CA1037519A - Method of producing nozzles in monocrystalline silicon wafer - Google Patents

Method of producing nozzles in monocrystalline silicon wafer

Info

Publication number: CA1037519A
Authority: CA; Canada
Prior art keywords: silicon; layer; cross; section; sectional area
Prior art date: 1974-12-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA240,350A

Other languages

English (en)

French (fr)

Other versions

CA240350S (en

Inventor

Ernest Bassous

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-12-31

Filing date

1975-11-21

Publication date

1978-08-29

1975-11-21 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1978-08-29 Application granted granted Critical

1978-08-29 Publication of CA1037519A publication Critical patent/CA1037519A/en

Status Expired legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 48
229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 24
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
229910052710 silicon Inorganic materials 0.000 claims abstract description 37
239000010703 silicon Substances 0.000 claims abstract description 37
238000005530 etching Methods 0.000 claims abstract description 17
239000000463 material Substances 0.000 claims abstract description 12
239000010410 layer Substances 0.000 claims description 36
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
239000000203 mixture Substances 0.000 claims description 15
239000002019 doping agent Substances 0.000 claims description 12
239000004065 semiconductor Substances 0.000 claims description 12
229910052581 Si3N4 Inorganic materials 0.000 claims description 11
235000012239 silicon dioxide Nutrition 0.000 claims description 11
230000000873 masking effect Effects 0.000 claims description 10
239000000377 silicon dioxide Substances 0.000 claims description 10
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
239000002344 surface layer Substances 0.000 claims description 6
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
150000001412 amines Chemical class 0.000 claims description 4
238000005468 ion implantation Methods 0.000 claims description 4
238000009792 diffusion process Methods 0.000 claims description 3
239000012528 membrane Substances 0.000 claims description 3
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
150000002989 phenols Chemical class 0.000 claims description 3
IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims 2
PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
150000004985 diamines Chemical class 0.000 claims 1
239000012530 fluid Substances 0.000 abstract description 14
239000012535 impurity Substances 0.000 abstract description 6
238000004519 manufacturing process Methods 0.000 abstract description 4
230000004888 barrier function Effects 0.000 abstract description 2
230000015572 biosynthetic process Effects 0.000 description 5
238000007641 inkjet printing Methods 0.000 description 4
238000003491 array Methods 0.000 description 3
239000013078 crystal Substances 0.000 description 3
238000009826 distribution Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
150000002500 ions Chemical class 0.000 description 3
239000007788 liquid Substances 0.000 description 3
239000002210 silicon-based material Substances 0.000 description 3
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
239000005977 Ethylene Substances 0.000 description 2
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
238000005553 drilling Methods 0.000 description 2
238000010894 electron beam technology Methods 0.000 description 2
239000007789 gas Substances 0.000 description 2
238000007689 inspection Methods 0.000 description 2
230000003647 oxidation Effects 0.000 description 2
238000007254 oxidation reaction Methods 0.000 description 2
239000007787 solid Substances 0.000 description 2
239000000126 substance Substances 0.000 description 2
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
244000228957 Ferula foetida Species 0.000 description 1
GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
229910001218 Gallium arsenide Inorganic materials 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
241001282736 Oriens Species 0.000 description 1
244000046052 Phaseolus vulgaris Species 0.000 description 1
235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
241001074085 Scophthalmus aquosus Species 0.000 description 1
FRIKWZARTBPWBN-UHFFFAOYSA-N [Si].O=[Si]=O Chemical compound [Si].O=[Si]=O FRIKWZARTBPWBN-UHFFFAOYSA-N 0.000 description 1
235000011054 acetic acid Nutrition 0.000 description 1
150000001243 acetic acids Chemical class 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910000147 aluminium phosphate Inorganic materials 0.000 description 1
229910052796 boron Inorganic materials 0.000 description 1
239000003153 chemical reaction reagent Substances 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
239000000470 constituent Substances 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000000866 electrolytic etching Methods 0.000 description 1
230000005670 electromagnetic radiation Effects 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
229910052733 gallium Inorganic materials 0.000 description 1
239000010437 gem Substances 0.000 description 1
229910052732 germanium Inorganic materials 0.000 description 1
GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
239000011521 glass Substances 0.000 description 1
229910021397 glassy carbon Inorganic materials 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
238000002513 implantation Methods 0.000 description 1
LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 1
150000004767 nitrides Chemical class 0.000 description 1
239000012299 nitrogen atmosphere Substances 0.000 description 1
239000007800 oxidant agent Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
230000000737 periodic effect Effects 0.000 description 1
239000012286 potassium permanganate Substances 0.000 description 1
238000007639 printing Methods 0.000 description 1
239000010453 quartz Substances 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
238000000992 sputter etching Methods 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
239000007858 starting material Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B9/00—Blowing glass; Production of hollow glass articles
- C03B9/30—Details of blowing glass; Use of materials for the moulds
- C03B9/32—Giving special shapes to parts of hollow glass articles
- C03B9/33—Making hollow glass articles with feet or projections; Moulds therefor
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S239/00—Fluid sprinkling, spraying, and diffusing
- Y10S239/19—Nozzle materials

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Geometry (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Weting (AREA)
Nozzles (AREA)
Facsimile Heads (AREA)

CA240,350A 1974-12-31 1975-11-21 Method of producing nozzles in monocrystalline silicon wafer Expired CA1037519A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US537799A US3921916A (en)	1974-12-31	1974-12-31	Nozzles formed in monocrystalline silicon

Publications (1)

Publication Number	Publication Date
CA1037519A true CA1037519A (en)	1978-08-29

Family

ID=24144139

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA240,350A Expired CA1037519A (en)	1974-12-31	1975-11-21	Method of producing nozzles in monocrystalline silicon wafer

Country Status (7)

Country	Link
US (1)	US3921916A (2)
JP (1)	JPS5516070B2 (2)
CA (1)	CA1037519A (2)
DE (1)	DE2555462C2 (2)
FR (1)	FR2296504A1 (2)
GB (1)	GB1492465A (2)
IT (1)	IT1054354B (2)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4007464A (en) *	1975-01-23	1977-02-08	International Business Machines Corporation	Ink jet nozzle
US4014029A (en) *	1975-12-31	1977-03-22	International Business Machines Corporation	Staggered nozzle array
US4047184A (en) *	1976-01-28	1977-09-06	International Business Machines Corporation	Charge electrode array and combination for ink jet printing and method of manufacture
US4106976A (en) *	1976-03-08	1978-08-15	International Business Machines Corporation	Ink jet nozzle method of manufacture
US4035812A (en) *	1976-07-12	1977-07-12	The Mead Corporation	Ink jet recorder and charge ring plate therefor with reduced deplating current
US4169008A (en) *	1977-06-13	1979-09-25	International Business Machines Corporation	Process for producing uniform nozzle orifices in silicon wafers
US4146899A (en) *	1977-10-13	1979-03-27	The Mead Corporation	Formed orifice plate for ink jet printing apparatus
US4184925A (en) *	1977-12-19	1980-01-22	The Mead Corporation	Solid metal orifice plate for a jet drop recorder
US4239586A (en) *	1979-06-29	1980-12-16	International Business Machines Corporation	Etching of multiple holes of uniform size
US4229265A (en) *	1979-08-09	1980-10-21	The Mead Corporation	Method for fabricating and the solid metal orifice plate for a jet drop recorder produced thereby
US4430784A (en) *	1980-02-22	1984-02-14	Celanese Corporation	Manufacturing process for orifice nozzle devices for ink jet printing apparati
US4282533A (en) *	1980-02-22	1981-08-04	Celanese Corporation	Precision orifice nozzle devices for ink jet printing apparati and the process for their manufacture
JPS5764563A (en) *	1980-10-07	1982-04-19	Fuji Xerox Co Ltd	Ink particle jet apparatus of multi-nozzle ink jet printer
JPS57182449A (en) *	1981-05-07	1982-11-10	Fuji Xerox Co Ltd	Forming method of ink jet multinozzle
JPS57208262A (en) *	1981-06-18	1982-12-21	Ibm	Drop-on demand type ink jet printing method
DE3176140D1 (en) *	1981-10-30	1987-05-27	Ibm Deutschland	Contact device for the detachable connection of electrical components
US4555062A (en) *	1983-04-05	1985-11-26	Hewlett-Packard Company	Anti-wetting in fluid nozzles
US4583690A (en) *	1983-04-05	1986-04-22	Hewlett-Packard Company	Anti-wetting in fluid nozzles
DE3477977D1 (en) *	1983-12-08	1989-06-01	Gen Signal Corp	Isfet sensor and method of manufacture
EP0177316B1 (en) *	1984-09-28	1991-06-19	Matsushita Electric Industrial Co., Ltd.	Method for fabricating an ink jet printer nozzle member
CA1237020A (en) *	1984-10-13	1988-05-24	Herbert A. Waggener	Silicon nozzle structure and method of manufacture
US4733823A (en) *	1984-10-15	1988-03-29	At&T Teletype Corporation	Silicon nozzle structures and method of manufacture
US4756508A (en) *	1985-02-21	1988-07-12	Ford Motor Company	Silicon valve
US4628576A (en) *	1985-02-21	1986-12-16	Ford Motor Company	Method for fabricating a silicon valve
US4647013A (en) *	1985-02-21	1987-03-03	Ford Motor Company	Silicon valve
US4768751A (en) *	1987-10-19	1988-09-06	Ford Motor Company	Silicon micromachined non-elastic flow valves
US5014750A (en) *	1988-03-14	1991-05-14	Baxter International Inc.	Systems having fixed and variable flow rate control mechanisms
US5176360A (en) *	1988-03-14	1993-01-05	Baxter International Inc.	Infusor having fixed and variable flow rate control mechanisms
DE68910965T2 (de) *	1988-03-14	1994-06-30	Baxter Int	Vorrichtung mit fester und einstellbarem strömungsgeschwindigkeits-regelungsmechanismus.
US5009251A (en) *	1988-11-15	1991-04-23	Baxter International, Inc.	Fluid flow control
SG45171A1 (en) *	1990-03-21	1998-01-16	Boehringer Ingelheim Int	Atomising devices and methods
DE4112150C2 (de) *	1990-09-21	1998-11-19	Bosch Gmbh Robert	Lochkörper und Ventil mit Lochkörper
IL100224A (en) *	1990-12-04	1994-10-21	Dmw Tech Ltd	Spray nozzle
DE4104019C1 (2) *	1991-02-09	1992-04-23	Robert Bosch Gmbh, 7000 Stuttgart, De
EP0585854B1 (en) *	1992-08-31	1998-11-11	Canon Kabushiki Kaisha	Ink jet head manufacturing method using ion machining and ink jet head manufactured thereby
US6007676A (en) *	1992-09-29	1999-12-28	Boehringer Ingelheim International Gmbh	Atomizing nozzle and filter and spray generating device
IL107120A (en) *	1992-09-29	1997-09-30	Boehringer Ingelheim Int	Atomising nozzle and filter and spray generating device
CA2115819C (en) *	1993-02-17	2000-07-25	Yasuhide Tani	Fluid injection nozzle
US5569187A (en) *	1994-08-16	1996-10-29	Texas Instruments Incorporated	Method and apparatus for wireless chemical supplying
DE19515722C1 (de) *	1995-05-03	1996-07-25	Tricumed Gmbh	Implantierbare Infusionspumpe
US5908414A (en) *	1995-05-03	1999-06-01	Tricumed Gmbh	Implantable infusion pump
US5992769A (en) *	1995-06-09	1999-11-30	The Regents Of The University Of Michigan	Microchannel system for fluid delivery
GB2302842B (en) *	1995-07-03	1998-12-30	Seiko Epson Corp	A nozzle plate, ink-jet head and manufacturing method thereof
JP3386099B2 (ja) *	1995-07-03	2003-03-10	セイコーエプソン株式会社	インクジェット式記録ヘッド用ノズルプレート、これの製造方法、及びインクジェット式記録ヘッド
US5658471A (en) *	1995-09-22	1997-08-19	Lexmark International, Inc.	Fabrication of thermal ink-jet feed slots in a silicon substrate
US5757400A (en) *	1996-02-01	1998-05-26	Spectra, Inc.	High resolution matrix ink jet arrangement
BR9714615A (pt) *	1996-07-08	2004-04-06	Spraychip Systems Corp	Dispositivo de atomização de queda de rayleigh e processos de fabricação de dispositvos de atomização de queda de 05 rayleigh
US6352209B1 (en)	1996-07-08	2002-03-05	Corning Incorporated	Gas assisted atomizing devices and methods of making gas-assisted atomizing devices
BR9710223A (pt)	1996-07-08	2000-01-18	Spraychip Systems	Dispositivo de atomização auxiliado por gás.
US5901425A (en) *	1996-08-27	1999-05-11	Topaz Technologies Inc.	Inkjet print head apparatus
JP2001522323A (ja) *	1997-04-18	2001-11-13	トパーズ・テクノロジーズ・インコーポレイテッド	インクジェット印刷ヘッドのノズルプレート
US6375858B1 (en) *	1997-05-14	2002-04-23	Seiko Epson Corporation	Method of forming nozzle for injection device and method of manufacturing inkjet head
JP3530744B2 (ja) *	1997-07-04	2004-05-24	キヤノン株式会社	インクジェット記録ヘッドの製造方法
DE19742439C1 (de) *	1997-09-26	1998-10-22	Boehringer Ingelheim Int	Mikrostrukturiertes Filter
AU751971B2 (en) *	1997-12-19	2002-09-05	Corning Incorporated	Method for producing metal oxide soot
EP1876442A3 (en) *	1998-09-17	2008-03-05	Advion BioSciences, Inc.	Integrated monolithic microfabricated liquid chromatography system and method
US6363606B1 (en) *	1998-10-16	2002-04-02	Agere Systems Guardian Corp.	Process for forming integrated structures using three dimensional printing techniques
US6633031B1 (en)	1999-03-02	2003-10-14	Advion Biosciences, Inc.	Integrated monolithic microfabricated dispensing nozzle and liquid chromatography-electrospray system and method
JP2001179987A (ja) *	1999-12-22	2001-07-03	Samsung Electro Mech Co Ltd	ノズルプレート及びその製造方法
CN1237572C (zh)	1999-12-30	2006-01-18	阿德维昂生物科学公司	多电雾化装置、系统和方法
JP2003520962A (ja)	2000-01-18	2003-07-08	アドビオンバイオサイエンシーズインコーポレーティッド	分離媒体、複式電気噴霧ノズルシステム、および方法
KR100499118B1 (ko)	2000-02-24	2005-07-04	삼성전자주식회사	단결정 실리콘 웨이퍼를 이용한 일체형 유체 노즐어셈블리 및 그 제작방법
DE10101875B4 (de) *	2001-01-16	2006-05-04	Infineon Technologies Ag	Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung
JP3881985B2 (ja) *	2001-12-04	2007-02-14	株式会社アトック	石英ガラス製流体送給用単穴ノズル及び石英ガラス製流体送給用多穴バーナヘッド
JP3975272B2 (ja) *	2002-02-21	2007-09-12	独立行政法人産業技術総合研究所	超微細流体ジェット装置
US7592201B2 (en) *	2003-09-09	2009-09-22	Csg Solar Ag	Adjustments of masks by re-flow
JP2007505485A (ja) *	2003-09-09	2007-03-08	シーエスジーソーラーアクチェンゲゼルシャフト	シリコンをエッチングする方法の改良
US7585781B2 (en) *	2003-09-09	2009-09-08	Csg Solar Ag	Method of forming openings in an organic resin material
US7548775B2 (en) *	2003-10-21	2009-06-16	The Regents Of The University Of Michigan	Intracranial neural interface system
US7347532B2 (en) *	2004-08-05	2008-03-25	Fujifilm Dimatix, Inc.	Print head nozzle formation
US9014796B2 (en)	2005-06-14	2015-04-21	Regents Of The University Of Michigan	Flexible polymer microelectrode with fluid delivery capability and methods for making same
EP1931419B1 (en) *	2005-10-07	2016-08-10	NeuroNexus Technologies, Inc.	Modular multichannel microelectrode array
US8195267B2 (en)	2006-01-26	2012-06-05	Seymour John P	Microelectrode with laterally extending platform for reduction of tissue encapsulation
JP4881126B2 (ja) *	2006-10-25	2012-02-22	株式会社東芝	ノズルプレートの製造方法、および液滴吐出ヘッドの製造方法
US8731673B2 (en)	2007-02-26	2014-05-20	Sapiens Steering Brain Stimulation B.V.	Neural interface system
US20100276505A1 (en) *	2007-09-26	2010-11-04	Roger Earl Smith	Drilling in stretched substrates
US8224417B2 (en)	2007-10-17	2012-07-17	Neuronexus Technologies, Inc.	Guide tube for an implantable device system
WO2009052425A1 (en)	2007-10-17	2009-04-23	Neuronexus Technologies	Implantable device including a resorbable carrier
US8565894B2 (en) *	2007-10-17	2013-10-22	Neuronexus Technologies, Inc.	Three-dimensional system of electrode leads
US8498720B2 (en) *	2008-02-29	2013-07-30	Neuronexus Technologies, Inc.	Implantable electrode and method of making the same
US20090240314A1 (en) *	2008-03-24	2009-09-24	Kong K C	Implantable electrode lead system with a three dimensional arrangement and method of making the same
US9289142B2 (en)	2008-03-24	2016-03-22	Neuronexus Technologies, Inc.	Implantable electrode lead system with a three dimensional arrangement and method of making the same
WO2010051247A2 (en) *	2008-10-31	2010-05-06	Fujifilm Dimatix, Inc.	Shaping a nozzle outlet
US8197029B2 (en)	2008-12-30	2012-06-12	Fujifilm Corporation	Forming nozzles
RU2012120108A (ru) *	2009-10-16	2013-11-27	Сапиенс Стиринг Брейн Стимьюлейшн Б.В.	Нейроинтерфейсная система
CN102686147B (zh)	2009-11-05	2016-01-20	格雷特巴奇有限公司	波导神经接口装置
US9155861B2 (en)	2010-09-20	2015-10-13	Neuronexus Technologies, Inc.	Neural drug delivery system with fluidic threads
JP6901446B2 (ja)	2018-09-03	2021-07-14	株式会社東芝	無線通信装置、無線通信システム、無線通信方法及びプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2665946A (en) *	1951-05-29	1954-01-12	Arthur E Broughton	Spray nozzle
US2834635A (en) *	1955-06-22	1958-05-13	Muellermist Irrigation Co	Liquid spray device
US2987262A (en) *	1959-11-24	1961-06-06	Lodding Engineering Corp	Removable and replaceable shower device
US3125295A (en) *	1960-12-30	1964-03-17		Crystal
US3211088A (en) *	1962-05-04	1965-10-12	Sperry Rand Corp	Exponential horn printer
JPS5040616B1 (2) *	1970-03-18	1975-12-25
US3655530A (en) *	1970-06-15	1972-04-11	Mead Corp	Fabrication of orifices
US3742230A (en) *	1972-06-29	1973-06-26	Massachusetts Inst Technology	Soft x-ray mask support substrate

1974
- 1974-12-31 US US537799A patent/US3921916A/en not_active Expired - Lifetime
1975
- 1975-10-15 JP JP12333875A patent/JPS5516070B2/ja not_active Expired
- 1975-10-27 GB GB43997/75A patent/GB1492465A/en not_active Expired
- 1975-10-31 IT IT28866/75A patent/IT1054354B/it active
- 1975-11-21 CA CA240,350A patent/CA1037519A/en not_active Expired
- 1975-11-21 FR FR7536645A patent/FR2296504A1/fr active Granted
- 1975-12-10 DE DE2555462A patent/DE2555462C2/de not_active Expired

Also Published As

Publication number	Publication date
JPS5516070B2 (2)	1980-04-28
GB1492465A (en)	1977-11-23
DE2555462C2 (de)	1982-06-03
IT1054354B (it)	1981-11-10
US3921916A (en)	1975-11-25
FR2296504B1 (2)	1978-05-12
FR2296504A1 (fr)	1976-07-30
DE2555462A1 (de)	1976-07-08
JPS5184641A (2)	1976-07-24

Publication	Publication Date	Title
CA1037519A (en)	1978-08-29	Method of producing nozzles in monocrystalline silicon wafer
US4733823A (en)	1988-03-29	Silicon nozzle structures and method of manufacture
US4957592A (en)	1990-09-18	Method of using erodable masks to produce partially etched structures in ODE wafer structures
Bassous	1978	Fabrication of novel three-dimensional microstructures by the anisotropic etching of (l 00) and (I 10) silicon
US4961821A (en)	1990-10-09	Ode through holes and butt edges without edge dicing
JPS5848352B2 (ja)	1983-10-27	インクジエツトプリントソウチ
US4595428A (en)	1986-06-17	Method for producing high-aspect ratio hollow diffused regions in a semiconductor body
JP3127002B2 (ja)	2001-01-22	大型および小型の構造体を製作するための低温、片面、複数ステップによるエッチング工程
DE68918982T2 (de)	1995-04-27	Verfahren zur Trennung integrierter Schaltkreise auf einem Substrat.
CA1059197A (en)	1979-07-24	Ink jet nozzle structure and method of making
US4808260A (en)	1989-02-28	Directional aperture etched in silicon
CA1101765A (en)	1981-05-26	Process for etching holes
US4008111A (en)	1977-02-15	AlN masking for selective etching of sapphire
US4720308A (en)	1988-01-19	Method for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced thereby
US5338400A (en)	1994-08-16	Micromachining process for making perfect exterior corner in an etchable substrate
US5716533A (en)	1998-02-10	Method of fabricating ink jet printheads
KR930009109B1 (ko)	1993-09-23	실리콘 노즐
JPS6043309B2 (ja)	1985-09-27	マルチノズルオリフイス板
US5487483A (en)	1996-01-30	Nozzles for ink jet devices and method for microfabrication of the nozzles
US3902925A (en)	1975-09-02	Deep diode device and method
US4840701A (en)	1989-06-20	Etching apparatus and method
US4006040A (en)	1977-02-01	Semiconductor device manufacture
US5468344A (en)	1995-11-21	Method for manufacturing semiconductor devices
GB2095897A (en)	1982-10-06	Semiconductor manufacture
US4108685A (en)	1978-08-22	Semiconductor device manufacture