CA1163056A - Solutions au cuivre pour la deposition sans electrolyse - Google Patents

Solutions au cuivre pour la deposition sans electrolyse

Info

Publication number: CA1163056A
Authority: CA; Canada
Prior art keywords: solution; cupric; copper; substrate; ions
Prior art date: 1981-12-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA000393444A

Other languages

English (en)

Inventor

Donald R. Ferrier

Harold L. Rhodenizer

Peter E. Kukanskis

John J. Grunwald

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

MacDermid Inc

Original Assignee

MacDermid Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-12-30

Filing date

1981-12-30

Publication date

1984-03-06

1981-12-30 Application filed by MacDermid Inc filed Critical MacDermid Inc

1981-12-30 Priority to CA000393444A priority Critical patent/CA1163056A/fr

1984-03-06 Application granted granted Critical

1984-03-06 Publication of CA1163056A publication Critical patent/CA1163056A/fr

Status Expired legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 111
239000010949 copper Substances 0.000 title claims abstract description 111
229910052802 copper Inorganic materials 0.000 title claims abstract description 109
230000008021 deposition Effects 0.000 title claims description 16
238000007747 plating Methods 0.000 claims abstract description 41
239000000758 substrate Substances 0.000 claims abstract description 39
239000003638 chemical reducing agent Substances 0.000 claims abstract description 29
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims abstract description 23
150000001450 anions Chemical class 0.000 claims abstract description 11
-1 halides and acetates Chemical class 0.000 claims abstract description 10
150000001242 acetic acid derivatives Chemical class 0.000 claims abstract description 4
150000004820 halides Chemical class 0.000 claims abstract description 4
150000002500 ions Chemical class 0.000 claims description 29
238000000151 deposition Methods 0.000 claims description 21
238000000034 method Methods 0.000 claims description 16
229910052751 metal Inorganic materials 0.000 claims description 11
239000002184 metal Substances 0.000 claims description 11
239000008139 complexing agent Substances 0.000 claims description 9
URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 7
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 7
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
238000001556 precipitation Methods 0.000 claims description 5
230000009467 reduction Effects 0.000 claims description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
239000003795 chemical substances by application Substances 0.000 claims description 4
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 3
230000002452 interceptive effect Effects 0.000 claims description 3
230000000536 complexating effect Effects 0.000 claims description 2
XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims 6
238000006722 reduction reaction Methods 0.000 claims 2
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 21
230000003197 catalytic effect Effects 0.000 abstract description 2
239000013522 chelant Substances 0.000 abstract 1
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
229910052759 nickel Inorganic materials 0.000 description 7
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000002253 acid Substances 0.000 description 6
238000007772 electroless plating Methods 0.000 description 6
239000004033 plastic Substances 0.000 description 6
229920003023 plastic Polymers 0.000 description 6
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
229910052804 chromium Inorganic materials 0.000 description 5
239000011651 chromium Substances 0.000 description 5
150000001879 copper Chemical class 0.000 description 5
238000009713 electroplating Methods 0.000 description 5
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
230000008901 benefit Effects 0.000 description 4
239000000203 mixture Substances 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
239000002585 base Substances 0.000 description 3
239000011248 coating agent Substances 0.000 description 3
238000000576 coating method Methods 0.000 description 3
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
238000002360 preparation method Methods 0.000 description 3
229920001187 thermosetting polymer Polymers 0.000 description 3
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
239000004593 Epoxy Substances 0.000 description 2
239000004721 Polyphenylene oxide Substances 0.000 description 2
239000004743 Polypropylene Substances 0.000 description 2
230000001464 adherent effect Effects 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
239000002738 chelating agent Substances 0.000 description 2
239000000470 constituent Substances 0.000 description 2
239000011889 copper foil Substances 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
239000002245 particle Substances 0.000 description 2
229920006380 polyphenylene oxide Polymers 0.000 description 2
229920001155 polypropylene Polymers 0.000 description 2
239000002244 precipitate Substances 0.000 description 2
230000008569 process Effects 0.000 description 2
229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
238000012360 testing method Methods 0.000 description 2
229920001169 thermoplastic Polymers 0.000 description 2
239000004416 thermosoftening plastic Substances 0.000 description 2
BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 description 1
RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
229910017981 Cu(BF4)2 Inorganic materials 0.000 description 1
101100353161 Drosophila melanogaster prel gene Proteins 0.000 description 1
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
229910021205 NaH2PO2 Inorganic materials 0.000 description 1
239000004727 Noryl Substances 0.000 description 1
229920001207 Noryl Polymers 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
230000006978 adaptation Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
238000013019 agitation Methods 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
235000019270 ammonium chloride Nutrition 0.000 description 1
BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
229910052921 ammonium sulfate Inorganic materials 0.000 description 1
235000011130 ammonium sulphate Nutrition 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical group Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
238000010960 commercial process Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
229960003280 cupric chloride Drugs 0.000 description 1
229960004643 cupric oxide Drugs 0.000 description 1
230000002939 deleterious effect Effects 0.000 description 1
230000001627 detrimental effect Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000011152 fibreglass Substances 0.000 description 1
239000011888 foil Substances 0.000 description 1
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
238000009434 installation Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
239000002932 luster Substances 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000000615 nonconductor Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
ZMLDXWLZKKZVSS-UHFFFAOYSA-N palladium tin Chemical compound [Pd].[Sn] ZMLDXWLZKKZVSS-UHFFFAOYSA-N 0.000 description 1
238000007719 peel strength test Methods 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
238000007086 side reaction Methods 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000002904 solvent Substances 0.000 description 1
230000006641 stabilisation Effects 0.000 description 1
238000011105 stabilization Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
235000011149 sulphuric acid Nutrition 0.000 description 1
UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
239000012974 tin catalyst Substances 0.000 description 1
230000000007 visual effect Effects 0.000 description 1

Landscapes

Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

CA000393444A 1981-12-30 1981-12-30 Solutions au cuivre pour la deposition sans electrolyse Expired CA1163056A (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA000393444A CA1163056A (fr)	1981-12-30	1981-12-30	Solutions au cuivre pour la deposition sans electrolyse

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA000393444A CA1163056A (fr)	1981-12-30	1981-12-30	Solutions au cuivre pour la deposition sans electrolyse

Publications (1)

Publication Number	Publication Date
CA1163056A true CA1163056A (fr)	1984-03-06

Family

ID=4121735

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000393444A Expired CA1163056A (fr)	1981-12-30	1981-12-30	Solutions au cuivre pour la deposition sans electrolyse

Country Status (1)

Country	Link
CA (1)	CA1163056A (fr)

1981
- 1981-12-30 CA CA000393444A patent/CA1163056A/fr not_active Expired

Legal Events

Date	Code	Title	Description
2001-03-06	MKEX	Expiry

Publication	Publication Date	Title
US4265943A (en)	1981-05-05	Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US5250105A (en)	1993-10-05	Selective process for printing circuit board manufacturing
US4209331A (en)	1980-06-24	Electroless copper composition solution using a hypophosphite reducing agent
US5454930A (en)	1995-10-03	Electrolytic copper plating using a reducing agent
US4279948A (en)	1981-07-21	Electroless copper deposition solution using a hypophosphite reducing agent
US4814205A (en)	1989-03-21	Process for rejuvenation electroless nickel solution
EP0201806B1 (fr)	1991-08-28	Procédé de traitement d'un substrat en vue d'un dépôt chimique d'un métal
EP0053279B1 (fr)	1985-07-24	Procédé de préparation d'un circuit imprimé
US3959523A (en)	1976-05-25	Additive printed circuit boards and method of manufacture
US4325990A (en)	1982-04-20	Electroless copper deposition solutions with hypophosphite reducing agent
EP0538006A1 (fr)	1993-04-21	Procédé de métallisation directe
US3819497A (en)	1974-06-25	Electroless and electrolytic copper plating
US4913768A (en)	1990-04-03	Process for producing electrical conductor boards
US5298058A (en)	1994-03-29	Electroless copper plating bath
CA1163056A (fr)	1984-03-06	Solutions au cuivre pour la deposition sans electrolyse
JP3564460B2 (ja)	2004-09-08	プリント配線板用銅箔及びその製造方法
JP4789361B2 (ja)	2011-10-12	誘電体表面上に導電層を製造する方法
EP0096034B1 (fr)	1986-09-10	Solutions de depot non-electrolytique du cuivre
US3516848A (en)	1970-06-23	Process and solution for sensitizing substrates for electroless plating
EP0139233B1 (fr)	1987-05-27	Procédé pour le conditionnement de la surface d'un substrat diélectrique pour le placage sans courant
JP2648729B2 (ja)	1997-09-03	無電解銅めっき液および無電解銅めっき方法
GB2253415A (en)	1992-09-09	Selective process for printed circuit board manufacturing employing noble metal oxide catalyst.
CA1177773A (fr)	1984-11-13	Methode de placage metallique pour bain a potentiel electrique
GB2150601A (en)	1985-07-03	Initiation of electroless nickel plating
JPH0455550B2 (fr)	1992-09-03