CA1075825A - Plaquette de circuit et methode de fabrication - Google Patents

Plaquette de circuit et methode de fabrication

Info

Publication number: CA1075825A
Authority: CA; Canada
Prior art keywords: substrate; pattern; recessed; circuit; applying
Prior art date: 1976-04-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA274,360A

Other languages

English (en)

Inventor

Rollin W. Mettler

John H. Mettler

John Impey

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CIRCUIT-WISE

Original Assignee

CIRCUIT-WISE

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1976-04-22

Filing date

1977-03-21

Publication date

1980-04-15

1977-03-21 Application filed by CIRCUIT-WISE filed Critical CIRCUIT-WISE

1980-04-15 Application granted granted Critical

1980-04-15 Publication of CA1075825A publication Critical patent/CA1075825A/fr

Status Expired legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title description 2
239000000758 substrate Substances 0.000 claims abstract description 45
238000007747 plating Methods 0.000 claims abstract description 33
238000000034 method Methods 0.000 claims abstract description 30
229910052751 metal Inorganic materials 0.000 claims abstract description 22
239000002184 metal Substances 0.000 claims abstract description 22
238000000465 moulding Methods 0.000 claims abstract description 7
238000007788 roughening Methods 0.000 claims description 8
230000000994 depressogenic effect Effects 0.000 claims description 7
239000003989 dielectric material Substances 0.000 claims description 7
229910000679 solder Inorganic materials 0.000 claims description 5
238000000151 deposition Methods 0.000 claims description 4
239000000126 substance Substances 0.000 claims description 4
239000004593 Epoxy Substances 0.000 claims description 3
238000004140 cleaning Methods 0.000 claims description 3
239000011253 protective coating Substances 0.000 claims description 3
239000011248 coating agent Substances 0.000 claims description 2
238000000576 coating method Methods 0.000 claims description 2
230000003213 activating effect Effects 0.000 claims 3
238000005488 sandblasting Methods 0.000 claims 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
229910052802 copper Inorganic materials 0.000 abstract description 14
239000010949 copper Substances 0.000 abstract description 14
239000000463 material Substances 0.000 abstract description 7
238000002360 preparation method Methods 0.000 abstract description 3
230000001681 protective effect Effects 0.000 abstract description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 26
239000000243 solution Substances 0.000 description 16
238000002791 soaking Methods 0.000 description 14
238000007654 immersion Methods 0.000 description 7
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
235000013824 polyphenols Nutrition 0.000 description 4
239000004094 surface-active agent Substances 0.000 description 4
XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
238000010276 construction Methods 0.000 description 3
238000001035 drying Methods 0.000 description 3
229910052759 nickel Inorganic materials 0.000 description 3
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 3
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000012670 alkaline solution Substances 0.000 description 2
ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
229940117975 chromium trioxide Drugs 0.000 description 2
WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 2
230000008021 deposition Effects 0.000 description 2
238000005530 etching Methods 0.000 description 2
239000004922 lacquer Substances 0.000 description 2
229940032007 methylethyl ketone Drugs 0.000 description 2
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
-1 MacDermid 9042 Chemical compound 0.000 description 1
239000004734 Polyphenylene sulfide Substances 0.000 description 1
KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
238000005299 abrasion Methods 0.000 description 1
239000003082 abrasive agent Substances 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
229910021529 ammonia Inorganic materials 0.000 description 1
229910001870 ammonium persulfate Inorganic materials 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
239000004020 conductor Substances 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
238000005336 cracking Methods 0.000 description 1
238000007766 curtain coating Methods 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
230000032798 delamination Effects 0.000 description 1
238000013461 design Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
239000012153 distilled water Substances 0.000 description 1
238000005553 drilling Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
239000002305 electric material Substances 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000004049 embossing Methods 0.000 description 1
230000004907 flux Effects 0.000 description 1
239000004519 grease Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
238000007689 inspection Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
238000003801 milling Methods 0.000 description 1
229910000159 nickel phosphate Inorganic materials 0.000 description 1
JOCJYBPHESYFOK-UHFFFAOYSA-K nickel(3+);phosphate Chemical compound [Ni+3].[O-]P([O-])([O-])=O JOCJYBPHESYFOK-UHFFFAOYSA-K 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
HFHZKZSRXITVMK-UHFFFAOYSA-N oxyphenbutazone Chemical compound O=C1C(CCCC)C(=O)N(C=2C=CC=CC=2)N1C1=CC=C(O)C=C1 HFHZKZSRXITVMK-UHFFFAOYSA-N 0.000 description 1
238000012856 packing Methods 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000069 polyphenylene sulfide Polymers 0.000 description 1
230000004224 protection Effects 0.000 description 1
238000003908 quality control method Methods 0.000 description 1
238000007761 roller coating Methods 0.000 description 1
239000004576 sand Substances 0.000 description 1
238000012216 screening Methods 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
238000005476 soldering Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
239000001119 stannous chloride Substances 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
238000004381 surface treatment Methods 0.000 description 1
239000000725 suspension Substances 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
238000009736 wetting Methods 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Manufacturing Of Printed Wiring (AREA)
Structure Of Printed Boards (AREA)
Insulated Metal Substrates For Printed Circuits (AREA)

CA274,360A 1976-04-22 1977-03-21 Plaquette de circuit et methode de fabrication Expired CA1075825A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US67935276A	1976-04-22	1976-04-22

Publications (1)

