CA2079964C - Installation et methode pour la fabrication d'un module optique - Google Patents

Installation et methode pour la fabrication d'un module optique

Info

Publication number
CA2079964C
CA2079964C CA 2079964 CA2079964A CA2079964C CA 2079964 C CA2079964 C CA 2079964C CA 2079964 CA2079964 CA 2079964 CA 2079964 A CA2079964 A CA 2079964A CA 2079964 C CA2079964 C CA 2079964C
Authority
CA
Canada
Prior art keywords
lead frame
optical members
members
clamping
pallet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA 2079964
Other languages
English (en)
Other versions
CA2079964A1 (fr
Inventor
Mitsutoshi Kamakura
Akihiko Shioda
Yoshihide Enami
Hisao Go
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP950192A external-priority patent/JP3114164B2/ja
Priority claimed from JP949892A external-priority patent/JP3114163B2/ja
Priority claimed from JP4009500A external-priority patent/JP3024124B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CA2079964A1 publication Critical patent/CA2079964A1/fr
Application granted granted Critical
Publication of CA2079964C publication Critical patent/CA2079964C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA 2079964 1992-01-22 1992-10-06 Installation et methode pour la fabrication d'un module optique Expired - Fee Related CA2079964C (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP950192A JP3114164B2 (ja) 1992-01-22 1992-01-22 光モジュール製造装置
JP949892A JP3114163B2 (ja) 1992-01-22 1992-01-22 光モジュール製造方法
JP4009500A JP3024124B2 (ja) 1992-01-22 1992-01-22 クランプ装置
JP4-9501 1992-01-22
JP4-9498 1992-01-22
JP4-9500 1992-01-22

Publications (2)

Publication Number Publication Date
CA2079964A1 CA2079964A1 (fr) 1993-07-23
CA2079964C true CA2079964C (fr) 1997-12-16

Family

ID=27278514

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2079964 Expired - Fee Related CA2079964C (fr) 1992-01-22 1992-10-06 Installation et methode pour la fabrication d'un module optique

Country Status (4)

Country Link
US (2) US5341563A (fr)
EP (1) EP0552419B1 (fr)
CA (1) CA2079964C (fr)
DE (1) DE69217474T2 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340594C2 (de) * 1992-12-01 1998-04-09 Murata Manufacturing Co Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
JPH0917809A (ja) * 1995-06-30 1997-01-17 Sumitomo Kinzoku Electro Device:Kk 半導体セラミックパッケージの製造方法と装置
US6288739B1 (en) 1997-09-05 2001-09-11 Intelect Systems Corporation Distributed video communications system
US6112973A (en) * 1997-10-31 2000-09-05 Texas Instruments Incorporated Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
US6203082B1 (en) 1999-07-12 2001-03-20 Rd Automation Mounting apparatus for electronic parts
JP2004087802A (ja) * 2002-08-27 2004-03-18 Fujitsu Ltd 光通信装置
DE102004008082A1 (de) * 2004-02-19 2005-09-08 Marconi Communications Gmbh Verfahren zum Bestücken eines Schaltungsträgers
JP5170080B2 (ja) * 2007-03-09 2013-03-27 オムロン株式会社 パッケージの製造方法、パッケージ、及び光モジュール
CN101627472A (zh) * 2007-03-19 2010-01-13 富士通株式会社 散热器和电子装置以及电子装置的制造方法
US8597984B2 (en) 2009-10-14 2013-12-03 Stmicroelectronics, Inc. Modular low stress package technology
US8283769B2 (en) * 2009-10-14 2012-10-09 Stmicroelectronics, Inc. Modular low stress package technology
US8853843B2 (en) 2009-10-14 2014-10-07 Stmicroelectronics, Inc. Modular low stress package technology
US20140082935A1 (en) * 2012-09-27 2014-03-27 Volex Plc Method for passive alignment of optical components to a substrate
CN106002186A (zh) * 2016-06-06 2016-10-12 正信光电科技股份有限公司 光伏组件装框机
CN106002826B (zh) * 2016-07-11 2018-04-10 京东方科技集团股份有限公司 灯条组装装置以及利用其进行灯条组装的方法
DE102017123122A1 (de) * 2016-12-01 2018-06-07 Hesse Gmbh Verfahren zum Bonden großer Module und Bondanordnung
US10541223B2 (en) * 2017-05-05 2020-01-21 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
CN112802787B (zh) * 2021-04-13 2021-06-22 四川旭茂微科技有限公司 一种用于引线框架组装的送料装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4040078A (en) * 1976-05-11 1977-08-02 Bell Telephone Laboratories, Incorporated Opto-isolators and method of manufacture
US4457662A (en) * 1982-03-25 1984-07-03 Pennwalt Corporation Automatic lead frame loading machine
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−
US5049527A (en) * 1985-06-25 1991-09-17 Hewlett-Packard Company Optical isolator
US4631815A (en) * 1985-12-18 1986-12-30 Amp Incorporated Pick-up head
US4790897A (en) * 1987-04-29 1988-12-13 Lsi Logic Corporation Device for bonding of lead wires for an integrated circuit device
JPH0777308B2 (ja) * 1987-05-28 1995-08-16 三洋電機株式会社 部品装着装置
US4953287A (en) * 1987-07-01 1990-09-04 Hewlett-Packard Company Thermal-bonding process and apparatus
US5056296A (en) * 1990-03-30 1991-10-15 R. J. R. Polymers, Inc. Iso-thermal seal process for electronic devices
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
US5123066A (en) * 1991-04-25 1992-06-16 At&T Bell Laboratories Molded optical package utilizing leadframe technology
US5267379A (en) * 1992-09-01 1993-12-07 Avx Corporation Method of fabricating surface mountable clock oscillator module

Also Published As

Publication number Publication date
DE69217474T2 (de) 1997-06-26
US5341563A (en) 1994-08-30
DE69217474D1 (de) 1997-03-27
US5537737A (en) 1996-07-23
CA2079964A1 (fr) 1993-07-23
EP0552419B1 (fr) 1997-02-12
EP0552419A1 (fr) 1993-07-28

Similar Documents

Publication Publication Date Title
CA2079964C (fr) Installation et methode pour la fabrication d'un module optique
JP3016981B2 (ja) 自動テストハンドラー用ピック・プレース装置
JP4043339B2 (ja) 試験方法および試験装置
CN107342247A (zh) 吸附单元、板状构件输送单元、树脂密封装置、板状构件输送方法以及树脂密封方法
CN110931367A (zh) 芯片贴装装置及半导体器件的制造方法
JP2000044255A (ja) 光学ガラス素材の移載装置
US6385842B1 (en) Tube feeder having a zone on which components can pivot
CN110971999A (zh) 一种麦克风支架生产设备
US5987737A (en) Gate break device and gate break method
CN211917756U (zh) 一种镜头组装线
JP3635930B2 (ja) 光通信ユニットの実装方法
KR101764244B1 (ko) 완충기능을 가지는 반도체 칩 이송모듈
CN118321862A (zh) 自动组装机
JP4028348B2 (ja) 固体撮像装置の製造方法並びに製造装置
KR101640525B1 (ko) 픽 앤 플레이스먼트 장치
CN211128108U (zh) 一种麦克风支架生产设备
JP3114163B2 (ja) 光モジュール製造方法
JP2674946B2 (ja) 半導体装置におけるリードフレーム切離し装置
JP3114164B2 (ja) 光モジュール製造装置
KR101758697B1 (ko) 반도체 칩 픽업장치
TWI849982B (zh) 拾取具、接合機構及作業機
KR0120490Y1 (ko) 반도체 제조장비에 있어서의 튜브 오정렬 검지장치
JPH08139096A (ja) 電子部品及び電子部品の実装方法並びに電子部品の実装装置
CN222495143U (zh) 自动成型装置
JPH08203962A (ja) チップ位置決め装置、チップステージおよびインナリードボンディング装置ならびに方法

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed