CA1201086A - Methode et dispositif de fabrication de microfil - Google Patents

Methode et dispositif de fabrication de microfil

Info

Publication number
CA1201086A
CA1201086A CA000402402A CA402402A CA1201086A CA 1201086 A CA1201086 A CA 1201086A CA 000402402 A CA000402402 A CA 000402402A CA 402402 A CA402402 A CA 402402A CA 1201086 A CA1201086 A CA 1201086A
Authority
CA
Canada
Prior art keywords
die
microwire
blank
parts
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000402402A
Other languages
English (en)
Inventor
Stepan S. Klimenkov
Svyatoslav A. Bartashevich
Viktor S. Karpitsky
Vladimir G. Voitov
Alexandr V. Stepanenko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Belarusian National Technical University BNTU
Original Assignee
Belarusian National Technical University BNTU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Belarusian National Technical University BNTU filed Critical Belarusian National Technical University BNTU
Priority to CA000402402A priority Critical patent/CA1201086A/fr
Application granted granted Critical
Publication of CA1201086A publication Critical patent/CA1201086A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Metal Extraction Processes (AREA)
CA000402402A 1982-05-06 1982-05-06 Methode et dispositif de fabrication de microfil Expired CA1201086A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000402402A CA1201086A (fr) 1982-05-06 1982-05-06 Methode et dispositif de fabrication de microfil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000402402A CA1201086A (fr) 1982-05-06 1982-05-06 Methode et dispositif de fabrication de microfil

Publications (1)

Publication Number Publication Date
CA1201086A true CA1201086A (fr) 1986-02-25

Family

ID=4122720

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000402402A Expired CA1201086A (fr) 1982-05-06 1982-05-06 Methode et dispositif de fabrication de microfil

Country Status (1)

Country Link
CA (1) CA1201086A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112044964A (zh) * 2020-08-13 2020-12-08 东莞市冠标电工机械有限公司 一种高速微细铜拉丝机的电阻配模及其应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112044964A (zh) * 2020-08-13 2020-12-08 东莞市冠标电工机械有限公司 一种高速微细铜拉丝机的电阻配模及其应用

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Legal Events

Date Code Title Description
MKEX Expiry