CA2023769C - Module optique - Google Patents

Module optique

Info

Publication number: CA2023769C
Authority: CA; Canada
Prior art keywords: optical connector; lead frame; lead; holding member; optical
Prior art date: 1990-08-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CA002023769A

Other languages

English (en)

Other versions

CA2023769A1 (fr

Inventor

Hisao Go

Hidenori Takahashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Electric Industries Ltd

Original Assignee

Sumitomo Electric Industries Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-08-22

Filing date

1990-08-22

Publication date

1998-06-30

1990-08-22 Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd

1990-08-22 Priority to CA002023769A priority Critical patent/CA2023769C/fr

1992-02-23 Publication of CA2023769A1 publication Critical patent/CA2023769A1/fr

1998-06-30 Application granted granted Critical

1998-06-30 Publication of CA2023769C publication Critical patent/CA2023769C/fr

2010-08-22 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

230000003287 optical effect Effects 0.000 title claims abstract description 143
239000000758 substrate Substances 0.000 claims abstract description 43
239000011347 resin Substances 0.000 claims abstract description 26
229920005989 resin Polymers 0.000 claims abstract description 26
239000013307 optical fiber Substances 0.000 claims abstract description 9
238000001721 transfer moulding Methods 0.000 claims description 17
238000003780 insertion Methods 0.000 claims description 9
230000037431 insertion Effects 0.000 claims description 9
239000000835 fiber Substances 0.000 claims description 2
238000012546 transfer Methods 0.000 claims description 2
238000004519 manufacturing process Methods 0.000 description 20
239000000919 ceramic Substances 0.000 description 7
229910045601 alloy Inorganic materials 0.000 description 5
239000000956 alloy Substances 0.000 description 5
238000000465 moulding Methods 0.000 description 4
238000003466 welding Methods 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
238000005530 etching Methods 0.000 description 3
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
238000005452 bending Methods 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
238000004891 communication Methods 0.000 description 2
238000000034 method Methods 0.000 description 2
230000010355 oscillation Effects 0.000 description 2
241000905957 Channa melasoma Species 0.000 description 1
229910000990 Ni alloy Inorganic materials 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
238000012856 packing Methods 0.000 description 1
238000007789 sealing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000007493 shaping process Methods 0.000 description 1
238000005476 soldering Methods 0.000 description 1

Classifications

- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Optical Couplings Of Light Guides (AREA)

CA002023769A 1990-08-22 1990-08-22 Module optique Expired - Fee Related CA2023769C (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA002023769A CA2023769C (fr)	1990-08-22	1990-08-22	Module optique

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA002023769A CA2023769C (fr)	1990-08-22	1990-08-22	Module optique

Publications (2)

Publication Number	Publication Date
CA2023769A1 CA2023769A1 (fr)	1992-02-23
CA2023769C true CA2023769C (fr)	1998-06-30

Family

ID=4145800

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA002023769A Expired - Fee Related CA2023769C (fr)	1990-08-22	1990-08-22	Module optique

Country Status (1)

Country	Link
CA (1)	CA2023769C (fr)

1990
- 1990-08-22 CA CA002023769A patent/CA2023769C/fr not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2023769A1 (fr)	1992-02-23

Legal Events

Date	Code	Title	Description
1993-04-23	EEER	Examination request
2005-08-22	MKLA	Lapsed

Publication	Publication Date	Title
US5170453A (en)	1992-12-08	Optical module
US5099307A (en)	1992-03-24	Process for producing optical module
KR0137189B1 (ko)	1998-06-15	광학소자의 개선한 접지를 가진 광모듈
US6518659B1 (en)	2003-02-11	Stackable package having a cavity and a lid for an electronic device
US6667544B1 (en)	2003-12-23	Stackable package having clips for fastening package and tool for opening clips
US6291262B1 (en)	2001-09-18	Surface mount TO-220 package and process for the manufacture thereof
EP1096566A2 (fr)	2001-05-02	Dispositif électronique et méthode d'assemblage associée
JP2682936B2 (ja)	1997-11-26	半導体装置
JPH06132453A (ja)	1994-05-13	半導体装置及びその製造方法
US5127071A (en)	1992-06-30	Optical module including receptacle, and method of producing the same
US6617200B2 (en)	2003-09-09	System and method for fabricating a semiconductor device
EP0438165B1 (fr)	1997-07-09	Parties de dispositif semi-conducteur
JP2881806B2 (ja)	1999-04-12	光モジュール及びその製造方法
US6315465B1 (en)	2001-11-13	Optical module
CA2023769C (fr)	1998-06-30	Module optique
AU643411B2 (en)	1993-11-11	Optical module
KR0143074B1 (ko)	1998-10-01	광 모듈 및 광 모듈용 리드 프레임
JPH0612830B2 (ja)	1994-02-16	光送受信モジュール用リードフレーム
JP2529787Y2 (ja)	1997-03-19	光モジュール
JP3092119B2 (ja)	2000-09-25	光モジュール
CA2026252C (fr)	1997-03-11	Module optique et methode de production connexe
JP2864460B2 (ja)	1999-03-03	多心式光モジュール及びその製造方法
JP3151797B2 (ja)	2001-04-03	光モジュールの製造方法
US20200335430A1 (en)	2020-10-22	Semiconductor Component and Method for Producing Semiconductor Components
JPH03272164A (ja)	1991-12-03	リードフレーム及び電子回路装置の製造方法