2 (en)	1976-12-02	Extrusion tool
AU489055B2 (en)	1976-07-01	Substituted cycloalkano-thiophenes
AU495258B2 (en)	1976-11-25	Substituted penylene dioxamates
AU493642B2 (en)	1977-01-06	Substituted 1-sulfonylbenzimidazoles
AU493137B2 (en)	1977-02-24	Polyene compounds
AU482931B2 (en)	1976-02-12	Polyene compounds