CA1202734A - Methode de preparation des trous d'une plaquette a circuit imprime aux fins de leur metallisation - Google Patents
Methode de preparation des trous d'une plaquette a circuit imprime aux fins de leur metallisationInfo
- Publication number
- CA1202734A CA1202734A CA000455904A CA455904A CA1202734A CA 1202734 A CA1202734 A CA 1202734A CA 000455904 A CA000455904 A CA 000455904A CA 455904 A CA455904 A CA 455904A CA 1202734 A CA1202734 A CA 1202734A
- Authority
- CA
- Canada
- Prior art keywords
- resin
- holes
- metal
- thru
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 44
- 239000002904 solvent Substances 0.000 claims description 35
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 25
- 239000012286 potassium permanganate Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000012876 topography Methods 0.000 claims description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 2
- 238000010306 acid treatment Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 17
- 239000010949 copper Substances 0.000 abstract description 17
- 239000004593 Epoxy Substances 0.000 abstract description 13
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 abstract description 2
- 229960001841 potassium permanganate Drugs 0.000 description 18
- 239000011521 glass Substances 0.000 description 17
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000000635 electron micrograph Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- WXLPKTIAUMCNDX-UHFFFAOYSA-N 2h-pyran-3-ol Chemical compound OC1=CC=COC1 WXLPKTIAUMCNDX-UHFFFAOYSA-N 0.000 description 2
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 239000002964 rayon Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- BFXAWOHHDUIALU-UHFFFAOYSA-M sodium;hydron;difluoride Chemical compound F.[F-].[Na+] BFXAWOHHDUIALU-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50129583A | 1983-06-06 | 1983-06-06 | |
| US501,295 | 1983-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1202734A true CA1202734A (fr) | 1986-04-01 |
Family
ID=23992942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000455904A Expired CA1202734A (fr) | 1983-06-06 | 1984-06-05 | Methode de preparation des trous d'une plaquette a circuit imprime aux fins de leur metallisation |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS607194A (fr) |
| AU (1) | AU2808484A (fr) |
| CA (1) | CA1202734A (fr) |
| ZA (1) | ZA843703B (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4515829A (en) * | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
| CN119304711B (zh) * | 2024-12-17 | 2025-03-14 | 内江威士凯电子有限公司 | 一种pcb板及其打磨装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833353A (fr) * | 1971-09-01 | 1973-05-09 | ||
| GB1500040A (en) * | 1975-07-08 | 1978-02-08 | Neil Holdings Ltd James | Adjustable mountings |
| JPS5524713A (en) * | 1978-08-09 | 1980-02-22 | Hitachi Ltd | Double mandrel type reel |
| JPS5626495A (en) * | 1979-08-09 | 1981-03-14 | Matsushita Electric Industrial Co Ltd | Method of manufacturing printed circuit board |
| JPS603129B2 (ja) * | 1980-09-19 | 1985-01-25 | 熊本県 | 高熱送風モミガラ燃焼炉装置 |
-
1984
- 1984-05-16 ZA ZA843703A patent/ZA843703B/xx unknown
- 1984-05-16 AU AU28084/84A patent/AU2808484A/en not_active Abandoned
- 1984-06-05 CA CA000455904A patent/CA1202734A/fr not_active Expired
- 1984-06-05 JP JP11535684A patent/JPS607194A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU2808484A (en) | 1984-12-13 |
| JPS607194A (ja) | 1985-01-14 |
| ZA843703B (en) | 1985-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |