CA2013455A1 - Dispositif d'interconnexion electro-optique - Google Patents

Dispositif d'interconnexion electro-optique

Info

Publication number
CA2013455A1
CA2013455A1 CA2013455A CA2013455A CA2013455A1 CA 2013455 A1 CA2013455 A1 CA 2013455A1 CA 2013455 A CA2013455 A CA 2013455A CA 2013455 A CA2013455 A CA 2013455A CA 2013455 A1 CA2013455 A1 CA 2013455A1
Authority
CA
Canada
Prior art keywords
optical
connecting elements
electro
electrical
connection arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2013455A
Other languages
English (en)
Other versions
CA2013455C (fr
Inventor
Kurt Losch
Matjaz Florjancic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV filed Critical Alcatel NV
Publication of CA2013455A1 publication Critical patent/CA2013455A1/fr
Application granted granted Critical
Publication of CA2013455C publication Critical patent/CA2013455C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/381—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres
    • G02B6/3817—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres containing optical and electrical conductors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Optical Communication System (AREA)
  • Light Receiving Elements (AREA)
  • Structure Of Printed Boards (AREA)
CA002013455A 1989-04-03 1990-03-30 Dispositif d'interconnexion electro-optique Expired - Fee Related CA2013455C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3910710.8 1989-04-03
DE3910710A DE3910710A1 (de) 1989-04-03 1989-04-03 Optisch-elektrische mehrfachverbindung

Publications (2)

Publication Number Publication Date
CA2013455A1 true CA2013455A1 (fr) 1990-10-03
CA2013455C CA2013455C (fr) 1993-10-05

Family

ID=6377715

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002013455A Expired - Fee Related CA2013455C (fr) 1989-04-03 1990-03-30 Dispositif d'interconnexion electro-optique

Country Status (8)

