CA138031S - Semiconductor substrate - Google Patents

Semiconductor substrate

Info

Publication number
CA138031S
CA138031S CA138031F CA138031F CA138031S CA 138031 S CA138031 S CA 138031S CA 138031 F CA138031 F CA 138031F CA 138031 F CA138031 F CA 138031F CA 138031 S CA138031 S CA 138031S
Authority
CA
Canada
Prior art keywords
view
semiconductor substrate
design
partially enlarged
drawings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA138031F
Other versions
CA947439A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of CA138031S publication Critical patent/CA138031S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

The design consists of the shape, configuration, pattern and ornamentation of the semiconductor substrate as shown in the drawings; the semiconductor substrate presents an upper surface of the upper substrate as shown in solid lines in the drawings and a lower substrate shown in stippled lines.Representations of the design are shown in the figures wherein:Fig. 1 is a right front perspective view from above the design of a semiconductor substrate;Fig. 2 is a front view thereof, a rear view being a mirror image thereof;Fig. 3 is a top plan view thereof;Fig. 4 is a bottom view thereof;Fig. 5 is a right side view thereof, a left side view being a mirror image thereof;Fig. 6 is a partially enlarged view at A shown in Fig. 2 thereof;Fig. 7 is a partially enlarged view at B shown in Fig. 2 thereof;Fig. 8 is a cross-sectional view at C-C shown in Fig. 3 thereof, andFig. 9 is a partially enlarged view at D shown in Fig. 8 thereof.The stippled lines in the drawings do not form part of the design.
CA138031F 2010-08-17 2010-11-19 Semiconductor substrate Expired - Lifetime CA138031S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010019916 2010-08-17

Publications (1)

Publication Number Publication Date
CA138031S true CA138031S (en) 2011-11-17

Family

ID=45758269

Family Applications (1)

Application Number Title Priority Date Filing Date
CA138031F Expired - Lifetime CA138031S (en) 2010-08-17 2010-11-19 Semiconductor substrate

Country Status (2)

Country Link
US (1) USD655256S1 (en)
CA (1) CA138031S (en)

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USD700441S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD769832S1 (en) 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
JP1534136S (en) 2014-11-13 2015-09-28
JP1534137S (en) * 2014-11-13 2015-09-28
JP1534138S (en) 2014-11-13 2015-09-28
USD806249S1 (en) 2014-12-16 2017-12-26 Hamamatsu Photonics K.K. Radiation image conversion plate
JP1563719S (en) * 2015-12-28 2016-11-21
JP1563718S (en) * 2015-12-28 2016-11-21
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models

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USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
JPS6088535U (en) * 1983-11-24 1985-06-18 住友電気工業株式会社 semiconductor wafer
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
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EP2650907B1 (en) * 2004-06-04 2024-10-23 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
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Also Published As

Publication number Publication date
USD655256S1 (en) 2012-03-06

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