CA1136006A - Methode de deposition d'un placage brillant sans electrolyse, et produits ainsi obtenus - Google Patents

Methode de deposition d'un placage brillant sans electrolyse, et produits ainsi obtenus

Info

Publication number: CA1136006A
Authority: CA; Canada
Prior art keywords: coating; electroless; copper; metal; primary
Prior art date: 1978-02-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA000321322A

Other languages

English (en)

Inventor

Harold Narcus

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-02-13

Filing date

1979-02-12

Publication date

1982-11-23

1978-02-13 Priority claimed from US05/876,895 external-priority patent/US4169171A/en

1979-02-12 Application filed by Individual filed Critical Individual

1982-11-23 Application granted granted Critical

1982-11-23 Publication of CA1136006A publication Critical patent/CA1136006A/fr

Status Expired legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 42
230000008569 process Effects 0.000 title abstract description 24
238000007772 electroless plating Methods 0.000 title description 2
238000000576 coating method Methods 0.000 claims abstract description 70
239000011248 coating agent Substances 0.000 claims abstract description 65
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
229910052802 copper Inorganic materials 0.000 claims abstract description 53
239000010949 copper Substances 0.000 claims abstract description 53
229910052751 metal Inorganic materials 0.000 claims abstract description 53
239000002184 metal Substances 0.000 claims abstract description 53
230000008021 deposition Effects 0.000 claims abstract description 10
238000007654 immersion Methods 0.000 claims abstract description 8
239000000758 substrate Substances 0.000 claims description 35
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 33
239000000203 mixture Substances 0.000 claims description 18
229910052759 nickel Inorganic materials 0.000 claims description 17
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
239000011574 phosphorus Substances 0.000 claims description 13
229910052698 phosphorus Inorganic materials 0.000 claims description 13
239000003054 catalyst Substances 0.000 claims description 12
238000002310 reflectometry Methods 0.000 claims description 7
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 6
230000001133 acceleration Effects 0.000 claims description 6
229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 6
239000002738 chelating agent Substances 0.000 claims description 5
239000003638 chemical reducing agent Substances 0.000 claims description 5
239000002253 acid Substances 0.000 claims description 4
230000003213 activating effect Effects 0.000 claims description 4
-1 ammonium ions Chemical class 0.000 claims description 4
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
230000004913 activation Effects 0.000 claims description 3
229910001431 copper ion Inorganic materials 0.000 claims description 3
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
238000005530 etching Methods 0.000 claims description 3
239000005749 Copper compound Substances 0.000 claims description 2
238000005282 brightening Methods 0.000 claims description 2
150000001875 compounds Chemical class 0.000 claims description 2
150000001880 copper compounds Chemical class 0.000 claims description 2
238000006386 neutralization reaction Methods 0.000 claims description 2
230000009467 reduction Effects 0.000 claims description 2
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 2
VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
229960000583 acetic acid Drugs 0.000 claims 1
229910052783 alkali metal Inorganic materials 0.000 claims 1
150000001340 alkali metals Chemical class 0.000 claims 1
239000000908 ammonium hydroxide Substances 0.000 claims 1
229910000365 copper sulfate Inorganic materials 0.000 claims 1
239000012362 glacial acetic acid Substances 0.000 claims 1
238000002360 preparation method Methods 0.000 claims 1
150000003467 sulfuric acid derivatives Chemical class 0.000 claims 1
229920003023 plastic Polymers 0.000 abstract description 18
239000004033 plastic Substances 0.000 abstract description 18
238000009713 electroplating Methods 0.000 abstract description 13
238000000151 deposition Methods 0.000 abstract description 10
230000001464 adherent effect Effects 0.000 abstract description 3
229910045601 alloy Inorganic materials 0.000 abstract description 3
239000000956 alloy Substances 0.000 abstract description 3
230000008030 elimination Effects 0.000 abstract description 3
238000003379 elimination reaction Methods 0.000 abstract description 3
238000002203 pretreatment Methods 0.000 abstract 1
239000000243 solution Substances 0.000 description 28
229910001868 water Inorganic materials 0.000 description 18
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 11
NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 9
238000007747 plating Methods 0.000 description 9
235000014786 phosphorus Nutrition 0.000 description 7
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
239000004676 acrylonitrile butadiene styrene Substances 0.000 description 6
KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
239000012279 sodium borohydride Substances 0.000 description 6
229910000033 sodium borohydride Inorganic materials 0.000 description 6
QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 5
235000019270 ammonium chloride Nutrition 0.000 description 5
229910017052 cobalt Inorganic materials 0.000 description 5
239000010941 cobalt Substances 0.000 description 5
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 5
238000009472 formulation Methods 0.000 description 5
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
229910052737 gold Inorganic materials 0.000 description 5
239000010931 gold Substances 0.000 description 5
239000000126 substance Substances 0.000 description 5
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
239000003795 chemical substances by application Substances 0.000 description 4
229910052804 chromium Inorganic materials 0.000 description 4
239000011651 chromium Substances 0.000 description 4
230000006872 improvement Effects 0.000 description 4
229910052763 palladium Inorganic materials 0.000 description 4
239000003381 stabilizer Substances 0.000 description 4
UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
229910021591 Copper(I) chloride Inorganic materials 0.000 description 3
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
230000008901 benefit Effects 0.000 description 3
KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 3
150000001879 copper Chemical class 0.000 description 3
OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 3
229940045803 cuprous chloride Drugs 0.000 description 3
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
150000003839 salts Chemical class 0.000 description 3
229910052709 silver Inorganic materials 0.000 description 3
239000004332 silver Substances 0.000 description 3
239000001509 sodium citrate Substances 0.000 description 3
NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 3
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 description 2
PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 2
229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
238000013019 agitation Methods 0.000 description 2
230000000712 assembly Effects 0.000 description 2
238000000429 assembly Methods 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
229910052796 boron Inorganic materials 0.000 description 2
RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 2
229910000331 cadmium sulfate Inorganic materials 0.000 description 2
230000009920 chelation Effects 0.000 description 2
XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
238000004070 electrodeposition Methods 0.000 description 2
FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 2
BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
235000014655 lactic acid Nutrition 0.000 description 2
229940046892 lead acetate Drugs 0.000 description 2
230000002101 lytic effect Effects 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229910021645 metal ion Inorganic materials 0.000 description 2
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
238000005498 polishing Methods 0.000 description 2
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
WFRUBUQWJYMMRQ-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F WFRUBUQWJYMMRQ-UHFFFAOYSA-M 0.000 description 2
235000019260 propionic acid Nutrition 0.000 description 2
238000006722 reduction reaction Methods 0.000 description 2
230000001235 sensitizing effect Effects 0.000 description 2
229910052708 sodium Inorganic materials 0.000 description 2
239000011734 sodium Substances 0.000 description 2
235000010267 sodium hydrogen sulphite Nutrition 0.000 description 2
235000011006 sodium potassium tartrate Nutrition 0.000 description 2
239000001119 stannous chloride Substances 0.000 description 2
235000011150 stannous chloride Nutrition 0.000 description 2
239000001117 sulphuric acid Substances 0.000 description 2
239000004094 surface-active agent Substances 0.000 description 2
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
WTFNSXYULBQCQV-UHFFFAOYSA-N $l^{1}-oxidanyloxymethane Chemical compound CO[O] WTFNSXYULBQCQV-UHFFFAOYSA-N 0.000 description 1
LJHFIVQEAFAURQ-ZPUQHVIOSA-N (NE)-N-[(2E)-2-hydroxyiminoethylidene]hydroxylamine Chemical compound O\N=C\C=N\O LJHFIVQEAFAURQ-ZPUQHVIOSA-N 0.000 description 1
RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
101150039167 Bex3 gene Proteins 0.000 description 1
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
229910000531 Co alloy Inorganic materials 0.000 description 1
229910021580 Cobalt(II) chloride Inorganic materials 0.000 description 1
XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
229910002651 NO3 Inorganic materials 0.000 description 1
229910021205 NaH2PO2 Inorganic materials 0.000 description 1
229910021202 NaH2PO2.H2O Inorganic materials 0.000 description 1
229910000990 Ni alloy Inorganic materials 0.000 description 1
NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
239000005864 Sulphur Substances 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
ARHBWGMHXPPGCZ-UHFFFAOYSA-N [K].[Au](C#N)(C#N)C#N Chemical compound [K].[Au](C#N)(C#N)C#N ARHBWGMHXPPGCZ-UHFFFAOYSA-N 0.000 description 1
239000012190 activator Substances 0.000 description 1
239000003513 alkali Substances 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical class N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
MIAUJDCQDVWHEV-UHFFFAOYSA-N benzene-1,2-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1S(O)(=O)=O MIAUJDCQDVWHEV-UHFFFAOYSA-N 0.000 description 1
238000003339 best practice Methods 0.000 description 1
229910052793 cadmium Inorganic materials 0.000 description 1
BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000003486 chemical etching Methods 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
150000003841 chloride salts Chemical class 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
230000001427 coherent effect Effects 0.000 description 1
238000010960 commercial process Methods 0.000 description 1
230000001143 conditioned effect Effects 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
238000005034 decoration Methods 0.000 description 1
KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
230000009977 dual effect Effects 0.000 description 1
230000005611 electricity Effects 0.000 description 1
239000002659 electrodeposit Substances 0.000 description 1
238000001914 filtration Methods 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000000227 grinding Methods 0.000 description 1
XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
230000007062 hydrolysis Effects 0.000 description 1
238000006460 hydrolysis reaction Methods 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
239000000976 ink Substances 0.000 description 1
229910001853 inorganic hydroxide Inorganic materials 0.000 description 1
UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
239000004310 lactic acid Substances 0.000 description 1
238000003754 machining Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
229910052750 molybdenum Inorganic materials 0.000 description 1
239000011733 molybdenum Substances 0.000 description 1
DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
125000000896 monocarboxylic acid group Chemical group 0.000 description 1
238000000465 moulding Methods 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
150000002923 oximes Chemical class 0.000 description 1
239000003973 paint Substances 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
239000002245 particle Substances 0.000 description 1
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
238000009428 plumbing Methods 0.000 description 1
239000002798 polar solvent Substances 0.000 description 1
229910052700 potassium Inorganic materials 0.000 description 1
150000004672 propanoic acids Chemical class 0.000 description 1
IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
229910052711 selenium Inorganic materials 0.000 description 1
239000011669 selenium Substances 0.000 description 1
MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
239000001476 sodium potassium tartrate Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
229940124530 sulfonamide Drugs 0.000 description 1
150000003456 sulfonamides Chemical class 0.000 description 1
150000003871 sulfonates Chemical class 0.000 description 1
150000003460 sulfonic acids Chemical class 0.000 description 1
235000011149 sulphuric acid Nutrition 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
150000003585 thioureas Chemical class 0.000 description 1
239000011135 tin Substances 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
239000002023 wood Substances 0.000 description 1

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Chemically Coating (AREA)

CA000321322A 1978-02-13 1979-02-12 Methode de deposition d'un placage brillant sans electrolyse, et produits ainsi obtenus Expired CA1136006A (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US876,895		1978-02-13
US05/876,895 US4169171A (en)	1977-11-07	1978-02-13	Bright electroless plating process and plated articles produced thereby

Publications (1)

Publication Number	Publication Date
CA1136006A true CA1136006A (fr)	1982-11-23

Family

ID=25368788

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000321322A Expired CA1136006A (fr)	1978-02-13	1979-02-12	Methode de deposition d'un placage brillant sans electrolyse, et produits ainsi obtenus

Country Status (1)

Country	Link
CA (1)	CA1136006A (fr)

1979
- 1979-02-12 CA CA000321322A patent/CA1136006A/fr not_active Expired

Legal Events

Date	Code	Title	Description
1999-11-23	MKEX	Expiry

Publication	Publication Date	Title
US4169171A (en)	1979-09-25	Bright electroless plating process and plated articles produced thereby
US4160049A (en)	1979-07-03	Bright electroless plating process producing two-layer nickel coatings on dielectric substrates
US3370974A (en)	1968-02-27	Electroless plating on non-conductive materials
CA1130952A (fr)	1982-09-07	Solution non electrolytique de deposition du cuivre employant un agent reducteur constitue d'hypophosphite
US5250105A (en)	1993-10-05	Selective process for printing circuit board manufacturing
EP0905285B1 (fr)	2000-12-27	Procede pour metalliser par voie electrolytique un materiau non conducteur
US3962494A (en)	1976-06-08	Sensitized substrates for chemical metallization
US4279948A (en)	1981-07-21	Electroless copper deposition solution using a hypophosphite reducing agent
US20050266165A1 (en)	2005-12-01	Method for metallizing plastic surfaces
ES8205021A1 (es)	1982-05-16	Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor
CA2425575A1 (fr)	2002-05-10	Procede de depot autocatalytique de nickel
US4061802A (en)	1977-12-06	Plating process and bath
US20040132300A1 (en)	2004-07-08	Procedure for activation of substrates for plastic galvanizing
US3819497A (en)	1974-06-25	Electroless and electrolytic copper plating
US2827399A (en)	1958-03-18	Electroless deposition of iron alloys
CA2210883A1 (fr)	1996-09-26	Procede de metallisation electrolytique selective ou partielle de surfaces de substrats composes de materiaux non conducteurs
US4325990A (en)	1982-04-20	Electroless copper deposition solutions with hypophosphite reducing agent
US4770751A (en)	1988-09-13	Method for forming on a nonconductor a shielding layer against electromagnetic radiation
EP2825690A2 (fr)	2015-01-21	Procédé pour la métallisation de surfaces plastiques non conductrices
US3694250A (en)	1972-09-26	Electroless copper plating
US5298058A (en)	1994-03-29	Electroless copper plating bath
US4474838A (en)	1984-10-02	Electroless direct deposition of gold on metallized ceramics
CA1136006A (fr)	1982-11-23	Methode de deposition d'un placage brillant sans electrolyse, et produits ainsi obtenus
CA1058457A (fr)	1979-07-17	Procede de sensibilisation de la surface d'articles non-metalliques pour le revetement non electrolytique
US3516848A (en)	1970-06-23	Process and solution for sensitizing substrates for electroless plating