CA1044636A - Formation de nodules sur une surface metallique - Google Patents

Formation de nodules sur une surface metallique

Info

Publication number: CA1044636A
Authority: CA; Canada
Prior art keywords: copper; nitrate; range; method defined; ions
Prior art date: 1974-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA216,635A

Other languages

English (en)

Other versions

CA216635S (en

Inventor

Betty L. Berdan

Betty M. Luce

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Gould Electronics Inc

Original Assignee

Gould Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-01-07

Filing date

1974-12-18

Publication date

1978-12-19

1974-12-18 Application filed by Gould Inc filed Critical Gould Inc

1978-12-19 Application granted granted Critical

1978-12-19 Publication of CA1044636A publication Critical patent/CA1044636A/fr

Status Expired legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 44
229910052751 metal Inorganic materials 0.000 title claims abstract description 19
239000002184 metal Substances 0.000 title claims abstract description 19
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
229910052802 copper Inorganic materials 0.000 claims abstract description 46
239000010949 copper Substances 0.000 claims abstract description 46
238000007747 plating Methods 0.000 claims abstract description 17
229910002651 NO3 Inorganic materials 0.000 claims abstract description 16
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 16
-1 nitrate ions Chemical class 0.000 claims abstract description 12
238000009713 electroplating Methods 0.000 claims abstract description 8
239000011889 copper foil Substances 0.000 claims description 37
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 24
229910001431 copper ion Inorganic materials 0.000 claims description 24
239000011888 foil Substances 0.000 claims description 24
NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 19
PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 11
JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims description 9
239000000203 mixture Substances 0.000 claims description 9
239000002253 acid Substances 0.000 claims description 8
FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 8
VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 8
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
229910052759 nickel Inorganic materials 0.000 claims description 5
229910052725 zinc Inorganic materials 0.000 claims description 5
239000011701 zinc Substances 0.000 claims description 5
229910001369 Brass Inorganic materials 0.000 claims description 4
239000010951 brass Substances 0.000 claims description 4
229910017052 cobalt Inorganic materials 0.000 claims description 4
239000010941 cobalt Substances 0.000 claims description 4
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 4
238000000151 deposition Methods 0.000 claims description 4
239000000463 material Substances 0.000 claims description 4
235000010333 potassium nitrate Nutrition 0.000 claims description 4
239000004323 potassium nitrate Substances 0.000 claims description 4
235000010344 sodium nitrate Nutrition 0.000 claims description 4
239000004317 sodium nitrate Substances 0.000 claims description 4
229910052738 indium Inorganic materials 0.000 claims description 3
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
238000009877 rendering Methods 0.000 claims description 3
150000002500 ions Chemical class 0.000 claims description 2
150000001875 compounds Chemical class 0.000 claims 2
229910000838 Al alloy Inorganic materials 0.000 claims 1
239000000758 substrate Substances 0.000 abstract description 32
229910000881 Cu alloy Inorganic materials 0.000 abstract description 4
229910000570 Cupronickel Inorganic materials 0.000 abstract description 3
229910000365 copper sulfate Inorganic materials 0.000 abstract description 3
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 3
239000000243 solution Substances 0.000 description 23
229910052782 aluminium Inorganic materials 0.000 description 12
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
239000004593 Epoxy Substances 0.000 description 7
239000011521 glass Substances 0.000 description 7
229920005989 resin Polymers 0.000 description 7
239000011347 resin Substances 0.000 description 7
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
230000001464 adherent effect Effects 0.000 description 4
239000003792 electrolyte Substances 0.000 description 4
239000004615 ingredient Substances 0.000 description 4
238000003475 lamination Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 3
239000000843 powder Substances 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
239000011651 chromium Substances 0.000 description 2
229960000355 copper sulfate Drugs 0.000 description 2
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 2
235000011180 diphosphates Nutrition 0.000 description 2
238000007598 dipping method Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000007772 nodular growth Effects 0.000 description 2
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
235000011006 sodium potassium tartrate Nutrition 0.000 description 2
229910001220 stainless steel Inorganic materials 0.000 description 2
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
229910019142 PO4 Inorganic materials 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
238000013019 agitation Methods 0.000 description 1
239000003513 alkali Substances 0.000 description 1
DQSGVVGOPRWTKI-QVFAWCHISA-N atazanavir sulfate Chemical compound [H+].[H+].[O-]S([O-])(=O)=O.C([C@H](NC(=O)[C@@H](NC(=O)OC)C(C)(C)C)[C@@H](O)CN(CC=1C=CC(=CC=1)C=1N=CC=CC=1)NC(=O)[C@@H](NC(=O)OC)C(C)(C)C)C1=CC=CC=C1 DQSGVVGOPRWTKI-QVFAWCHISA-N 0.000 description 1
KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
239000003153 chemical reaction reagent Substances 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
SXTLQDJHRPXDSB-UHFFFAOYSA-N copper;dinitrate;trihydrate Chemical compound O.O.O.[Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O SXTLQDJHRPXDSB-UHFFFAOYSA-N 0.000 description 1
ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
238000010348 incorporation Methods 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
238000010030 laminating Methods 0.000 description 1
230000013011 mating Effects 0.000 description 1
238000005259 measurement Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
239000002245 particle Substances 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
239000000047 product Substances 0.000 description 1
WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
239000010959 steel Substances 0.000 description 1
239000011787 zinc oxide Substances 0.000 description 1
NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating Methods And Accessories (AREA)
Laminated Bodies (AREA)
Electrochemical Coating By Surface Reaction (AREA)
Electroplating And Plating Baths Therefor (AREA)

CA216,635A 1974-01-07 1974-12-18 Formation de nodules sur une surface metallique Expired CA1044636A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US43134274A	1974-01-07	1974-01-07

Publications (1)

Publication Number	Publication Date
CA1044636A true CA1044636A (fr)	1978-12-19

Family

ID=23711503

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA216,635A Expired CA1044636A (fr)	1974-01-07	1974-12-18	Formation de nodules sur une surface metallique

Country Status (6)

Country	Link
JP (1)	JPS5756558B2 (fr)
CA (1)	CA1044636A (fr)
DE (1)	DE2500160C2 (fr)
GB (1)	GB1462001A (fr)
LU (1)	LU71602A1 (fr)
SE (1)	SE7500053L (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4169018A (en) *	1978-01-16	1979-09-25	Gould Inc.	Process for electroforming copper foil
US4468293A (en) *	1982-03-05	1984-08-28	Olin Corporation	Electrochemical treatment of copper for improving its bond strength
JPS58224059A (ja) *	1982-06-22	1983-12-26	Tokai Rika Co Ltd	ダイカスト鋳造機
US4515671A (en) *	1983-01-24	1985-05-07	Olin Corporation	Electrochemical treatment of copper for improving its bond strength
US4846918A (en) *	1988-02-24	1989-07-11	Psi Star	Copper etching process and product with controlled nitrous acid reaction
US5670033A (en) *	1993-04-19	1997-09-23	Electrocopper Products Limited	Process for making copper metal powder, copper oxides and copper foil
US5366612A (en) *	1993-04-19	1994-11-22	Magma Copper Company	Process for making copper foil
DE69427583T2 (de) *	1993-04-19	2001-10-04	Ga-Tek Inc, Eastlake	Verfahren zur herstellung von kupfermetallpulver kupferoxide und kupferfolie
SG101924A1 (en) *	1998-10-19	2004-02-27	Mitsui Mining & Smelting Co	Composite material used in making printed wiring boards
DE69930909T2 (de) *	1998-10-19	2007-05-03	Mitsui Mining & Smelting Co., Ltd.	Neue Verbundfolie, Verfahren zu deren Herstellung und Kupferkaschiertes Laminat

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3857681A (en) *	1971-08-03	1974-12-31	Yates Industries	Copper foil treatment and products produced therefrom

1974
- 1974-12-18 CA CA216,635A patent/CA1044636A/fr not_active Expired
1975
- 1975-01-02 GB GB12675A patent/GB1462001A/en not_active Expired
- 1975-01-03 SE SE7500053A patent/SE7500053L/xx unknown
- 1975-01-03 DE DE2500160A patent/DE2500160C2/de not_active Expired
- 1975-01-07 JP JP50004629A patent/JPS5756558B2/ja not_active Expired
- 1975-01-07 LU LU71602A patent/LU71602A1/xx unknown

Also Published As

Publication number	Publication date
DE2500160A1 (de)	1975-07-17
JPS5756558B2 (fr)	1982-11-30
LU71602A1 (fr)	1975-06-17
JPS50101234A (fr)	1975-08-11
GB1462001A (en)	1977-01-19
SE7500053L (fr)	1975-07-08
DE2500160C2 (de)	1982-12-23

Publication	Publication Date	Title
CA1277948C (fr)	1990-12-18	Traitement du cuivre en feuille
EP0180981B1 (fr)	1989-03-22	Procédé pour le traitement de surface de produits en cuivre
EP0790332B1 (fr)	2001-07-18	Bain de dépôt de laiton sans cyanure et procédé de fabrication d'une feuille métallique ayant une couche de laiton en utilisant ce bain
EP0177686A2 (fr)	1986-04-16	Procédé de liaison de métaux à des couches déposées par électrophorèse et circuit imprimé à trous métallisés ainsi produit
US4619871A (en)	1986-10-28	Copper foil for printed circuit board
EP1439952A1 (fr)	2004-07-28	Feuille de cuivre dotee d'une meilleure liaison de profil bas
US5322975A (en)	1994-06-21	Universal carrier supported thin copper line
CN114929944B (zh)	2025-02-25	表面处理铜箔及其制造方法
JPH0335394B2 (fr)	1991-05-28
KR101695236B1 (ko)	2017-01-11	동박, 이를 포함하는 전기부품 및 전지
US4061837A (en)	1977-12-06	Plastic-metal composite and method of making the same
US4323632A (en)	1982-04-06	Metal composites and laminates formed therefrom
JP3370316B2 (ja)	2003-01-27	プリント配線板用銅箔及びその表面処理方法
US4234395A (en)	1980-11-18	Metal composites and laminates formed therefrom
CA2070046A1 (fr)	1992-12-29	Feuil metallique a adherense amelioree sur substrat et methode de fabrication
JP2002069691A (ja)	2002-03-08	印刷回路基板用銅箔の製造方法
CN111757607B (zh)	2023-11-07	表面处理铜箔、覆铜层叠板及印制布线板
JP2708130B2 (ja)	1998-02-04	プリント回路用銅箔の粗面形成方法
JP2005008955A (ja)	2005-01-13	銅箔の表面処理方法
EP0269208A1 (fr)	1988-06-01	Procédé de traitement d'une feuille en cuivre
KR840001643B1 (ko)	1984-10-12	인쇄 회로용 동박(銅箔)
JPH10135594A (ja)	1998-05-22	プリント配線板用銅箔
JP2005042139A (ja)	2005-02-17	表面処理銅箔及びその製造方法
KR920002012B1 (ko)	1992-03-09	인쇄회로용 동박
KR820001688B1 (ko)	1982-09-17	전기도금방법에 의한 동포일의 제조방법