CA1077643A - Substrats polymeriques a deux phases pour la deposition non electrolytique des metaux - Google Patents

Substrats polymeriques a deux phases pour la deposition non electrolytique des metaux

Info

Publication number: CA1077643A
Authority: CA; Canada
Prior art keywords: liquid; polymer; constituent; ethylenic unsaturation; phase rich
Prior art date: 1975-07-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA255,541A

Other languages

English (en)

Inventor

Edward J. Leech

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Corp

Original Assignee

Kollmorgen Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-07-25

Filing date

1976-06-23

Publication date

1980-05-13

1976-06-23 Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp

1980-05-13 Application granted granted Critical

1980-05-13 Publication of CA1077643A publication Critical patent/CA1077643A/fr

Status Expired legal-status Critical Current

Links

238000000454 electroless metal deposition Methods 0.000 title claims description 11
239000000758 substrate Substances 0.000 title abstract description 26
229920000642 polymer Polymers 0.000 claims abstract description 67
239000007788 liquid Substances 0.000 claims abstract description 54
239000000203 mixture Substances 0.000 claims abstract description 40
238000006116 polymerization reaction Methods 0.000 claims abstract description 28
239000012705 liquid precursor Substances 0.000 claims abstract description 23
229910052751 metal Inorganic materials 0.000 claims abstract description 22
239000002184 metal Substances 0.000 claims abstract description 22
230000008021 deposition Effects 0.000 claims abstract description 12
230000001590 oxidative effect Effects 0.000 claims abstract description 8
239000000470 constituent Substances 0.000 claims description 38
238000000034 method Methods 0.000 claims description 38
230000008569 process Effects 0.000 claims description 25
239000007787 solid Substances 0.000 claims description 23
239000004593 Epoxy Substances 0.000 claims description 19
230000001464 adherent effect Effects 0.000 claims description 18
229920003986 novolac Polymers 0.000 claims description 13
KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
238000000151 deposition Methods 0.000 claims description 11
NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 9
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
229920000647 polyepoxide Polymers 0.000 claims description 7
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 4
230000000379 polymerizing effect Effects 0.000 claims description 4
229920001568 phenolic resin Polymers 0.000 claims description 3
239000003822 epoxy resin Substances 0.000 claims 2
239000005007 epoxy-phenolic resin Substances 0.000 claims 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
238000007254 oxidation reaction Methods 0.000 abstract description 13
230000003647 oxidation Effects 0.000 abstract description 11
239000000463 material Substances 0.000 description 22
239000000047 product Substances 0.000 description 14
238000011282 treatment Methods 0.000 description 14
239000002904 solvent Substances 0.000 description 10
238000000576 coating method Methods 0.000 description 9
239000011159 matrix material Substances 0.000 description 9
229920001971 elastomer Polymers 0.000 description 8
235000013824 polyphenols Nutrition 0.000 description 8
239000005060 rubber Substances 0.000 description 8
238000001465 metallisation Methods 0.000 description 7
239000003054 catalyst Substances 0.000 description 6
238000010899 nucleation Methods 0.000 description 6
239000003960 organic solvent Substances 0.000 description 6
229920005989 resin Polymers 0.000 description 6
239000011347 resin Substances 0.000 description 6
239000011248 coating agent Substances 0.000 description 5
125000003700 epoxy group Chemical group 0.000 description 5
238000002156 mixing Methods 0.000 description 5
239000002243 precursor Substances 0.000 description 5
230000003197 catalytic effect Effects 0.000 description 4
239000003795 chemical substances by application Substances 0.000 description 4
239000006185 dispersion Substances 0.000 description 4
239000000945 filler Substances 0.000 description 4
239000004615 ingredient Substances 0.000 description 4
XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical group COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
238000007766 curtain coating Methods 0.000 description 3
238000010525 oxidative degradation reaction Methods 0.000 description 3
238000007747 plating Methods 0.000 description 3
239000000126 substance Substances 0.000 description 3
229920001187 thermosetting polymer Polymers 0.000 description 3
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
CFRNDJFRRKMHTL-UHFFFAOYSA-N [3-octanoyloxy-2,2-bis(octanoyloxymethyl)propyl] octanoate Chemical compound CCCCCCCC(=O)OCC(COC(=O)CCCCCCC)(COC(=O)CCCCCCC)COC(=O)CCCCCCC CFRNDJFRRKMHTL-UHFFFAOYSA-N 0.000 description 2
230000008901 benefit Effects 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
239000007800 oxidant agent Substances 0.000 description 2
-1 polypropylene Polymers 0.000 description 2
238000000926 separation method Methods 0.000 description 2
238000005476 soldering Methods 0.000 description 2
KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 2
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
CKDAPHXLBCKEKI-UHFFFAOYSA-N C=CC=C.C(=O)(O)C(C#N)=C Chemical compound C=CC=C.C(=O)(O)C(C#N)=C CKDAPHXLBCKEKI-UHFFFAOYSA-N 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
239000005977 Ethylene Substances 0.000 description 1
KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
239000005062 Polybutadiene Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
238000003618 dip coating Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005265 energy consumption Methods 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
239000012467 final product Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
238000010030 laminating Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
230000018984 mastication Effects 0.000 description 1
238000010077 mastication Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
230000035515 penetration Effects 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
238000002203 pretreatment Methods 0.000 description 1
BALXUFOVQVENIU-KXNXZCPBSA-N pseudoephedrine hydrochloride Chemical compound [H+].[Cl-].CN[C@@H](C)[C@@H](O)C1=CC=CC=C1 BALXUFOVQVENIU-KXNXZCPBSA-N 0.000 description 1
238000009877 rendering Methods 0.000 description 1
230000008439 repair process Effects 0.000 description 1
230000004044 response Effects 0.000 description 1
229920002050 silicone resin Polymers 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
239000001119 stannous chloride Substances 0.000 description 1
DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
238000010792 warming Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Polymers & Plastics (AREA)
Medicinal Chemistry (AREA)
Health & Medical Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Compositions Of Macromolecular Compounds (AREA)
Manufacturing Of Printed Wiring (AREA)
Epoxy Resins (AREA)
Adhesives Or Adhesive Processes (AREA)

CA255,541A 1975-07-25 1976-06-23 Substrats polymeriques a deux phases pour la deposition non electrolytique des metaux Expired CA1077643A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US59877075A	1975-07-25	1975-07-25

Publications (1)

Publication Number	Publication Date
CA1077643A true CA1077643A (fr)	1980-05-13

Family

ID=24396845

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA255,541A Expired CA1077643A (fr)	1975-07-25	1976-06-23	Substrats polymeriques a deux phases pour la deposition non electrolytique des metaux

Country Status (13)

Country	Link
JP (1)	JPS5953295B2 (fr)
AT (1)	AT362008B (fr)
AU (1)	AU503695B2 (fr)
CA (1)	CA1077643A (fr)
CH (1)	CH636631A5 (fr)
DE (1)	DE2633094C3 (fr)
FR (1)	FR2333024A1 (fr)
GB (1)	GB1531826A (fr)
IL (1)	IL50093A (fr)
IT (1)	IT1066020B (fr)
NL (1)	NL185935C (fr)
SE (1)	SE7608413L (fr)
ZA (1)	ZA763010B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2809917B1 (de) *	1978-03-08	1979-07-26	Dynamit Nobel Ag	Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben
DE2828288C2 (de) *	1978-06-28	1982-04-15	Dynamit Nobel Ag, 5210 Troisdorf	Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen
US4797508A (en) *	1986-09-19	1989-01-10	Firan Corporation	Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
CA1318416C (fr) *	1987-01-14	1993-05-25	Kollmorgen Corporation	Produits de metallisation servant a la fabrication de circuits imprimes par superposition
JPH02117948A (ja) *	1988-08-30	1990-05-02	Japan Synthetic Rubber Co Ltd	変性エポキシ組成物
JP4722954B2 (ja) *	2008-03-17	2011-07-13	イビデン株式会社	プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AT310285B (de) *	1966-02-22	1973-09-25	Photocircuits Corp	Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
DE1790293B2 (de) *	1966-02-22	1973-12-13	Photocircuits Corp., Glen Cove, N.Y. (V.St.A.)	Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314

1976
- 1976-05-20 ZA ZA763010A patent/ZA763010B/xx unknown
- 1976-06-23 CA CA255,541A patent/CA1077643A/fr not_active Expired
- 1976-06-24 AU AU15255/76A patent/AU503695B2/en not_active Expired
- 1976-07-19 CH CH922376A patent/CH636631A5/de not_active IP Right Cessation
- 1976-07-20 DE DE2633094A patent/DE2633094C3/de not_active Expired
- 1976-07-21 IL IL50093A patent/IL50093A/xx unknown
- 1976-07-23 AT AT545376A patent/AT362008B/de not_active IP Right Cessation
- 1976-07-23 GB GB30744/76A patent/GB1531826A/en not_active Expired
- 1976-07-23 NL NLAANVRAGE7608242,A patent/NL185935C/xx not_active IP Right Cessation
- 1976-07-23 SE SE7608413A patent/SE7608413L/xx unknown
- 1976-07-26 JP JP51089616A patent/JPS5953295B2/ja not_active Expired
- 1976-07-26 IT IT50600/76A patent/IT1066020B/it active
- 1976-07-26 FR FR7622745A patent/FR2333024A1/fr active Granted

Also Published As

Publication number	Publication date
DE2633094B2 (de)	1979-08-30
IT1066020B (it)	1985-03-04
DE2633094A1 (de)	1977-01-27
ATA545376A (de)	1980-09-15
FR2333024B1 (fr)	1979-05-25
IL50093A (en)	1980-01-31
NL185935C (nl)	1990-08-16
FR2333024A1 (fr)	1977-06-24
JPS5953295B2 (ja)	1984-12-24
AT362008B (de)	1981-04-27
AU503695B2 (en)	1979-09-13
DE2633094C3 (de)	1987-02-12
NL7608242A (nl)	1977-01-27
ZA763010B (en)	1977-04-27
NL185935B (nl)	1990-03-16
SE7608413L (sv)	1977-01-26
GB1531826A (en)	1978-11-08
CH636631A5 (en)	1983-06-15
JPS5215569A (en)	1977-02-05
IL50093A0 (en)	1976-09-30
AU1525576A (en)	1978-01-05

Legal Events

Date	Code	Title	Description
1997-05-13	MKEX	Expiry

Publication	Publication Date	Title
DE69426472T2 (de)	2001-04-19	Klebstoffe für stromlose Metallisierung und Leiterplatten
AU608215B2 (en)	1991-03-28	Conductive copper paste composition
AU608245B2 (en)	1991-03-28	Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US3347724A (en)	1967-10-17	Metallizing flexible substrata
US3259559A (en)	1966-07-05	Method for electroless copper plating
US4832989A (en)	1989-05-23	Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces
US4522850A (en)	1985-06-11	Polymeric substrates for electroless metal deposition
JPH05502059A (ja)	1993-04-15	ポリ（アリールエーテルケトン）表面の金属被覆
US3399268A (en)	1968-08-27	Chemical metallization and products produced thereby
CN111440364B (zh)	2022-12-27	树脂组合物、半固化片、电路基板和印制电路板
EP1236760B1 (fr)	2005-10-26	Solvant gonflant pour la texturation et le décapage et l'ébeurrage de surfaces polymériques
GB2090476A (en)	1982-07-07	Electrical conductors arranged in multiple layers and preparation thereof
US3770571A (en)	1973-11-06	Fabrication of printed circuit boards
US3697319A (en)	1972-10-10	Method of metallizing an electrically insulating surface
US3681474A (en)	1972-08-01	Electrical substrates
JPS5953295B2 (ja)	1984-12-24	無電解金属析出用の新規な高分子基質
US5230928A (en)	1993-07-27	Electroless plating method
JP3290529B2 (ja)	2002-06-10	無電解めっき用接着剤、無電解めっき用接着剤層およびプリント配線板
US3781275A (en)	1973-12-25	Electrical substrates
US4687681A (en)	1987-08-18	Method of making a chemically bonded coating on a fibrous or filamentous substrate
JPH09124806A (ja)	1997-05-13	プリプレグの製法
JPH0314871B2 (fr)	1991-02-27
US5162438A (en)	1992-11-10	Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents
JP3770989B2 (ja)	2006-04-26	プリプレグの製造方法
JPH0525195B2 (fr)	1993-04-12