CA1255014A - Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre - Google Patents

Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre

Info

Publication number
CA1255014A
CA1255014A CA000534145A CA534145A CA1255014A CA 1255014 A CA1255014 A CA 1255014A CA 000534145 A CA000534145 A CA 000534145A CA 534145 A CA534145 A CA 534145A CA 1255014 A CA1255014 A CA 1255014A
Authority
CA
Canada
Prior art keywords
solder
circuit board
printed circuit
pad
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000534145A
Other languages
English (en)
Inventor
Isaac R. Revah
Norman T. Green
Henry K. Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Priority to CA000534145A priority Critical patent/CA1255014A/fr
Application granted granted Critical
Publication of CA1255014A publication Critical patent/CA1255014A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA000534145A 1987-04-08 1987-04-08 Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre Expired CA1255014A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000534145A CA1255014A (fr) 1987-04-08 1987-04-08 Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000534145A CA1255014A (fr) 1987-04-08 1987-04-08 Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre

Publications (1)

Publication Number Publication Date
CA1255014A true CA1255014A (fr) 1989-05-30

Family

ID=4135394

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000534145A Expired CA1255014A (fr) 1987-04-08 1987-04-08 Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre

Country Status (1)

Country Link
CA (1) CA1255014A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108059124A (zh) * 2016-11-08 2018-05-22 盾安美斯泰克股份有限公司 将焊接附接的mems管芯自对准到安装表面的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108059124A (zh) * 2016-11-08 2018-05-22 盾安美斯泰克股份有限公司 将焊接附接的mems管芯自对准到安装表面的方法
CN108059124B (zh) * 2016-11-08 2023-03-14 盾安美斯泰克股份有限公司 将焊接附接的mems管芯自对准到安装表面的方法

Similar Documents

Publication Publication Date Title
KR910007103B1 (ko) 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법
US6115262A (en) Enhanced mounting pads for printed circuit boards
JP3846554B2 (ja) 印刷用マスクおよび印刷方法、実装構造体およびこの実装構造体の製造方法
JP3859422B2 (ja) リード付き電子部品の半田付け方法
US5172852A (en) Soldering method
US6902097B2 (en) Electrically conductive wire
US4645114A (en) Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
US6151221A (en) Printed circuit board having wire clamps for securing component leads
US6114769A (en) Solder paste brick
CA1255014A (fr) Iiot circulaire de montage en surface pour dispositifs electroniques, et surface de montage garnie d'ilots du genre
US5369880A (en) Method for forming solder deposit on a substrate
US20030027415A1 (en) Ball grid assembly with solder columns
US6296174B1 (en) Method and circuit board for assembling electronic devices
EP0568087A2 (fr) Montage des composants électroniques sur des plaquettes de montage par soudage du type à refusion
US6012225A (en) Method of making surface mount pads
JP2646688B2 (ja) 電子部品の半田付け方法
JPS63150994A (ja) 表面実装用部品の押え機構
GB2378042A (en) Fixing mechanical parts to PCBs
JPS61102089A (ja) フラツトパツケ−ジｉｃの実装構造
JPS6221298A (ja) チツプ形電子部品の実装方法
JPS58102597A (ja) 電子回路基板
JPH0485986A (ja) 印刷回路基板
JPH04243187A (ja) プリント基板
JPH09162545A (ja) ボールグリッドアレイ実装構造及び実装方法
JPH04146688A (ja) 電子部品のボンディング方法

Legal Events

Date Code Title Description
MKEX Expiry