Country Link
US (1) US5054870A (fr)
EP (1) EP0391248B1 (fr)
JP (1) JPH0719900B2 (fr)
AT (1) ATE108027T1 (fr)
AU (1) AU625465B2 (fr)
CA (1) CA2013455C (fr)
DE (2) DE3910710A1 (fr)
ES (1) ES2058648T3 (fr)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642527B2 (ja) * 1989-10-10 1994-06-01 日本電気株式会社 光導波路を用いた情報処理装置
EP0497011A1 (fr) * 1991-01-29 1992-08-05 BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Assemblage de circuit imprimé
US5125054A (en) * 1991-07-25 1992-06-23 Motorola, Inc. Laminated polymer optical waveguide interface and method of making same
US5327517A (en) * 1991-08-05 1994-07-05 Nippon Telegraph And Telephone Corporation Guided-wave circuit module and wave-guiding optical component equipped with the module
US5249826A (en) 1991-10-03 1993-10-05 Amerigon, Inc. Inertial mass safety system activation for personal vehicles
US5208879A (en) * 1991-10-18 1993-05-04 International Business Machines Corporation Optical signal distribution system
FR2685098B1 (fr) * 1991-12-12 1995-02-10 Andre Schiltz Procede de montage et de couplage optique sur un substrat et substrat equipe d'une fibre optique.
DE4142340A1 (de) * 1991-12-20 1993-06-24 Siemens Ag Optoelektronischer ic
US5199087A (en) * 1991-12-31 1993-03-30 Texas Instruments Incorporated Optoelectronic integrated circuit for transmitting optical and electrical signals and method of forming same
US5268973A (en) * 1992-01-21 1993-12-07 The University Of Texas System Wafer-scale optical bus
US5282071A (en) * 1992-07-13 1994-01-25 Motorola, Inc. Contact areas on an optical waveguide and method of making
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5375184A (en) * 1992-12-29 1994-12-20 Honeywell Inc. Flexible channel optical waveguide having self-aligned ports for interconnecting optical devices
JP2531453Y2 (ja) * 1993-06-11 1997-04-02 福岡県園芸農業協同組合連合会 接ぎ木苗活着促進用棚車
DE19520676A1 (de) * 1995-06-07 1996-12-12 Deutsche Telekom Ag Hybridschaltung und Verfahren zur Herstellung derselben
US5659648A (en) * 1995-09-29 1997-08-19 Motorola, Inc. Polyimide optical waveguide having electrical conductivity
US5902435A (en) * 1996-12-31 1999-05-11 Minnesota Mining And Manufacturing Company Flexible optical circuit appliques
FI981079A7 (fi) * 1998-05-14 1999-11-15 Nokia Corp Signaalien siirtomenetelmä ja emolevyrakenne
GB2340998B (en) * 1998-08-26 2003-07-16 Lsi Logic Corp Optical/electrical inputs for an integrated circuit die
US6690845B1 (en) 1998-10-09 2004-02-10 Fujitsu Limited Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making
US6611635B1 (en) 1998-10-09 2003-08-26 Fujitsu Limited Opto-electronic substrates with electrical and optical interconnections and methods for making
US6785447B2 (en) 1998-10-09 2004-08-31 Fujitsu Limited Single and multilayer waveguides and fabrication process
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6343171B1 (en) * 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6706546B2 (en) 1998-10-09 2004-03-16 Fujitsu Limited Optical reflective structures and method for making
WO2001018567A2 (fr) * 1999-09-03 2001-03-15 Teraconnect, Inc Dispositif de connecteur optoelectronique
US6434308B1 (en) 1999-09-03 2002-08-13 Teraconnect, Inc Optoelectronic connector system
US6288821B1 (en) 1999-10-01 2001-09-11 Lucent Technologies, Inc. Hybrid electro-optic device with combined mirror arrays
JP2001274528A (ja) 2000-01-21 2001-10-05 Fujitsu Ltd 薄膜デバイスの基板間転写方法
US6916121B2 (en) * 2001-08-03 2005-07-12 National Semiconductor Corporation Optical sub-assembly for optoelectronic modules
US6588943B1 (en) * 2000-08-07 2003-07-08 Teradyne, Inc. Electro-optic connector module
GB2368141A (en) * 2000-10-19 2002-04-24 Bookham Technology Plc Integrated optical package
JP3899842B2 (ja) * 2001-05-01 2007-03-28 富士ゼロックス株式会社 光配線回路積層体および光電気配線装置
CN1870862A (zh) * 2001-07-06 2006-11-29 惠亚集团公司 对用于电路板间通信的pcb中的光层进行集成的系统和方法
US7269027B2 (en) * 2001-08-03 2007-09-11 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US7023705B2 (en) 2001-08-03 2006-04-04 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US6599031B2 (en) 2001-09-12 2003-07-29 Intel Corporation Optical/electrical interconnects and package for high speed signaling
US6973225B2 (en) * 2001-09-24 2005-12-06 National Semiconductor Corporation Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package
US6985668B2 (en) * 2003-07-15 2006-01-10 National Semiconductor Corporation Multi-purpose optical light pipe
US7156562B2 (en) * 2003-07-15 2007-01-02 National Semiconductor Corporation Opto-electronic module form factor having adjustable optical plane height
US7130498B2 (en) * 2003-10-16 2006-10-31 3M Innovative Properties Company Multi-layer optical circuit and method for making
JP2006091241A (ja) * 2004-09-22 2006-04-06 Hitachi Cable Ltd 光電気複合配線部品及びこれを用いた電子機器
US7200295B2 (en) * 2004-12-07 2007-04-03 Reflex Photonics, Inc. Optically enabled hybrid semiconductor package
KR20060106891A (ko) * 2005-04-04 2006-10-12 마츠시타 덴끼 산교 가부시키가이샤 광학 디바이스용 캐비티 구조체, 광학 디바이스 및 광학디바이스용 캐비티 구조체의 제조방법
US20070237527A1 (en) * 2006-03-31 2007-10-11 Sanjay Dabral Optical debug mechanism
US8014638B2 (en) * 2006-04-03 2011-09-06 The University Of Tokyo Signal transmission device
KR100796982B1 (ko) * 2006-11-21 2008-01-22 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100871252B1 (ko) * 2007-01-19 2008-11-28 삼성전자주식회사 광섬유를 이용한 광/전기 배선을 갖는 연성 인쇄회로기판
JP5171524B2 (ja) * 2007-10-04 2013-03-27 株式会社日立ハイテクノロジーズ 物体表面の欠陥検査装置および方法
US8755655B2 (en) * 2009-09-22 2014-06-17 Oracle America, Inc. Edge-coupled optical proximity communication
DE102009047872B4 (de) * 2009-09-30 2015-03-12 GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG Halbleiterbauelement mit einem vergrabenen Wellenleiter für die bauteilinterne optische Kommunikation
US9405064B2 (en) * 2012-04-04 2016-08-02 Texas Instruments Incorporated Microstrip line of different widths, ground planes of different distances
US9217836B2 (en) * 2012-10-23 2015-12-22 Kotura, Inc. Edge coupling of optical devices
US9531645B2 (en) 2014-07-29 2016-12-27 Mellanox Technologies Ltd. Cable backplane
US9784933B2 (en) * 2014-12-18 2017-10-10 Infinera Corporation Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device
US10324261B2 (en) * 2015-02-18 2019-06-18 Technische Universiteit Eindhoven Multi-port optical probe for photonic IC characterization and packaging
US10365445B2 (en) 2017-04-24 2019-07-30 Mellanox Technologies, Ltd. Optical modules integrated into an IC package of a network switch having electrical connections extend on different planes
US10116074B1 (en) 2017-04-30 2018-10-30 Mellanox Technologies, Ltd. Graded midplane
US11391897B2 (en) * 2020-12-23 2022-07-19 Cisco Technology, Inc. Stiffener device providing external connections to co-packaged optical devices
EP4384859A1 (fr) * 2021-08-10 2024-06-19 Corning Research & Development Corporation Ensembles optiques co-emballés
US12571959B2 (en) * 2023-04-03 2026-03-10 Intel Corporation Embedded photonic integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102525B1 (fr) * 1982-08-23 1988-07-06 BURROUGHS CORPORATION (a Delaware corporation) Protection contre des particules alpha dans des empaquetages de circuits intégrés
US4597631A (en) * 1982-12-02 1986-07-01 The United States Of America As Represented By The Secretary Of The Navy Printed circuit card hybrid
US4611886A (en) * 1983-12-29 1986-09-16 At&T Bell Laboratories Integrated optical circuit package
US4695120A (en) * 1985-09-26 1987-09-22 The United States Of America As Represented By The Secretary Of The Army Optic-coupled integrated circuits
US4732446A (en) * 1985-10-02 1988-03-22 Lamar Gipson Electrical circuit and optical data buss
EP0335104A3 (fr) * 1988-03-31 1991-11-06 Siemens Aktiengesellschaft Dispositif pour relier optiquement un ou plusieurs émetteurs optiques d'un ou plusieurs circuits intégrés

Also Published As

Publication number Publication date
DE59006275D1 (de) 1994-08-04
EP0391248B1 (fr) 1994-06-29
JPH0340446A (ja) 1991-02-21
US5054870A (en) 1991-10-08
EP0391248A3 (fr) 1991-12-11
JPH0719900B2 (ja) 1995-03-06
CA2013455C (fr) 1993-10-05
EP0391248A2 (fr) 1990-10-10
DE3910710A1 (de) 1990-10-04
AU5214490A (en) 1990-10-04
ES2058648T3 (es) 1994-11-01
ATE108027T1 (de) 1994-07-15
AU625465B2 (en) 1992-07-09

Similar Documents

Publication Publication Date Title
CA2013455A1 (fr) Dispositif d'interconnexion electro-optique
US7137744B2 (en) Fiber optic transceiver module with rigid and flexible circuit boards
CA2077486A1 (fr) Galette a semi-conducteur de type connecteur electrique
EP0907225A3 (fr) Connecteur ayant une isolation électrique dans des zones à haute densité
CA2368250A1 (fr) Appareil de raccordement utilisant une technique a memoire de forme
EP0334343A3 (fr) Connecteur de faisceau de câbles pour tableau de bord
CA2111151A1 (fr) Ensemble de connexion
EP0277430A3 (fr) Systèmes de plaques à circuits imprimés, connecteurs utilisés pour ceux-ci et méthodes de fabrication des connecteurs et des systèmes
EP0278430A3 (fr) Assemblage de connexion entre un dispositif de commande et un dispositif de transmission de signaux
EP0289197A3 (fr) Dispositif électro-optique
EP1217695A3 (fr) Système d' interconnection électrique pour câble plat
EP0256698A3 (fr) Structure de bus à caractéristiques électriques constantes
JPH0815541A (ja) 隣接導波管
US20020146218A1 (en) Optoelectronic emitter-receiver device
CA2275556A1 (fr) Contact de bord combine electrique et optique pour effectuer l'interconnexion compacte d'une piece a une autre et son procede de fabrication
EP1094355A1 (fr) Interconnexion electrique de circuits planaires à ondes lumineuses
EP0461454A3 (en) Distribution device
EP0312975A3 (fr) Empaquetage pour puce semi-conductrice
EP0838704A3 (fr) Structures pour transmissions de données et relatives à des configurations de fond de panier pour données
EP0352805A3 (fr) Ligne à retard à constantes distribuées et son procédé de fabrication
AU599216B2 (en) Backplane having a jumper plug to connect socket connectors to a bus line
EP0905830A3 (fr) Dispositif de raccordement avec des raccordements à fiches
JPS6448439A (en) Mounting structure of probing card
US4575165A (en) Circuit to post interconnection device
ATE81422T1 (de) Verbindungsvorrichtung fuer die elektrische verbindung von elektrischen anschluessen von elektrogeraeten.

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed