CA1054259A - Plaquette de circuits imprimes avec masque de protection a adherence amelioree - Google Patents

Plaquette de circuits imprimes avec masque de protection a adherence amelioree

Info

Publication number
CA1054259A
CA1054259A CA288,785A CA288785A CA1054259A CA 1054259 A CA1054259 A CA 1054259A CA 288785 A CA288785 A CA 288785A CA 1054259 A CA1054259 A CA 1054259A
Authority
CA
Canada
Prior art keywords
printed circuit
connection pads
circuit board
tin
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA288,785A
Other languages
English (en)
Inventor
John A. Galko
Original Assignee
Canadian General Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canadian General Electric Co Ltd filed Critical Canadian General Electric Co Ltd
Priority to CA288,785A priority Critical patent/CA1054259A/fr
Priority to JP5078578A priority patent/JPS5458869A/ja
Application granted granted Critical
Publication of CA1054259A publication Critical patent/CA1054259A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CA288,785A 1977-10-14 1977-10-14 Plaquette de circuits imprimes avec masque de protection a adherence amelioree Expired CA1054259A (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CA288,785A CA1054259A (fr) 1977-10-14 1977-10-14 Plaquette de circuits imprimes avec masque de protection a adherence amelioree
JP5078578A JPS5458869A (en) 1977-10-14 1978-05-01 Print circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA288,785A CA1054259A (fr) 1977-10-14 1977-10-14 Plaquette de circuits imprimes avec masque de protection a adherence amelioree

Publications (1)

Publication Number Publication Date
CA1054259A true CA1054259A (fr) 1979-05-08

Family

ID=4109773

Family Applications (1)

Application Number Title Priority Date Filing Date
CA288,785A Expired CA1054259A (fr) 1977-10-14 1977-10-14 Plaquette de circuits imprimes avec masque de protection a adherence amelioree

Country Status (2)

Country Link
JP (1) JPS5458869A (fr)
CA (1) CA1054259A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (fr) * 1981-03-18 1982-09-24 Licentia Gmbh Procede de production de circuits imprimes
FR2587575A1 (fr) * 1985-09-18 1987-03-20 Eat Etude Assistance Tech Procede pour la fabrication de supports de circuits electriques
EP0233201A4 (fr) * 1985-08-08 1987-11-30 Macdermid Inc Procede de fabrication de cartes a circuits imprimes.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (fr) * 1981-03-18 1982-09-24 Licentia Gmbh Procede de production de circuits imprimes
EP0233201A4 (fr) * 1985-08-08 1987-11-30 Macdermid Inc Procede de fabrication de cartes a circuits imprimes.
FR2587575A1 (fr) * 1985-09-18 1987-03-20 Eat Etude Assistance Tech Procede pour la fabrication de supports de circuits electriques
EP0219394A1 (fr) * 1985-09-18 1987-04-22 Société Anonyme E A T Société d'Etude et d'Assistance Technique Procédé pour la fabrication de supports de circuits électriques

Also Published As

Publication number Publication date
JPS5458869A (en) 1979-05-11

Similar Documents

Publication Publication Date Title
US3742597A (en) Method for making a coated printed circuit board
CA1213073A (fr) Methode de fabrication de cartes de circuits imprimes
US6043966A (en) Printed circuit board assembly having an integrated fusible link
US3786172A (en) Printed circuit board method and apparatus
KR850000216Y1 (ko) 인쇄 회로기판
KR960001352B1 (ko) 땜납 피복 프린트 회로 기판 및 그의 제조방법
US5742483A (en) Method for producing circuit board assemblies using surface mount components with finely spaced leads
WO1987000390A1 (fr) Procede de fabrication de cartes de circuit imprime
EP0947125B1 (fr) Procede de fabrication d'une carte a circuit imprime dotee d'un revetement en etain et plomb
JPH0423485A (ja) プリント配線板とその製造法
US4525246A (en) Making solderable printed circuit boards
US5358622A (en) Procedure for the production of printed circuit boards provided with pads for the insertion of SMDs
CA1054259A (fr) Plaquette de circuits imprimes avec masque de protection a adherence amelioree
US3850711A (en) Method of forming printed circuit
US5250757A (en) Printed wiring board having a connecting terminal
US5024734A (en) Solder pad/circuit trace interface and a method for generating the same
EP0095256A1 (fr) Méthode pour fabriquer des plaquettes à circuit imprimé
JPH0590725A (ja) フレキシブル基板の接続構造
US3176381A (en) Method of forming weldable terminals on circuit boards
JP2864705B2 (ja) Ｔａｂ用フイルムキャリアテープ及びそのリードへのはんだ被覆方法
JPH01155683A (ja) プリント配線板の製造方法
JPH04297091A (ja) 半田コートプリント回路基板とその製造方法
JPH09232753A (ja) プリント配線基板の製造方法及びプリント配線基板
JPH05327195A (ja) プリント基板
JPS63204790A (ja) プリント配線板