CA1240073A - Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation - Google Patents

Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation

Info

Publication number
CA1240073A
CA1240073A CA000544816A CA544816A CA1240073A CA 1240073 A CA1240073 A CA 1240073A CA 000544816 A CA000544816 A CA 000544816A CA 544816 A CA544816 A CA 544816A CA 1240073 A CA1240073 A CA 1240073A
Authority
CA
Canada
Prior art keywords
prepreg
lower mold
sheets
mold cavity
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000544816A
Other languages
English (en)
Inventor
Milton I. Ross
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/613,172 external-priority patent/US4680617A/en
Application filed by Individual filed Critical Individual
Priority to CA000544816A priority Critical patent/CA1240073A/fr
Application granted granted Critical
Publication of CA1240073A publication Critical patent/CA1240073A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA000544816A 1984-05-23 1987-08-18 Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation Expired CA1240073A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000544816A CA1240073A (fr) 1984-05-23 1987-08-18 Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US613,172 1984-05-23
US06/613,172 US4680617A (en) 1984-05-23 1984-05-23 Encapsulated electronic circuit device, and method and apparatus for making same
CA000482227A CA1237825A (fr) 1984-05-23 1985-05-23 Enrobage de resine plastique et de fibres pour dispositif a electronique, et methode et support d'exeution
CA000544816A CA1240073A (fr) 1984-05-23 1987-08-18 Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA000482227A Division CA1237825A (fr) 1984-05-23 1985-05-23 Enrobage de resine plastique et de fibres pour dispositif a electronique, et methode et support d'exeution

Publications (1)

Publication Number Publication Date
CA1240073A true CA1240073A (fr) 1988-08-02

Family

ID=25670689

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000544816A Expired CA1240073A (fr) 1984-05-23 1987-08-18 Capsule plastique de resine et fibres pour dispositif a circuit electronique, et methode d'encapsulation

Country Status (1)

Country Link
CA (1) CA1240073A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112920719A (zh) * 2021-01-21 2021-06-08 梁飞 一种橡胶卷材拼接装置及其拼接方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112920719A (zh) * 2021-01-21 2021-06-08 梁飞 一种橡胶卷材拼接装置及其拼接方法

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Legal Events

Date Code Title Description
MKEX Expiry