CA1120420A - Process for providing a polymer-electroplate bond of improved strength and stability - Google Patents
Process for providing a polymer-electroplate bond of improved strength and stabilityInfo
- Publication number
- CA1120420A CA1120420A CA000285376A CA285376A CA1120420A CA 1120420 A CA1120420 A CA 1120420A CA 000285376 A CA000285376 A CA 000285376A CA 285376 A CA285376 A CA 285376A CA 1120420 A CA1120420 A CA 1120420A
- Authority
- CA
- Canada
- Prior art keywords
- bond
- nickel
- substrate
- group viii
- viii metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 28
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000032683 aging Effects 0.000 claims abstract description 21
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000004033 plastic Substances 0.000 claims abstract description 16
- 229920003023 plastic Polymers 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 239000002659 electrodeposit Substances 0.000 claims abstract description 13
- 238000004070 electrodeposition Methods 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 99
- 229910052759 nickel Inorganic materials 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 22
- 239000006229 carbon black Substances 0.000 claims description 15
- 229910052717 sulfur Inorganic materials 0.000 claims description 14
- 239000011593 sulfur Substances 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 11
- -1 polypropylene Polymers 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000006385 ozonation reaction Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 230000002939 deleterious effect Effects 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 18
- 239000010410 layer Substances 0.000 description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 239000004615 ingredient Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005486 sulfidation Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 244000228957 Ferula foetida Species 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 241000486442 Parastichtis suspecta Species 0.000 description 1
- 244000269722 Thea sinensis Species 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- KDBQRAGSEVVHSN-UHFFFAOYSA-L copper(II) sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O KDBQRAGSEVVHSN-UHFFFAOYSA-L 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical group [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73531276A | 1976-10-26 | 1976-10-26 | |
| US735,312 | 1976-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1120420A true CA1120420A (en) | 1982-03-23 |
Family
ID=24955243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000285376A Expired CA1120420A (en) | 1976-10-26 | 1977-08-24 | Process for providing a polymer-electroplate bond of improved strength and stability |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS5354133A (de) |
| AT (1) | AT358350B (de) |
| AU (1) | AU508106B2 (de) |
| BE (1) | BE860143R (de) |
| CA (1) | CA1120420A (de) |
| CH (1) | CH609733A5 (de) |
| DE (1) | DE2747920A1 (de) |
| ES (1) | ES463498A2 (de) |
| FR (1) | FR2369356A2 (de) |
| GB (1) | GB1534638A (de) |
| IT (1) | IT1116138B (de) |
| NL (1) | NL7711671A (de) |
| SE (1) | SE7711982L (de) |
| ZA (1) | ZA776225B (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6989087B2 (en) * | 2000-12-08 | 2006-01-24 | Kohler Mira Ltd. | Metal finishes |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3004265A1 (de) * | 1979-02-08 | 1980-10-23 | Kokoku Rubber Ind | Zum unmittelbaren plattieren geeignete harzverbindung |
| LT2000074A (lt) * | 2000-07-20 | 2002-01-25 | Mykolas Baranauskas | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1253949A (fr) * | 1960-01-07 | 1961-02-17 | Nobel Bozel | Plaques polymétalliques pour l'impression offset |
| FR1521281A (fr) * | 1966-05-02 | 1968-04-12 | M & T Chemicals | Procédé pour déposer du nickel sur une plaque métallique |
| DE2101049A1 (de) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
-
1977
- 1977-08-24 CA CA000285376A patent/CA1120420A/en not_active Expired
- 1977-10-13 AU AU29678/77A patent/AU508106B2/en not_active Expired
- 1977-10-19 ZA ZA00776225A patent/ZA776225B/xx unknown
- 1977-10-21 GB GB43955/77A patent/GB1534638A/en not_active Expired
- 1977-10-24 FR FR7731927A patent/FR2369356A2/fr active Pending
- 1977-10-25 IT IT51541/77A patent/IT1116138B/it active
- 1977-10-25 SE SE7711982A patent/SE7711982L/ not_active Application Discontinuation
- 1977-10-25 NL NL7711671A patent/NL7711671A/xx not_active Application Discontinuation
- 1977-10-25 AT AT760877A patent/AT358350B/de not_active IP Right Cessation
- 1977-10-25 ES ES463498A patent/ES463498A2/es not_active Expired
- 1977-10-25 CH CH1297277A patent/CH609733A5/xx not_active IP Right Cessation
- 1977-10-26 JP JP12771077A patent/JPS5354133A/ja active Pending
- 1977-10-26 DE DE19772747920 patent/DE2747920A1/de not_active Ceased
- 1977-10-26 BE BE182090A patent/BE860143R/xx active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6989087B2 (en) * | 2000-12-08 | 2006-01-24 | Kohler Mira Ltd. | Metal finishes |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1534638A (en) | 1978-12-06 |
| BE860143R (fr) | 1978-04-26 |
| CH609733A5 (en) | 1979-03-15 |
| NL7711671A (nl) | 1978-04-28 |
| ZA776225B (en) | 1978-11-29 |
| AT358350B (de) | 1980-09-10 |
| ES463498A2 (es) | 1978-07-16 |
| IT1116138B (it) | 1986-02-10 |
| ATA760877A (de) | 1980-01-15 |
| JPS5354133A (en) | 1978-05-17 |
| SE7711982L (sv) | 1978-04-27 |
| AU508106B2 (en) | 1980-03-06 |
| AU2967877A (en) | 1979-04-26 |
| FR2369356A2 (fr) | 1978-05-26 |
| DE2747920A1 (de) | 1978-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4009093A (en) | Platable polymeric composition | |
| US3865699A (en) | Electrodeposition on non-conductive surfaces | |
| CA1192858A (en) | Process for plating polymeric substrates | |
| US4278510A (en) | Platable propylene polymer compositions | |
| US4673469A (en) | Method of plating plastics | |
| US4270957A (en) | Method for cleaning aluminum articles | |
| US6136460A (en) | Tin coatings incorporating selected elemental additions to reduce discoloration | |
| GB2059442A (en) | Micro-throwing Alloy Undercoatings and Method for Improving Corrosion Resistance | |
| WO2007008369A1 (en) | Tin electrodeposits having properties or characteristics that minimize tin whisker growth | |
| US4268579A (en) | Primer for powder coating | |
| CA1120420A (en) | Process for providing a polymer-electroplate bond of improved strength and stability | |
| CA1162505A (en) | Process for high speed nickel and gold electroplate system | |
| KR880002937A (ko) | 폴리우레판 수지 분산재를 함유한 양이온 전해석출성 수지조성물 | |
| US4159229A (en) | Method of plating light weight metal to enhance lateral corrosion resistance | |
| US11293111B2 (en) | Plating bronze on polymer sheets | |
| US5073403A (en) | Aluminum-plated steel sheet for cans | |
| US2791553A (en) | Method of electroplating aluminum | |
| US5013410A (en) | Method of manufacturing an aluminum-plated steel sheet for cans | |
| US3846258A (en) | Process for solder coating silicon solar cells | |
| TWI589732B (zh) | 化學轉化處理鋼板及化學轉化處理鋼板的製造方法 | |
| DE1958519A1 (de) | Verfahren zum kontinuierlichen galvanischen Abscheiden von Metallen auf nichtleitenden Gegenstaenden ohne Metallabscheidung auf deren Traggestellen | |
| JP2006312762A (ja) | 錫めっき鉄系金属材料 | |
| JPH0247311B2 (de) | ||
| JPH0513995B2 (de) | ||
| US2039067A (en) | Copper-antimony or copper-bismuth coated ferrous metals |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |