CA2120272A1 - Polyimidesiloxane solution and method of coating substrates - Google Patents
Polyimidesiloxane solution and method of coating substratesInfo
- Publication number
- CA2120272A1 CA2120272A1 CA 2120272 CA2120272A CA2120272A1 CA 2120272 A1 CA2120272 A1 CA 2120272A1 CA 2120272 CA2120272 CA 2120272 CA 2120272 A CA2120272 A CA 2120272A CA 2120272 A1 CA2120272 A1 CA 2120272A1
- Authority
- CA
- Canada
- Prior art keywords
- solution according
- solvent
- solution
- dianhydride
- polyimidesiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/096—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
- C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
- C07D207/04—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members
- C07D207/10—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
- C07D207/12—Oxygen or sulfur atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/10—Block- or graft-copolymers containing polysiloxane sequences
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/078,339 US5317049A (en) | 1993-06-21 | 1993-06-21 | Polyimidesiloxane solution and method of coating substrates |
| US08/078,339 | 1993-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2120272A1 true CA2120272A1 (en) | 1994-12-22 |
Family
ID=22143410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2120272 Abandoned CA2120272A1 (en) | 1993-06-21 | 1994-03-30 | Polyimidesiloxane solution and method of coating substrates |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5317049A (2) |
| EP (1) | EP0630934A3 (2) |
| JP (1) | JP3491968B2 (2) |
| KR (1) | KR950000805A (2) |
| CA (1) | CA2120272A1 (2) |
| TW (1) | TW288039B (2) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5554684A (en) * | 1993-10-12 | 1996-09-10 | Occidental Chemical Corporation | Forming polyimide coating by screen printing |
| US5849607A (en) * | 1993-11-27 | 1998-12-15 | Samsung Electronics Co., Ltd. | Process for attaching a lead frame to a semiconductor chip |
| US6451955B1 (en) * | 2000-09-28 | 2002-09-17 | Sumitomo Bakelite Company Limited | Method of making a polyimide in a low-boiling solvent |
| JP4602151B2 (ja) * | 2004-04-22 | 2010-12-22 | 信越化学工業株式会社 | 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜 |
| US8168726B2 (en) * | 2006-06-22 | 2012-05-01 | Sabic Innovative Plastics Ip B.V. | Process for making polysiloxane/polymide copolymer blends |
| US8491997B2 (en) * | 2006-06-22 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Conductive wire comprising a polysiloxane/polyimide copolymer blend |
| EP2936581B1 (en) | 2012-12-21 | 2018-11-21 | Dow Silicones Corporation | Layered polymer structures and methods |
| TWI522421B (zh) * | 2014-03-18 | 2016-02-21 | Daxin Materials Corp | Liquid crystal alignment composition |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57168943A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Coating liquid for thin film formation |
| JPS59202259A (ja) * | 1983-04-30 | 1984-11-16 | Hitachi Chem Co Ltd | 芳香族ポリエ−テルアミドイミド重合体ワニス |
| JPS60118741A (ja) * | 1983-11-14 | 1985-06-26 | ロジヤース・コーポレイシヨン | 高温ポリイミド加工助剤 |
| US4624978A (en) * | 1983-11-14 | 1986-11-25 | Rogers Corporation | High temperature polyimide processing aid |
| FR2560601A1 (fr) * | 1984-03-05 | 1985-09-06 | Rogers Corp | Accelerateur de co-solvant et procede de transformation d'une solution d'un polyamide-acide en polyimide |
| US4639485A (en) * | 1985-07-31 | 1987-01-27 | Rogers Corporation | Co-solvent accelerator for conversion of polyamide-acid solution to polyimide |
| CA1299801C (en) * | 1987-03-31 | 1992-04-28 | Chung J. Lee | Soluble polyimidesiloxanes and methods for their preparation and use |
| US4996254A (en) * | 1988-10-11 | 1991-02-26 | Ethyl Corporation | Production of electronic coatings by spin coating a partially fluorinated polyamic acid composition |
| US5068131A (en) * | 1988-10-11 | 1991-11-26 | Ethyl Corporation | Method for production of electronic coatings |
| EP0363737A3 (en) * | 1988-10-11 | 1990-09-26 | Ethyl Corporation | Compositions for production of electronic coatings |
| US4956451A (en) * | 1988-10-11 | 1990-09-11 | Ethyl Corporation | Compositions for production of electronic coatings |
| US5206337A (en) * | 1990-05-10 | 1993-04-27 | Sumitomo Bakelite Company Limited | Solvent-soluble polyimidesiloxane oligomer and process for producing the same |
| JP2526845B2 (ja) * | 1991-10-25 | 1996-08-21 | 日産化学工業株式会社 | ポリイミドワニス組成物及びその使用法 |
-
1993
- 1993-06-21 US US08/078,339 patent/US5317049A/en not_active Expired - Lifetime
-
1994
- 1994-03-30 CA CA 2120272 patent/CA2120272A1/en not_active Abandoned
- 1994-04-21 TW TW83103614A patent/TW288039B/zh active
- 1994-06-16 JP JP13426194A patent/JP3491968B2/ja not_active Expired - Fee Related
- 1994-06-17 EP EP19940109410 patent/EP0630934A3/en not_active Withdrawn
- 1994-06-20 KR KR1019940013875A patent/KR950000805A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR950000805A (ko) | 1995-01-03 |
| EP0630934A2 (en) | 1994-12-28 |
| JPH0718181A (ja) | 1995-01-20 |
| US5317049A (en) | 1994-05-31 |
| JP3491968B2 (ja) | 2004-02-03 |
| TW288039B (2) | 1996-10-11 |
| EP0630934A3 (en) | 1995-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5209981A (en) | Polyimidesiloxane extended block copolymers | |
| US5554684A (en) | Forming polyimide coating by screen printing | |
| JP4640560B2 (ja) | ポリアミドイミドシロキサンホットメルト接着剤 | |
| EP0689571B1 (en) | Three-layer polyimidesiloxane adhesive tape | |
| US6451955B1 (en) | Method of making a polyimide in a low-boiling solvent | |
| US6632523B1 (en) | Low temperature bonding adhesive composition | |
| US5317049A (en) | Polyimidesiloxane solution and method of coating substrates | |
| US5922167A (en) | Bending integrated circuit chips | |
| EP0880555B1 (en) | Method of making free-standing polyimide film | |
| US6218496B1 (en) | Polyimidesiloxane adhesive | |
| US5089549A (en) | Polyimide resin solution compositions | |
| JPS62135529A (ja) | ポリイミド前駆体 | |
| US5955245A (en) | Method of forming polyimide patterns on substrates | |
| US5869161A (en) | Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film | |
| AU667776C (en) | Three-layer polyimidesiloxane adhesive tape | |
| JPH03231923A (ja) | 樹脂溶液組成物 | |
| JPS59107522A (ja) | 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |