CA1042116A - Couvercle reformable a la chaleur - Google Patents

Couvercle reformable a la chaleur

Info

Publication number
CA1042116A
CA1042116A CA215,092A CA215092A CA1042116A CA 1042116 A CA1042116 A CA 1042116A CA 215092 A CA215092 A CA 215092A CA 1042116 A CA1042116 A CA 1042116A
Authority
CA
Canada
Prior art keywords
sealing member
package
substrate
wall
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA215,092A
Other languages
English (en)
Other versions
CA215092S (en
Inventor
John F. Krumme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of CA1042116A publication Critical patent/CA1042116A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
CA215,092A 1973-12-03 1974-12-02 Couvercle reformable a la chaleur Expired CA1042116A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (1)

Publication Number Publication Date
CA1042116A true CA1042116A (fr) 1978-11-07

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
CA215,092A Expired CA1042116A (fr) 1973-12-03 1974-12-02 Couvercle reformable a la chaleur

Country Status (15)

Country Link
JP (1) JPS5842622B2 (fr)
AT (1) ATA964874A (fr)
AU (1) AU502556B2 (fr)
BE (1) BE822904A (fr)
CA (1) CA1042116A (fr)
CH (1) CH580379A5 (fr)
DE (1) DE2457116A1 (fr)
ES (1) ES432527A1 (fr)
FR (1) FR2253283B1 (fr)
GB (1) GB1484177A (fr)
HK (1) HK18478A (fr)
IL (1) IL46173A (fr)
IT (1) IT1033109B (fr)
NL (1) NL7415764A (fr)
SE (1) SE7415124L (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (fr) * 1974-06-27 1979-09-08
JPS57175442U (fr) * 1981-04-30 1982-11-05
JPS58100446A (ja) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp 真空封止方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
FR2253283B1 (fr) 1979-08-10
DE2457116A1 (de) 1975-08-21
ES432527A1 (es) 1977-03-01
CH580379A5 (fr) 1976-09-30
AU502556B2 (en) 1979-08-02
FR2253283A1 (fr) 1975-06-27
AU7601974A (en) 1976-06-03
ATA964874A (de) 1980-04-15
IL46173A (en) 1977-08-31
IT1033109B (it) 1979-07-10
GB1484177A (en) 1977-09-01
JPS5087586A (fr) 1975-07-14
NL7415764A (nl) 1975-06-05
BE822904A (fr) 1975-06-03
HK18478A (en) 1978-04-14
IL46173A0 (en) 1975-03-13
SE7415124L (fr) 1975-06-04
JPS5842622B2 (ja) 1983-09-21

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