CA138031S - Semiconductor substrate - Google Patents
Semiconductor substrateInfo
- Publication number
- CA138031S CA138031S CA138031F CA138031F CA138031S CA 138031 S CA138031 S CA 138031S CA 138031 F CA138031 F CA 138031F CA 138031 F CA138031 F CA 138031F CA 138031 S CA138031 S CA 138031S
- Authority
- CA
- Canada
- Prior art keywords
- view
- semiconductor substrate
- design
- partially enlarged
- drawings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 4
Abstract
The design consists of the shape, configuration, pattern and ornamentation of the semiconductor substrate as shown in the drawings; the semiconductor substrate presents an upper surface of the upper substrate as shown in solid lines in the drawings and a lower substrate shown in stippled lines.Representations of the design are shown in the figures wherein:Fig. 1 is a right front perspective view from above the design of a semiconductor substrate;Fig. 2 is a front view thereof, a rear view being a mirror image thereof;Fig. 3 is a top plan view thereof;Fig. 4 is a bottom view thereof;Fig. 5 is a right side view thereof, a left side view being a mirror image thereof;Fig. 6 is a partially enlarged view at A shown in Fig. 2 thereof;Fig. 7 is a partially enlarged view at B shown in Fig. 2 thereof;Fig. 8 is a cross-sectional view at C-C shown in Fig. 3 thereof, andFig. 9 is a partially enlarged view at D shown in Fig. 8 thereof.The stippled lines in the drawings do not form part of the design.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010019916 | 2010-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA138031S true CA138031S (en) | 2011-11-17 |
Family
ID=45758269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA138031F Expired - Lifetime CA138031S (en) | 2010-08-17 | 2010-11-19 | Semiconductor substrate |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD655256S1 (en) |
| CA (1) | CA138031S (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1448315S (en) * | 2011-10-04 | 2015-08-03 | ||
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD769832S1 (en) | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
| JP1534136S (en) | 2014-11-13 | 2015-09-28 | ||
| JP1534137S (en) * | 2014-11-13 | 2015-09-28 | ||
| JP1534138S (en) | 2014-11-13 | 2015-09-28 | ||
| USD806249S1 (en) | 2014-12-16 | 2017-12-26 | Hamamatsu Photonics K.K. | Radiation image conversion plate |
| JP1563719S (en) * | 2015-12-28 | 2016-11-21 | ||
| JP1563718S (en) * | 2015-12-28 | 2016-11-21 | ||
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD262962S (en) * | 1978-11-03 | 1982-02-09 | Strumpell Winton C | Silicon wafer emitter electrode configuration |
| JPS6088535U (en) * | 1983-11-24 | 1985-06-18 | 住友電気工業株式会社 | semiconductor wafer |
| US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
| EP2565924B1 (en) * | 2001-07-24 | 2018-01-10 | Samsung Electronics Co., Ltd. | Transfer method |
| JP2004207606A (en) * | 2002-12-26 | 2004-07-22 | Disco Abrasive Syst Ltd | Wafer support plate |
| KR101270180B1 (en) * | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device |
| JP2005260154A (en) | 2004-03-15 | 2005-09-22 | Tokyo Seimitsu Co Ltd | Method of manufacturing chip |
| EP2650907B1 (en) * | 2004-06-04 | 2024-10-23 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| KR101139713B1 (en) * | 2004-06-24 | 2012-04-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing thin film integrated circuit |
| US7452786B2 (en) * | 2004-06-29 | 2008-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
| US8084400B2 (en) * | 2005-10-11 | 2011-12-27 | Intermolecular, Inc. | Methods for discretized processing and process sequence integration of regions of a substrate |
| JP4470690B2 (en) * | 2004-10-29 | 2010-06-02 | 住友電気工業株式会社 | Silicon carbide single crystal, silicon carbide substrate, and method for producing silicon carbide single crystal |
| US7205639B2 (en) * | 2005-03-09 | 2007-04-17 | Infineon Technologies Ag | Semiconductor devices with rotated substrates and methods of manufacture thereof |
| SG126885A1 (en) * | 2005-04-27 | 2006-11-29 | Disco Corp | Semiconductor wafer and processing method for same |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| JP2009016602A (en) * | 2007-07-05 | 2009-01-22 | Denso Corp | Method for manufacturing silicon carbide semiconductor device |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| JP5304255B2 (en) * | 2009-01-13 | 2013-10-02 | 住友電気工業株式会社 | Silicon carbide substrate, epitaxial wafer, and method for manufacturing silicon carbide substrate |
| JP2011100922A (en) * | 2009-11-09 | 2011-05-19 | Toshiba Corp | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
| USD638382S1 (en) * | 2010-04-09 | 2011-05-24 | Panasonic Electric Works Co., Ltd. | Electroluminescence module |
-
2010
- 2010-11-19 CA CA138031F patent/CA138031S/en not_active Expired - Lifetime
- 2010-11-19 US US29/379,471 patent/USD655256S1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| USD655256S1 (en) | 2012-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA138030S (en) | Semiconductor substrate | |
| CA138032S (en) | Semiconductor substrate | |
| CA138031S (en) | Semiconductor substrate | |
| CA141494S (en) | Bottle | |
| CA134830S (en) | Showerhead | |
| CA133104S (en) | Cup | |
| CA149006S (en) | Upper portion of a dishwasher | |
| CA140493S (en) | Bottle | |
| CA141933S (en) | Chair | |
| CA136036S (en) | Footwear insole | |
| CA141608S (en) | Bottle | |
| CA126781S (en) | Micro-flashlight docking station | |
| CA136956S (en) | Steamer | |
| CA142402S (en) | Cart basket | |
| CA134441S (en) | Bottle | |
| CA136753S (en) | Spray nozzle | |
| CA143116S (en) | Game controller | |
| CA136962S (en) | Steamer | |
| CA137259S (en) | Lens array | |
| CA137261S (en) | Lens array | |
| CA145425S (en) | Chair | |
| CA142284S (en) | Mosaic lamp | |
| CA132492S (en) | Cup lid | |
| CA142285S (en) | Mosaic lamp | |
| CA145422S (en) | Chair |