CA1197629A - Dispositif semiconducteur a contact resistance obtenu par chargement - Google Patents

Dispositif semiconducteur a contact resistance obtenu par chargement

Info

Publication number
CA1197629A
CA1197629A CA000404965A CA404965A CA1197629A CA 1197629 A CA1197629 A CA 1197629A CA 000404965 A CA000404965 A CA 000404965A CA 404965 A CA404965 A CA 404965A CA 1197629 A CA1197629 A CA 1197629A
Authority
CA
Canada
Prior art keywords
layer
solder
forming
electrode
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000404965A
Other languages
English (en)
Inventor
King Owyang
Leonard Stein (Deceased)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of CA1197629A publication Critical patent/CA1197629A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
CA000404965A 1981-03-23 1982-06-11 Dispositif semiconducteur a contact resistance obtenu par chargement Expired CA1197629A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24623181A 1981-03-23 1981-03-23

Publications (1)

Publication Number Publication Date
CA1197629A true CA1197629A (fr) 1985-12-03

Family

ID=22929835

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000404965A Expired CA1197629A (fr) 1981-03-23 1982-06-11 Dispositif semiconducteur a contact resistance obtenu par chargement

Country Status (6)

Country Link
JP (1) JPS57172753A (fr)
CA (1) CA1197629A (fr)
DE (1) DE3209666A1 (fr)
FR (1) FR2502399B1 (fr)
GB (1) GB2095904B (fr)
MX (1) MX151818A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119777A (ja) * 1983-11-30 1985-06-27 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ
DE3446789A1 (de) * 1984-12-21 1986-07-03 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Verfahren zum herstellen von halbleiterbauelementen
DE3635708A1 (de) * 1986-10-21 1988-04-28 Bbc Brown Boveri & Cie Verfahren und anordnung zur kontaktierung einer elektrode mit mehreren emitter-/kathoden-bereichen eines halbleiterbauelementes
GB8902431D0 (en) * 1989-02-03 1989-03-22 Plessey Co Plc Flip chip solder bond structure for devices with gold based metallisation
FR2759493B1 (fr) * 1997-02-12 2001-01-26 Motorola Semiconducteurs Dispositif de puissance a semiconducteur
US6130141A (en) * 1998-10-14 2000-10-10 Lucent Technologies Inc. Flip chip metallization
EP1306898A1 (fr) 2001-10-29 2003-05-02 Dialog Semiconductor GmbH Sous-milliohm interconnexion sur puce
US7339110B1 (en) 2003-04-10 2008-03-04 Sunpower Corporation Solar cell and method of manufacture
US7388147B2 (en) * 2003-04-10 2008-06-17 Sunpower Corporation Metal contact structure for solar cell and method of manufacture
DE10355953B4 (de) * 2003-11-29 2005-10-20 Infineon Technologies Ag Verfahren zum Galvanisieren und Kontaktvorsprungsanordnung
USD621682S1 (en) 2009-08-21 2010-08-17 Schlage Lock Company Llc Door lever
USD621681S1 (en) 2009-08-21 2010-08-17 Schlage Lock Company Llc Door lever
CN110998807B (zh) * 2017-08-01 2023-12-01 株式会社村田制作所 半导体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3381183A (en) * 1965-06-21 1968-04-30 Rca Corp High power multi-emitter transistor
FR1569479A (fr) * 1967-07-13 1969-05-30
FR2254879B1 (fr) * 1973-12-12 1977-09-23 Alsthom Cgee
JPS50114183A (fr) * 1974-02-15 1975-09-06

Also Published As

Publication number Publication date
DE3209666A1 (de) 1982-11-11
JPS57172753A (en) 1982-10-23
FR2502399B1 (fr) 1986-01-31
GB2095904B (en) 1985-11-27
GB2095904A (en) 1982-10-06
MX151818A (es) 1985-03-27
FR2502399A1 (fr) 1982-09-24

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