CA2131799A1 - Dispositif souple pour l'encapsulage de composants electroniques - Google Patents

Dispositif souple pour l'encapsulage de composants electroniques

Info

Publication number
CA2131799A1
CA2131799A1 CA002131799A CA2131799A CA2131799A1 CA 2131799 A1 CA2131799 A1 CA 2131799A1 CA 002131799 A CA002131799 A CA 002131799A CA 2131799 A CA2131799 A CA 2131799A CA 2131799 A1 CA2131799 A1 CA 2131799A1
Authority
CA
Canada
Prior art keywords
laminate
casing
electronic circuit
metal
electrical conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002131799A
Other languages
English (en)
Inventor
Karl-Erik Leeb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to CA002131799A priority Critical patent/CA2131799A1/fr
Publication of CA2131799A1 publication Critical patent/CA2131799A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
CA002131799A 1993-02-11 1993-02-11 Dispositif souple pour l'encapsulage de composants electroniques Abandoned CA2131799A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002131799A CA2131799A1 (fr) 1993-02-11 1993-02-11 Dispositif souple pour l'encapsulage de composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002131799A CA2131799A1 (fr) 1993-02-11 1993-02-11 Dispositif souple pour l'encapsulage de composants electroniques

Publications (1)

Publication Number Publication Date
CA2131799A1 true CA2131799A1 (fr) 1994-08-18

Family

ID=4154297

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002131799A Abandoned CA2131799A1 (fr) 1993-02-11 1993-02-11 Dispositif souple pour l'encapsulage de composants electroniques

Country Status (1)

Country Link
CA (1) CA2131799A1 (fr)

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued