CA1303752C - Burn-in pads for tab interconnect structures - Google Patents

Burn-in pads for tab interconnect structures

Info

Publication number
CA1303752C
CA1303752C CA000594187A CA594187A CA1303752C CA 1303752 C CA1303752 C CA 1303752C CA 000594187 A CA000594187 A CA 000594187A CA 594187 A CA594187 A CA 594187A CA 1303752 C CA1303752 C CA 1303752C
Authority
CA
Canada
Prior art keywords
burn
pads
tape
conductors
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA000594187A
Other languages
English (en)
French (fr)
Inventor
Richard A. Chase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Application granted granted Critical
Publication of CA1303752C publication Critical patent/CA1303752C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CA000594187A 1988-03-28 1989-03-20 Burn-in pads for tab interconnect structures Expired - Fee Related CA1303752C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17309488A 1988-03-28 1988-03-28
US07/173,094 1988-03-28

Publications (1)

Publication Number Publication Date
CA1303752C true CA1303752C (en) 1992-06-16

Family

ID=22630520

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000594187A Expired - Fee Related CA1303752C (en) 1988-03-28 1989-03-20 Burn-in pads for tab interconnect structures

Country Status (4)

Country Link
EP (1) EP0364536A1 (de)
JP (1) JPH02500221A (de)
CA (1) CA1303752C (de)
WO (1) WO1989009493A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5150047A (en) * 1989-07-21 1992-09-22 Nippon Steel Corporation Member for use in assembly of integrated circuit elements and a method of testing assembled integrated circuit elements
DE4204459A1 (de) * 1992-02-14 1993-08-19 Siemens Nixdorf Inf Syst Filmtraegermontierter integrierter baustein
FR2739742B1 (fr) * 1995-10-09 1997-12-05 Sagem Procede de fabrication de module a micro-composants et support a circuits imprimes de liaison, et produit intermediaire de mise en oeuvre du procede
JP3717660B2 (ja) 1998-04-28 2005-11-16 株式会社ルネサステクノロジ フィルムキャリア及びバーンイン方法
JP5215032B2 (ja) * 2008-05-09 2013-06-19 スパンション エルエルシー 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386389A (en) * 1981-09-08 1983-05-31 Mostek Corporation Single layer burn-in tape for integrated circuit
US4701363A (en) * 1986-01-27 1987-10-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby

Also Published As

Publication number Publication date
EP0364536A1 (de) 1990-04-25
JPH02500221A (ja) 1990-01-25
WO1989009493A1 (en) 1989-10-05

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