Publication Number	Publication Date
CA1075825A true CA1075825A (fr)	1980-04-15

Family

ID=24726584

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA274,360A Expired CA1075825A (fr)	1976-04-22	1977-03-21	Plaquette de circuit et methode de fabrication

Country Status (5)

Country	Link
JP (1)	JPS52151866A (fr)
CA (1)	CA1075825A (fr)
DE (1)	DE2715875A1 (fr)
FR (1)	FR2349255A1 (fr)
IT (1)	IT1086737B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4597177A (en) *	1984-01-03	1986-07-01	International Business Machines Corporation	Fabricating contacts for flexible module carriers
US4604799A (en) *	1982-09-03	1986-08-12	John Fluke Mfg. Co., Inc.	Method of making molded circuit board
US4985600A (en) *	1988-09-30	1991-01-15	Siemens Aktiengesellschaft	Printed circuit board having an injection molded substrate
US4996391A (en) *	1988-09-30	1991-02-26	Siemens Aktiengesellschaft	Printed circuit board having an injection molded substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5823496A (ja) *	1981-08-04	1983-02-12	日本電気株式会社	プラスチツク筐体への電気回路パタ−ン形成方法
JPS5854693A (ja) *	1981-09-29	1983-03-31	セイコー京葉工業株式会社	回路基板及び製造法
JPS58186994A (ja) *	1982-04-23	1983-11-01	三菱電機株式会社	印刷配線板の製造方法
JPS58186993A (ja) *	1982-04-23	1983-11-01	三菱電機株式会社	印刷配線板の製造方法

1977
- 1977-03-21 CA CA274,360A patent/CA1075825A/fr not_active Expired
- 1977-04-09 DE DE19772715875 patent/DE2715875A1/de active Pending
- 1977-04-13 IT IT4894677A patent/IT1086737B/it active
- 1977-04-19 JP JP4506777A patent/JPS52151866A/ja active Pending
- 1977-04-22 FR FR7712302A patent/FR2349255A1/fr not_active Withdrawn

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4604799A (en) *	1982-09-03	1986-08-12	John Fluke Mfg. Co., Inc.	Method of making molded circuit board
US4597177A (en) *	1984-01-03	1986-07-01	International Business Machines Corporation	Fabricating contacts for flexible module carriers
US4985600A (en) *	1988-09-30	1991-01-15	Siemens Aktiengesellschaft	Printed circuit board having an injection molded substrate
US4996391A (en) *	1988-09-30	1991-02-26	Siemens Aktiengesellschaft	Printed circuit board having an injection molded substrate

Also Published As

Publication number	Publication date
FR2349255A1 (fr)	1977-11-18
IT1086737B (it)	1985-05-31
DE2715875A1 (de)	1977-11-10
JPS52151866A (en)	1977-12-16

Legal Events

Date	Code	Title	Description
1997-04-15	MKEX	Expiry

Publication	Publication Date	Title
US4217182A (en)	1980-08-12	Semi-additive process of manufacturing a printed circuit
US4532152A (en)	1985-07-30	Fabrication of a printed circuit board with metal-filled channels
JP2668112B2 (ja)	1997-10-27	成型された相互接続装置およびその製造法
US5451722A (en)	1995-09-19	Printed circuit board with metallized grooves
CA1189019A (fr)	1985-06-18	Traitement par rayonnement pour la detente des tensions dans des articles en polysulfones
US3934334A (en)	1976-01-27	Method of fabricating metal printed wiring boards
US3177103A (en)	1965-04-06	Two pass etching for fabricating printed circuitry
US3514538A (en)	1970-05-26	Thermal dissipating metal core printed circuit board
JP2001144393A (ja)	2001-05-25	プリント回路基板
GB2113477A (en)	1983-08-03	Method of producing printed circuits
US4837129A (en)	1989-06-06	Process for producing conductor patterns on three dimensional articles
CA1075825A (fr)	1980-04-15	Plaquette de circuit et methode de fabrication
ATE82529T1 (de)	1992-12-15	Verfahren zur herstellung mehrschichtiger halbleiterplatten.
KR20010079509A (ko)	2001-08-22	전도성 트레이스 형성을 위한 개선된 방법 및 그 방법에의해 제조된 인쇄 회로
USRE29784E (en)	1978-09-26	Thermal dissipating metal core printed circuit board
KR101935248B1 (ko)	2019-01-04	Pas 근접 센서 및 장애물 감지 센서용 다층 인쇄회로기판의 제조 방법
GB2322735A (en)	1998-09-02	Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
JPS58186994A (ja)	1983-11-01	印刷配線板の製造方法
JPH04505829A (ja)	1992-10-08	プリント回路の絶縁抵抗の改良法
US3819430A (en)	1974-06-25	Method of manufacturing circuit board connectors
JPS58207696A (ja)	1983-12-03	パタ−ンめつきによるプリント配線板の製法
JPS6196795A (ja)	1986-05-15	印刷配線板の製造方法
JPH03201592A (ja)	1991-09-03	プリント配線板の製造法
CN101431866A (zh)	2009-05-13	利用水洗工艺制造软性电路板的方法
JPS5821394A (ja)	1983-02-08	プリント配線板の製造法

CA1075825A - Plaquette de circuit et methode de fabrication - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (1)

Family

ID=24726584

Family Applications (1)

Country Status (5)

Cited By (4)

Families Citing this family (4)

Cited By (4)

Also Published As

Similar Documents

Legal Events