CA1069254A - Dry replenishment of electroless copper solutions - Google Patents
Dry replenishment of electroless copper solutionsInfo
- Publication number
- CA1069254A CA1069254A CA260,042A CA260042A CA1069254A CA 1069254 A CA1069254 A CA 1069254A CA 260042 A CA260042 A CA 260042A CA 1069254 A CA1069254 A CA 1069254A
- Authority
- CA
- Canada
- Prior art keywords
- plating solution
- plating
- replenisher
- stabilizer
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65828076A | 1976-02-17 | 1976-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1069254A true CA1069254A (en) | 1980-01-08 |
Family
ID=24640605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA260,042A Expired CA1069254A (en) | 1976-02-17 | 1976-08-27 | Dry replenishment of electroless copper solutions |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5299932A (sv) |
| CA (1) | CA1069254A (sv) |
| DE (1) | DE2631633A1 (sv) |
| FR (1) | FR2341667A1 (sv) |
| GB (1) | GB1557871A (sv) |
| IT (1) | IT1059760B (sv) |
| SE (1) | SE7608874L (sv) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60248882A (ja) * | 1984-05-24 | 1985-12-09 | Aisin Seiki Co Ltd | 高リン含有ニツケル合金の無電解めつき浴 |
| JP6047714B2 (ja) * | 2012-08-08 | 2016-12-21 | 石原ケミカル株式会社 | 無電解スズ系メッキ液用のペースト状スズ補給剤及び補給方法 |
-
1976
- 1976-05-03 IT IT22924/76A patent/IT1059760B/it active
- 1976-06-04 GB GB23140/76A patent/GB1557871A/en not_active Expired
- 1976-07-14 DE DE19762631633 patent/DE2631633A1/de active Pending
- 1976-07-16 FR FR7621853A patent/FR2341667A1/fr not_active Withdrawn
- 1976-07-16 JP JP8490976A patent/JPS5299932A/ja active Pending
- 1976-08-09 SE SE7608874A patent/SE7608874L/sv unknown
- 1976-08-27 CA CA260,042A patent/CA1069254A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5299932A (en) | 1977-08-22 |
| IT1059760B (it) | 1982-06-21 |
| SE7608874L (sv) | 1977-08-18 |
| FR2341667A1 (fr) | 1977-09-16 |
| GB1557871A (en) | 1979-12-12 |
| DE2631633A1 (de) | 1977-08-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |