CA2093924A1 - Bain acide pour cuivrage - Google Patents

Bain acide pour cuivrage

Info

Publication number: CA2093924A1
Authority: CA; Canada
Prior art keywords: copper plating; acid bath; bath; copper; invention concerns
Prior art date: 1990-10-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

CA002093924A

Other languages

English (en)

Other versions

CA2093924C (fr

Inventor

Wolfgang Dahms

Horst Westphal

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Atotech Deutschland GmbH and Co KG

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-10-13

Filing date

1991-10-11

Publication date

1992-04-14

1991-10-11 Application filed by Individual filed Critical Individual

1992-04-14 Publication of CA2093924A1 publication Critical patent/CA2093924A1/fr

2002-02-05 Application granted granted Critical

2002-02-05 Publication of CA2093924C publication Critical patent/CA2093924C/fr

2011-10-11 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
229910052802 copper Inorganic materials 0.000 title abstract 2
239000010949 copper Substances 0.000 title abstract 2
239000002253 acid Substances 0.000 title 1
238000007747 plating Methods 0.000 title 1
239000011260 aqueous acid Substances 0.000 abstract 1
230000008021 deposition Effects 0.000 abstract 1
238000009713 electroplating Methods 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electrolytic Production Of Metals (AREA)

CA002093924A 1990-10-13 1991-10-11 Bain acide pour cuivrage Expired - Lifetime CA2093924C (fr)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE4032864A DE4032864A1 (de)	1990-10-13	1990-10-13	Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DEP4032864.3		1990-10-13
PCT/DE1991/000811 WO1992007116A1 (fr)	1990-10-13	1991-10-11	Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison

Publications (2)

Publication Number	Publication Date
CA2093924A1 true CA2093924A1 (fr)	1992-04-14
CA2093924C CA2093924C (fr)	2002-02-05

Family

ID=6416407

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA002093924A Expired - Lifetime CA2093924C (fr)	1990-10-13	1991-10-11	Bain acide pour cuivrage

Country Status (7)

Country	Link
EP (1)	EP0554275B1 (fr)
JP (1)	JPH06501986A (fr)
AT (1)	ATE115651T1 (fr)
CA (1)	CA2093924C (fr)
DE (2)	DE4032864A1 (fr)
ES (1)	ES2066477T3 (fr)
WO (1)	WO1992007116A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US11035051B2 (en)	2016-08-15	2021-06-15	Atotech Deutschland Gmbh	Acidic aqueous composition for electrolytic copper plating

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10261852B3 (de) *	2002-12-20	2004-06-03	Atotech Deutschland Gmbh	Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) *	2003-08-08	2006-04-27	Atotech Deutschland Gmbh	Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102004041701A1 (de) *	2004-08-28	2006-03-02	Enthone Inc., West Haven	Verfahren zur elektrolytischen Abscheidung von Metallen
US7282602B2 (en) *	2004-09-21	2007-10-16	Bionumerik Pharmaceuticals, Inc.	Medicinal disulfide salts
WO2007086454A1 (fr) *	2006-01-27	2007-08-02	Okuno Chemical Industries Co., Ltd.	Additif ajouté à une solution pour cuivrage électrolytique utilisant une anode de cuivre phosphoré, solution pour cuivrage électrolytique et procédé de cuivrage électrolytique
DE102014208733A1 (de)	2014-05-09	2015-11-12	Dr. Hesse Gmbh & Cie Kg	Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL291575A (fr) *	1962-04-16
DE1246347B (de) *	1966-03-08	1967-08-03	Schering Ag	Saures galvanisches Kupferbad
DE2028803C3 (de) *	1970-06-06	1980-08-14	Schering Ag, 1000 Berlin Und 4619 Bergkamen	Polymere Phenazoniumverbindungen
AU496780B2 (en) *	1975-03-11	1978-10-26	Oxy Metal Industries Corporation	Additives in baths forthe electrodeposition of copper
DE2721985A1 (de) *	1977-05-14	1978-11-16	Bayer Ag	Verfahren zur herstellung von urethan- und/oder harnstoffgruppen aufweisenden polyisocyanat polyadditionsprodukten
DE2746938C2 (de) *	1977-10-17	1987-04-09	Schering AG, 1000 Berlin und 4709 Bergkamen	Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) *	1980-02-19	1981-06-09	Oxy Metal Industries Corporation	Composition and method for electrodeposition of copper
US4374709A (en) *	1980-05-01	1983-02-22	Occidental Chemical Corporation	Process for plating polymeric substrates
US4376685A (en) *	1981-06-24	1983-03-15	M&T Chemicals Inc.	Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) *	1981-07-24	1986-02-07	Rhone Poulenc Spec Chim	Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
WO1984001393A1 (fr) *	1982-09-30	1984-04-12	Learonal Inc	Solutions de cuivrage electrolytique
DE3402999A1 (de) *	1984-01-28	1985-08-01	Skw Trostberg Ag, 8223 Trostberg	Duengerloesungen
DE3721985A1 (de) *	1987-06-30	1989-01-12	Schering Ag	Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

1990
- 1990-10-13 DE DE4032864A patent/DE4032864A1/de active Granted
1991
- 1991-10-11 EP EP91917496A patent/EP0554275B1/fr not_active Expired - Lifetime
- 1991-10-11 JP JP3516095A patent/JPH06501986A/ja active Pending
- 1991-10-11 AT AT91917496T patent/ATE115651T1/de not_active IP Right Cessation
- 1991-10-11 DE DE59103933T patent/DE59103933D1/de not_active Expired - Lifetime
- 1991-10-11 CA CA002093924A patent/CA2093924C/fr not_active Expired - Lifetime
- 1991-10-11 ES ES91917496T patent/ES2066477T3/es not_active Expired - Lifetime
- 1991-10-11 WO PCT/DE1991/000811 patent/WO1992007116A1/fr not_active Ceased

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US11035051B2 (en)	2016-08-15	2021-06-15	Atotech Deutschland Gmbh	Acidic aqueous composition for electrolytic copper plating
US12071702B2 (en)	2016-08-15	2024-08-27	Atotech Deutschland Gmbh	Acidic aqueous composition for electrolytic copper plating

Also Published As

Publication number	Publication date
EP0554275A1 (fr)	1993-08-11
WO1992007116A1 (fr)	1992-04-30
JPH06501986A (ja)	1994-03-03
CA2093924C (fr)	2002-02-05
DE4032864C2 (fr)	1993-01-07
DE4032864A1 (de)	1992-04-16
ES2066477T3 (es)	1995-03-01
ATE115651T1 (de)	1994-12-15
EP0554275B1 (fr)	1994-12-14
DE59103933D1 (de)	1995-01-26

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Legal Events

Date	Code	Title	Description
1998-09-17	EEER	Examination request
2011-10-11	MKLA	Lapsed
2012-12-02	MKEC	Expiry (correction)	Effective date: 20121202