CA1311210C - Production de panneaux dielectriques revetus de cuivre - Google Patents

Production de panneaux dielectriques revetus de cuivre

Info

Publication number: CA1311210C
Authority: CA; Canada
Prior art keywords: copper; press plate; press; copper layer; layer
Prior art date: 1986-08-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

CA000515791A

Other languages

English (en)

Inventor

John Edwin Thorpe

Gursharan Singh Sarang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Atotech UK Ltd

Original Assignee

M&T LAMINATES Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-08-12

Filing date

1986-08-12

Publication date

1992-12-08

1986-08-12 Application filed by M&T LAMINATES Ltd filed Critical M&T LAMINATES Ltd

1986-08-12 Priority to CA000515791A priority Critical patent/CA1311210C/fr

1992-12-08 Application granted granted Critical

1992-12-08 Publication of CA1311210C publication Critical patent/CA1311210C/fr

2009-12-08 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title description 10
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
239000010949 copper Substances 0.000 claims abstract description 66
229910052802 copper Inorganic materials 0.000 claims abstract description 66
238000010030 laminating Methods 0.000 claims abstract description 13
239000003989 dielectric material Substances 0.000 claims abstract description 11
239000011148 porous material Substances 0.000 claims abstract description 9
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
239000010936 titanium Substances 0.000 claims abstract description 5
229910052719 titanium Inorganic materials 0.000 claims abstract description 5
229910000831 Steel Inorganic materials 0.000 claims abstract description 4
229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
239000010935 stainless steel Substances 0.000 claims abstract description 4
239000010959 steel Substances 0.000 claims abstract description 4
238000000034 method Methods 0.000 claims description 34
DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims description 5
238000000151 deposition Methods 0.000 claims description 5
230000003746 surface roughness Effects 0.000 claims description 4
238000001816 cooling Methods 0.000 claims description 3
PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 2
230000035515 penetration Effects 0.000 claims description 2
239000000243 solution Substances 0.000 claims 2
239000003929 acidic solution Substances 0.000 claims 1
238000007747 plating Methods 0.000 description 18
210000000569 greater omentum Anatomy 0.000 description 15
239000000463 material Substances 0.000 description 12
239000011888 foil Substances 0.000 description 11
239000011889 copper foil Substances 0.000 description 9
229920005989 resin Polymers 0.000 description 9
239000011347 resin Substances 0.000 description 9
239000000758 substrate Substances 0.000 description 7
229910052751 metal Inorganic materials 0.000 description 5
239000002184 metal Substances 0.000 description 5
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
230000001464 adherent effect Effects 0.000 description 4
239000003795 chemical substances by application Substances 0.000 description 4
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
229910000077 silane Inorganic materials 0.000 description 4
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
239000013078 crystal Substances 0.000 description 3
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 3
235000011180 diphosphates Nutrition 0.000 description 3
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
239000010405 anode material Substances 0.000 description 2
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
239000004744 fabric Substances 0.000 description 2
239000010408 film Substances 0.000 description 2
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
239000011521 glass Substances 0.000 description 2
230000006911 nucleation Effects 0.000 description 2
238000010899 nucleation Methods 0.000 description 2
239000007921 spray Substances 0.000 description 2
239000001117 sulphuric acid Substances 0.000 description 2
235000011149 sulphuric acid Nutrition 0.000 description 2
LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
ZAKOWWREFLAJOT-CEFNRUSXSA-N D-alpha-tocopherylacetate Chemical compound CC(=O)OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C ZAKOWWREFLAJOT-CEFNRUSXSA-N 0.000 description 1
101100130497 Drosophila melanogaster Mical gene Proteins 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
101100345589 Mus musculus Mical1 gene Proteins 0.000 description 1
238000005299 abrasion Methods 0.000 description 1
238000005273 aeration Methods 0.000 description 1
239000004411 aluminium Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910021529 ammonia Inorganic materials 0.000 description 1
239000007767 bonding agent Substances 0.000 description 1
KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000011109 contamination Methods 0.000 description 1
230000001276 controlling effect Effects 0.000 description 1
230000007547 defect Effects 0.000 description 1
210000001787 dendrite Anatomy 0.000 description 1
239000000428 dust Substances 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000003475 lamination Methods 0.000 description 1
230000007935 neutral effect Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000005498 polishing Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
238000007788 roughening Methods 0.000 description 1
238000006748 scratching Methods 0.000 description 1
230000002393 scratching effect Effects 0.000 description 1
238000000926 separation method Methods 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
235000011006 sodium potassium tartrate Nutrition 0.000 description 1
238000010998 test method Methods 0.000 description 1
238000012360 testing method Methods 0.000 description 1
239000010409 thin film Substances 0.000 description 1
238000005406 washing Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Landscapes

Laminated Bodies (AREA)

CA000515791A 1986-08-12 1986-08-12 Production de panneaux dielectriques revetus de cuivre Expired - Lifetime CA1311210C (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA000515791A CA1311210C (fr)	1986-08-12	1986-08-12	Production de panneaux dielectriques revetus de cuivre

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA000515791A CA1311210C (fr)	1986-08-12	1986-08-12	Production de panneaux dielectriques revetus de cuivre

Publications (1)

Publication Number	Publication Date
CA1311210C true CA1311210C (fr)	1992-12-08

Family

ID=4133716

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000515791A Expired - Lifetime CA1311210C (fr)	1986-08-12	1986-08-12	Production de panneaux dielectriques revetus de cuivre

Country Status (1)

Country	Link
CA (1)	CA1311210C (fr)

1986
- 1986-08-12 CA CA000515791A patent/CA1311210C/fr not_active Expired - Lifetime

Legal Events

Date	Code	Title	Description
2001-12-10	MKLA	Lapsed

Publication	Publication Date	Title
US4715116A (en)	1987-12-29	Production of dielectric boards
US4357395A (en)	1982-11-02	Transfer lamination of vapor deposited foils, method and product
US4088544A (en)	1978-05-09	Composite and method for making thin copper foil
US4568413A (en)	1986-02-04	Metallized and plated laminates
EP1184165B1 (fr)	2006-03-01	Feuille de cuivre electrolytique avec feuille de support et stratifie plaque cuivre utilisant cette feuille de cuivre electrolytique
KR100547513B1 (ko)	2006-01-31	캐리어박 구비 전해동박 및 그 제조방법과 그 캐리어박구비 전해동박을 사용한 동 클래드 적층판
EP0930811B1 (fr)	2003-08-20	Feuille composite en cuivre, procédé de son fabrication, et laminé revêtu de cuivre et plaque à circuit imprimé l'utilisant
CZ20013257A3 (cs)	2002-01-16	Způsob výroby vícevrstvé desky s tiątěnými spoji a kompozitní fólie pro pouľití při tomto způsobu
WO1987003915A1 (fr)	1987-07-02	Procede et appareil d'electroplaquage d'une feuille de cuivre
JP2002292788A (ja)	2002-10-09	複合銅箔及び該複合銅箔の製造方法
KR100595381B1 (ko)	2006-07-03	복합동박 및 그 제조방법 및 해당 복합동박을 이용한 동피복적층판 및 프린트배선판
US5322975A (en)	1994-06-21	Universal carrier supported thin copper line
US5447619A (en)	1995-09-05	Copper foil for the manufacture of printed circuit boards and method of producing the same
JP3392066B2 (ja)	2003-03-31	複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
AU578653B2 (en)	1988-11-03	Production of a matte surface om a metal layer
US4387137A (en)	1983-06-07	Capacitor material
CA1311210C (fr)	1992-12-08	Production de panneaux dielectriques revetus de cuivre
JPS5921392B2 (ja)	1984-05-19	プリント回路用銅箔の製造方法
IE56824B1 (en)	1991-12-18	Production of dielectric boards
CN1198293A (zh)	1998-11-04	用于制造印刷电路板的铜箔及其制造方法
JPH0149794B2 (fr)	1989-10-26
JP2000315848A (ja)	2000-11-14	銅張り積層板の製造方法およびプリント配線板
GB2151660A (en)	1985-07-24	Dendritic surface treatment of metal layers
GB2185757A (en)	1987-07-29	Dendritic surface treatment of metal layers
JPH06350248A (ja)	1994-12-22	プリント配線板用銅箔の表面処理方法