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Lohja Oy AB
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Lohja Oy AB
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Priority to CA000476422ApriorityCriticalpatent/CA1213988A/fr
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Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components
Materiaux de sous-remplissage pre-appliques au niveau du boitier permettant d'ameliorer la fiabilite thermo-mecanique d'ensembles electroniques
Procede de remplissage sous-jacent d'un boitier de circuit integre (c4) de connexion de puce a deformation regulee avec un materiau de remplissage sous-jacent chauffe pour atteindre un etat de gel partiel